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A kind of halogen-containing antimony-free resin composition, prepreg, laminate and printed circuit board using the same

A resin composition and prepreg technology, applied in printed circuits, circuit substrate materials, printed circuit components, etc., can solve problems such as low correlation, and achieve low water absorption, good flame retardancy, and enhanced flame retardancy. sexual effect

Active Publication Date: 2021-07-20
SHAANXI SHENGYI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this patent mainly involves the technical field of thermoplastics, and has little relevance to the technical field of copper clad laminates (thermosetting materials)

Method used

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  • A kind of halogen-containing antimony-free resin composition, prepreg, laminate and printed circuit board using the same
  • A kind of halogen-containing antimony-free resin composition, prepreg, laminate and printed circuit board using the same
  • A kind of halogen-containing antimony-free resin composition, prepreg, laminate and printed circuit board using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～8 and comparative example 1～11

[0060] The specific components and component contents (in parts by weight) of the resin compositions of Examples 1-8 and Comparative Examples 1-11 are shown in Table 1 and Table 2.

[0061] Concrete components and component content of the resin composition of table 1 embodiment 1~8

[0062]

[0063] Concrete components and component contents of the resin compositions of Table 2 Comparative Examples 1 to 11

[0064]

[0065]

[0066] Each component code and its corresponding component name in Table 1 and Table 2 are as follows:

[0067] A Flame-retardant epoxy resin: Among them, the weight ratio of phosphorus-containing epoxy resin, brominated epoxy resin and nitrogen-containing epoxy resin in A-1~A-3 is (1.3:1.5:1); A-8 The weight ratio in A-9 is (1.5:1.75:1.2); the weight ratio in A-9 is (1.4:1.6:1.1); the weight ratio in A-10 is (0.8:2.5:0.5);

[0068] A-1: A combination of DOPO-based epoxy resin with a phosphorus content of 3%, BPA epoxy resin with a bromine cont...

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Abstract

The invention provides a halogen-containing antimony-free resin composition, a prepreg, a laminate and a printed circuit board using the same. The halogen-containing antimony-free resin composition includes the following components by weight: 25-70 parts by weight Flame-retardant epoxy resin, 10-40 parts by weight of non-flame-retardant epoxy resin, 20-60 parts by weight of curing agent, 0.05-1.0 parts by weight of curing accelerator; the flame-retardant epoxy resin includes phosphorus-containing epoxy resin Composition of resin, brominated epoxy resin and nitrogen-containing epoxy resin. The combination of flame retardant epoxy resin and non-flame retardant epoxy resin, especially the combination of three flame retardant epoxy resins, can achieve the synergistic flame retardant effect of phosphorus-bromine-nitrogen, endowing CEM‑1 with With good flame retardancy, the copper-clad laminate breaks the technical bottleneck that cannot be replaced by the halogen-antimony synergistic flame-retardant system in the traditional halogenated CEM‑1 copper-clad laminate, and also has outstanding features such as high heat resistance and high humidity resistance Comprehensive performance advantages.

Description

technical field [0001] The invention belongs to the technical field of laminated boards, and relates to a halogen-containing antimony-free resin composition, a prepreg using the same, a laminated board and a printed circuit board. Background technique [0002] CEM-1 copper-clad laminate is made of electronic grade glass fiber cloth and bleached wood pulp paper, which are respectively impregnated with resin composition for copper-clad laminate to make fabric and core material, and covered with copper foil. Made by hot pressing. Flame retardancy is the primary performance that CEM-1 copper-clad laminates must achieve. However, CEM-1 copper-clad laminates use wood pulp paper as the core material. The wood pulp paper itself is combustible. It is necessary to ensure that CEM- 1. Under the premise of other properties of copper clad laminates, especially heat resistance, toughness, moisture resistance and other properties, it is very difficult to improve the flame retardancy of CE...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K3/22C08J5/24B32B15/20B32B15/12B32B29/06H05K1/03
CPCB32B15/12B32B15/20B32B29/06B32B2260/028B32B2260/046B32B2307/3065B32B2457/08C08J5/24C08J2363/00C08J2463/00C08K2003/2224C08L63/00H05K1/0353C08K3/22
Inventor 张龙霍国洋李莎
Owner SHAANXI SHENGYI TECH
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