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Preparation and applications of addition type organosilicon heat conductive casting glue tackifier

A heat-conducting potting and silicone technology, used in adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of unsatisfactory stability and cohesive force, and the failure of addition-type silicone rubber platinum catalysts. Achieving excellent bonding effect, reducing self-aggregation and excellent bonding performance

Active Publication Date: 2019-02-26
东莞市佳迪新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, among the above two tackifiers, the organotin will invalidate the addition-type silicone rubber platinum catalyst, and the titanium catalyst will dehydrogenate the cross-linking agent hydrogen-containing silicone oil in the addition-type silicone rubber. Sex and cohesion are still not meeting existing needs

Method used

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  • Preparation and applications of addition type organosilicon heat conductive casting glue tackifier
  • Preparation and applications of addition type organosilicon heat conductive casting glue tackifier
  • Preparation and applications of addition type organosilicon heat conductive casting glue tackifier

Examples

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preparation example Construction

[0032] The preparation method of the tackifier for the addition-type silicone heat-conducting potting adhesive of the present invention comprises the following steps:

[0033]Step 1: Add 480-520 parts by weight of vinyl-containing polysiloxane with hydroxyl-terminated side groups and 608-658 parts by weight of ND-42 (silane coupling agent) into a reactor with constant temperature stirring function, and stir (stirring speed is 200-220 rev / min) to 115±2°C, add 1-2 parts by weight of alkali glue, and keep warm for 10-30 minutes; wherein, in the polysiloxane with vinyl group in terminal hydroxyl side group , the hydroxyl content is 6%-8%wt, the ethylene content is 3%-4%wt; ND-42 is anilinomethyltriethoxysilane, which can be used in the bonding of silicone rubber with metal, plastic and other materials; Alkali gum is an alkaline catalyst, and the addition method of alkali gum is dropwise. In this embodiment, alkali gum is obtained by the following method: 500 parts of vinyl silicon...

Embodiment 1

[0038] The raw materials used in this embodiment and the ratio of raw materials are as shown in Table 1:

[0039] Table 1 raw materials and ratio

[0040]

[0041] Using the ratio of raw materials in Table 1, the tackifier for the addition-type silicone heat-conducting potting adhesive of the present invention is prepared by the following steps:

[0042] (1) Add vinyl-containing polysiloxane and ND-42 into a reactor with a constant temperature function, adjust the mixer speed to 190 rpm, stir and heat up to 115±2°C, and then add alkali Glue, keep warm for 20 minutes;

[0043] (2) The temperature rises to 140±2°C, and the temperature is kept for 0.5 hours;

[0044] (3) The temperature is raised to 150±2°C, and the low molecular weight is removed by negative pressure for 1 hour; the temperature is lowered, and the material is discharged to obtain an addition-type silicone heat-conducting potting adhesive tackifier.

Embodiment 2

[0046] The raw materials used in this embodiment and the ratio of raw materials are as shown in Table 2:

[0047] Table 2 raw materials and ratio

[0048]

[0049] Using the raw material ratio in Table 2, the tackifier for the addition-type silicone heat-conducting potting adhesive of the present invention was prepared through the following steps:

[0050] (1) Add vinyl-containing polysiloxane and ND-42 into a reactor with a constant temperature function, adjust the mixer speed to 190 rpm, stir and heat up to 115±2°C, and then add alkali Glue, keep warm for 20 minutes;

[0051] (2) The temperature rises to 140±2°C, and the temperature is kept for 0.5 hours;

[0052] (3) The temperature is raised to 150±2°C, and the low molecular weight is removed by negative pressure for 1 hour; the temperature is lowered, and the material is discharged to obtain an addition-type silicone heat-conducting potting adhesive tackifier.

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Abstract

The invention discloses a preparation method of an addition type organosilicon heat conductive casting glue tackifier. The preparation method comprises following steps: by weight, 480 to 520 parts ofhydroxyl terminated polysiloxanes with side groups containing vinyl, and 608 to 658 parts of ND-42 are introduced into a reactor with constant temperature stirring functions, after stirring heating, 1to 2 parts of an alkaline glue is added, thermal insulation reaction is carried out for 10 to 30min; the temperature is increased to 140+ / -2 DEG C, thermal insulation reaction is carried out for 30min; the temperature is increased to 150+ / -2 DEG C, vacuum negative pressure removing of low molecular is carried out for 1h; and cooling and discharging are carried out so as to obtain the addition type organosilicon heat conductive casting glue tackifier. According to the preparation method, vinyl groups and aniline groups are introduced into a tackifier structure, vinyl groups are capable of taking part in reaction of addition type organosilicon heat conductive casting glue, chemical bond reaction is capable of realizing connection of casting glue with the tackifier through bonds; aniline groups possess excellent bonding effect, and excellent bonding effects on most metal and plastic materials at room temperature are achieved.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and more specifically relates to a tackifier for addition-type silicone heat-conducting potting adhesive, its preparation method and its application. Background technique [0002] With the rapid development of society, electronic technology is also changing with each passing day. The integration and modularization of electronic components are becoming more and more refined. The heat dissipation function and waterproof and moisture-proof requirements of products are also getting higher and higher. Therefore, the demand for packaging materials with excellent performance is also increasing. Big. [0003] Addition-type silicone heat-conducting potting material has good temperature resistance, fast curing speed, convenient use, high production efficiency, non-toxic and tasteless, and its base polymer has low viscosity, good compatibility with heat-conducting materials, and can be filled in l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J11/04
CPCC08L2203/206C08L2205/025C08L2205/035C09J11/04C09J183/04C08L83/04C08K3/042
Inventor 周群邦
Owner 东莞市佳迪新材料有限公司
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