Epoxy resin composition for semiconductor packaging

Abstract

The invention relates to an epoxy resin composition for semiconductor packaging. The epoxy resin composition consists of the following raw materials in percentage by weight: 40-50% of resin, 0.1-1% ofethyl methacrylate, 0.1-3% of glass fibers, 0.1-3% of polyvinyl alcohol, 0.1-3% of tetrabutyl titanate and 40-60% of polytetrafluoroethylene. The epoxy resin composition for semiconductor packaging has excellent adhesiveness to copper oxide, mold release performance during forming is excellent, and continuous formability is excellent. If the epoxy resin composition for semiconductor packaging isused for packaging electronic components such as integrated circuits (IC), large scale integrated circuits (LSI) and the like, semiconductor devices with excellent reliability can be obtained.

Description

technical field [0001] The present invention relates to an epoxy resin composition for semiconductor encapsulation. Background technique [0002] In the semiconductor package assembly process, the method of electrically connecting the aluminum electrode of the semiconductor chip and the inner lead by thermocompression bonding to make an electrical connection is now mainstream. In addition, in recent years, along with the market trend of miniaturization, light weight, and high performance of electronic devices, the high integration and multi-pin of electronic components have been developing year by year. Therefore, a more complicated wire bonding process is required than before, and when a copper lead frame is used, oxidation of the copper surface progresses further due to prolonged exposure to a high temperature state of 200 to 250°C. [0003] Under such circumstances, even conventional semiconductor encapsulation materials that have excellent adhesion to unoxidized copper ...

AI Technical Summary

Problems solved by technology

) According to this method, although the adhesion to unoxidized copper and releasability are excellent, there is a problem that the adhesion of the encapsulating resin to the oxidized copper frame decreases due to the combined use of oxidized polyethylene wax.

In addition, there is a problem that continuous moldability (releasability such as vent clogging) is poor for copolymer release agents whose α-olefin moieties are as short as 25 or less carbon atoms (for example, see Patent Document 3).