Resin composition for sealing semiconductor, semiconductor device having cured product thereof, and method for manufacturing semiconductor device

A resin composition, semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problems of reduced adhesion of CuLF or Ag plating, insufficient heat resistance, thermal decomposition, etc., Achieve excellent adhesion, less thermal decomposition, and excellent adhesion

Active Publication Date: 2018-08-24
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0018] However, the heat resistance of the conventional cyanate ester-containing resin composition is insufficient, and if it is left for a long time at a high temperature of 200° C. Or the adhesion of the hardened product to CuLF or Ag plating is reduced, resulting in cracks, etc.

Method used

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  • Resin composition for sealing semiconductor, semiconductor device having cured product thereof, and method for manufacturing semiconductor device
  • Resin composition for sealing semiconductor, semiconductor device having cured product thereof, and method for manufacturing semiconductor device
  • Resin composition for sealing semiconductor, semiconductor device having cured product thereof, and method for manufacturing semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0149] Hereinafter, examples and comparative examples are shown, and the present invention will be described in more detail, but the present invention is not limited to the following examples. In addition, the part in each example is a mass part.

[0150] [Example and Comparative Example]

[0151] Prepare the following components with the compositions shown in Table 1 to Table 4, mix them uniformly with a high-speed mixer, knead them uniformly with two heated rollers, cool them, and pulverize them to obtain a resin composition .

[0152] [Components (A) to (C) used in the first composition, the second composition, and the third composition]

[0153] (A) Cyanate compound

[0154] (a) Cyanate compound represented by the following formula (5) (Primaset (Primaset) PT-60, manufactured by Lonza Japan Co., Ltd., cyanoxy group equivalent: 119)

[0155] [chemical 13]

[0156]

[0157] (b) Cyanate compound obtained in Synthesis Example 1 below

Synthetic example 1

[0159] 100 g of phenol compound MEH-7851SS (manufactured by Meiwa Kasei) was dissolved in 600 g of butyl acetate. The solution was cooled to about -15°C, and 32 g of gaseous cyanogen chloride was introduced. Next, 50 g of triethylamine was added dropwise with stirring over about 30 minutes while maintaining the temperature at -10°C or lower. After a further 30 minutes at the temperature, the cooling was stopped and the reaction mixture was filtered. The filtrate is then passed to an ion exchanger packed column. Next, the solvent was removed under reduced pressure at a bath temperature of 70°C, followed by removal of volatile impurities (including solvent residues, free triethylamine, di ethyl cyanamide). The obtained product was a cyanate compound represented by the following formula (6) (cyanoxy group equivalent weight: 208).

[0160] [chemical 14]

[0161]

[0162] (B) Phenolic compounds

[0163] (c) A phenolic compound represented by the following formula (7) (MEH-...

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Abstract

The invention provides a resin composition used for packaging a semiconductor, a semiconductor device with a hardening substance thereof, and a method for manufacturing the semiconductor device. The objective of the invention is to provide a resin composition, and the resin composition can form a hardening substance. Even though the hardening substance is placed in high temperature of more than 200 DEG C, for example, 200 DEG C to 250 DEG C for a long time, thermal decomposition (weight reduction) of the hardening substance is low, and sealed joint with CuLF or plating Ag is good, mechanical strength of the hardening substance is good under high temperature, and reliability is excellent. The invention provides a composition, containing (A) cyanate ester compound which has more than two cyanoethoxy radical in a molecule; (B) phenoliic compounds given in general formula (2), and (C) inorganic filler. Molar ratio of phenolic hydroxyl in the phenoliic compounds relative to (A) cyanoethoxy radical in the cyanate ester compound is 0.1 to 0.4.

Description

technical field [0001] The present invention relates to a resin composition for semiconductor sealing. In detail, it relates to a method that can form a long-term excellent thermal stability at high temperature, and has excellent adhesion with copper (Cu) lead frame (Lead Frame, LF) or silver (Ag) at high temperature and A cured resin composition having good mechanical strength, and a semiconductor device having the cured product of the composition. [0002] In addition, the present invention relates to a resin composition that provides a semiconductor device that has excellent long-term thermal stability at high temperatures, less corrosion or migration of Cu lead frames (LF), Ag plating, or Cu wires, and excellent reliability, and A semiconductor device having a cured product of the composition. [0003] Furthermore, the present invention relates to a cured product that can provide excellent long-term thermal stability at high temperature, excellent adhesion with Cu lead f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K13/04C08K7/18C08K3/36C08K5/315C08K3/22C08K3/24C08K3/26C08K3/34C08K5/548C08G59/62H01L23/29
Inventor 长田将一萩原健司横田竜平
Owner SHIN ETSU CHEM IND CO LTD
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