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An epoxy resin adhesive that can be used in low temperature and high and low temperature cycles

A technology of epoxy resin adhesive and ultra-low temperature, which is applied in the direction of epoxy resin adhesive, adhesive, polymer adhesive additive, etc., can solve the problems of adhesive Tg decrease, bond strength decrease, intolerance to cold and heat shock, etc., to achieve Obvious effect, good bonding strength, effect of improving low temperature strength

Active Publication Date: 2021-03-19
BEIHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The introduction of soft segment (polyurethane) will increase the flexibility of the molecular chain to obtain better bonding strength at ultra-low temperature, but the flexible segment will significantly reduce the Tg of the adhesive, and the bonding strength will decrease significantly at room temperature, less than 20MPa
However, if nylon is used for modification, due to the need for reaction, nylon cannot crystallize, and its Tg is still low, so that the lap shear strength at 150°C is less than 20MPa
Insufficient strength at room temperature and high temperature makes it not resistant to cold and heat shocks, making this type of adhesive unsuitable for bonding devices that not only need to serve at ultra-low temperatures, but also need to withstand cold and heat cycles

Method used

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  • An epoxy resin adhesive that can be used in low temperature and high and low temperature cycles
  • An epoxy resin adhesive that can be used in low temperature and high and low temperature cycles

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] An ultra-low temperature resistant epoxy resin glue, the components of the ultra-low temperature resistant epoxy resin glue are shown in the following table:

[0027] The ultra-low temperature resistant epoxy resin glue component table in the embodiment 1 of table 1

[0028] name parts by mass Bisphenol A type epoxy resin 100 Polyethersulfone resin 5～25 High temperature curing agent 12～15 Accelerator 2.5～2.8 Flexible curing agent 4～6 coupling agent 0.6～0.8 fumed silica 7～9

[0029] The preparation method of concrete implementation described ultra-low temperature resistant one-component epoxy resin adhesive is carried out according to the following steps:

[0030] (1) Weigh bisphenol A epoxy resin E51, polyethersulfone resin, high-temperature curing agent, accelerator, coupling agent and nano-silica according to the parts by mass described in Table 1.

[0031] (2) Mix the raw materials weighed in step (1) at room ...

Embodiment 2

[0034] An ultra-low temperature resistant epoxy resin glue, the components of the ultra-low temperature resistant epoxy resin glue are shown in the following table:

[0035] The ultra-low temperature resistant epoxy resin glue component table in the embodiment 2 of table 2

[0036] name parts by mass Bisphenol A type epoxy resin 60 TDE-85 40 polyaryletherketone resin 20 High temperature curing agent 12 Accelerator 0.6 Flexible curing agent 6 coupling agent 3 fumed silica 4

[0037] The preparation method of the ultra-low temperature resistant one-component epoxy resin adhesive film is the same as that of Example 1.

Embodiment 3

[0039] An ultra-low temperature resistant epoxy resin glue, the components of the ultra-low temperature resistant epoxy resin glue are shown in the following table:

[0040] The ultra-low temperature resistant epoxy resin glue component table in the embodiment 3 of table 3

[0041] name parts by mass Bisphenol A type epoxy resin 100 Polyethersulfone 15 High temperature curing agent 7～10 Accelerator 0.4 Flexible curing agent 5 coupling agent 3 fumed silica 3～5

[0042] The preparation method of the ultra-low temperature resistant one-component epoxy resin adhesive film is the same as that of Example 1.

[0043] The following table shows the performance parameters of the ultra-low temperature resistant one-component epoxy resin film prepared in Examples 1-3 of the present invention.

[0044] Table 4 Performance parameters of ultra-low temperature resistant single-component epoxy resin adhesive film of the present inventio...

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Abstract

The invention discloses an ultra-low-temperature-resistant epoxy resin adhesive which is characterized by comprising, by weight, 100 parts of resin bodies, 10-25 parts of thermoplastic resin, 5-15 parts of high-temperature curing agents, 1-10 parts of flexible curing agents, 0-3 parts of accelerants, 0-5 parts of coupling agents and 5-10 parts of nano-fillers. Thermoplastic modified polyether ketone or polyether sulfone, the nano-fillers, the flexible curing agents and the high-temperature curing agents are added to jointly improve the low-temperature toughness of epoxy resin, and higher high-temperature strength and hot and cold impact resistance are ensured.

Description

technical field [0001] The invention belongs to the field of epoxy resin adhesives, in particular relates to a one-component epoxy structural adhesive applied to component bonding, in particular to a one-component epoxy resin which can be used at temperatures below liquid nitrogen and high and low temperature cycles adhesive. Background technique [0002] In recent years, with the rapid development of the automotive, medical and aerospace fields, the demand for structural adhesives in various industrial fields is increasing. For general structural adhesives, the applicable temperature range is generally narrow. However, for some special components, their service temperature is far beyond this range, such as liquid nitrogen storage tanks, transmission electron microscope cooling devices, etc., and their service temperature is below -196°C. Some structural parts are required to be able to serve safely from ultra-low temperature to high temperature, and to withstand multiple ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J181/06C09J171/10C09J11/04C09J11/08C08G59/40C08G59/50
CPCC08G59/40C08G59/50C08K2003/265C08K2201/011C08L2205/03C08L2205/04C09J11/04C09J11/08C09J163/00C08L81/06C08L71/00C08K3/36
Inventor 杨继萍苏航丁镠李红李大海
Owner BEIHANG UNIV