High-thermal-conductivity ultraviolet light curing adhesive for optical fiber coil filling and sealing and preparation method thereof
An optical fiber coil, high thermal conductivity technology, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of poor thermal conductivity and large temperature gradient, and achieve improved thermal conductivity and wide operating temperature range , Improve the effect of heat conduction efficiency
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[0038] A preparation method of a high thermal conductivity ultraviolet light curing adhesive for optical fiber coil potting, comprising the following steps:
[0039]Step 1: Mix epoxy acrylate prepolymer, urethane acrylate prepolymer, and acrylic reactive diluent, add to the reaction kettle, mix evenly at a certain speed, raise the temperature to 80°C, and keep it warm for 1.5 to 2.5 hours. Obtain a mixed prepolymer;
[0040] Step 2: Cool down the mixed prepolymer obtained in step 1 to 45°C, add thermally conductive fillers and additives, stir and mix evenly at a constant temperature of 45°C, and keep warm for 0.5-1.5h to obtain a doped prepolymer;
[0041] Step 3: Heat the doped prepolymer obtained in step 2 to 65°C, add a photoinitiator, a sensitizer and an adhesion promoter under the condition of avoiding light, stir and mix evenly at a constant temperature of 65°C, and cool down at 0.5°C / min Cool down to room temperature at a high rate to obtain a high thermal conductivity...
Embodiment 1
[0044] A method for preparing a high thermal conductivity UV-curable adhesive for optical fiber coil potting, which is specifically completed according to the following steps:
[0045] 1. By weight percentage, take respectively 28% of epoxy acrylate prepolymer, 40% of polyurethane acrylate prepolymer, 15% of acrylic reactive diluent, 3.9% of photoinitiator, 0.1% of sensitizer, and Concentration accelerator 7%, thermal conductivity filler 5%, auxiliary agent 1%;
[0046] The epoxy acrylate prepolymer described in step 1 is Corning 3215;
[0047] The polyurethane acrylate prepolymer described in step 1 is Cytec EB210;
[0048] The acrylic reactive diluent described in step 1 is triethoxylated trimethylolpropane triacrylate;
[0049] The photoinitiator described in step 1 is 2,4,6-trimethylbenzoyl-ethoxyl-phenylphosphine oxide;
[0050] The sensitizer described in step 1 is Doublecure EPD;
[0051] The adhesion promoter described in step 1 is gamma-(methacryloyloxy) propyltri...
Embodiment 2
[0058] A method for preparing a high thermal conductivity UV-curable adhesive for optical fiber coil potting, which is specifically completed according to the following steps:
[0059] 1. By weight percentage, respectively weigh 30% of epoxy acrylate prepolymer, 20% of polyurethane acrylate prepolymer, 26% of acrylic reactive diluent, 0.5% of photoinitiator, 0.5% of sensitizer, and Concentration accelerator 1%, thermal conductivity filler 20%, auxiliary agent 2%;
[0060] The epoxy acrylate prepolymer described in step 1 is Cytec EB6040;
[0061] The polyurethane acrylate prepolymer described in step 1 is Sartomer CN972;
[0062] The acrylic reactive diluent described in step 1 is glycidyl methacrylate;
[0063] The photoinitiator described in step 1 is α, α-diethoxyacetophenone;
[0064] The sensitizer described in step 1 is Doublecure 225;
[0065] The adhesion promoter described in step 1 is 2,3-epoxypropyl propyl trimethoxysilane;
[0066] The thermally conductive fil...
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