Laser-assisted cutting processing method for transparent material
A transparent material and laser-assisted technology, applied in the field of precision cutting, can solve problems such as difficulty in guaranteeing processing efficiency, subsurface damage, and high processing difficulty, so as to improve the integrity of the processed surface, prolong the service life, and improve the processing efficiency. Effect
Inactive Publication Date: 2019-03-12
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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Problems solved by technology
Since these materials are usually hard and brittle materials with low fracture toughness, defects such as surface microcracks and subsurface damage are easily produced during processing, which makes processing difficult and low yield, especially under the premise of satisfying precision. Guarantee the efficiency of processing
With the increasing demand for products of transparent hard and brittle materials, traditional machining methods are also facing new challenges
Method used
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Embodiment 1
[0034] refer to figure 1 Shown, a kind of transparent material laser assisted cutting processing method, comprises the following steps:
[0035] Step 1: Select the appropriate laser type according to the characteristics of the transparent material to maximize the absorption of laser energy by the transparent material;
[0036] In this embodiment, the processed transparent material workpiece is transparent optical glass, and the selected laser type is 1064nm nanosecond laser.
[0037] Step 2: Use finite element simulation method to simulate the laser-assisted heating process of transparent materials before processing transparent material workpieces, so as to obtain the depth h of the laser heat-affected zone and the temperature field distribution, and determine the distance between the laser center and the tool tip on this basis Distance L and depth of cut a p .
[0038] The simulation process is: based on the law of energy conservation and Fourier's law, the thermodynamic c...
Embodiment 2
[0058] The difference between this embodiment and embodiment 1 is that in step 4, the transparent workpiece rotates at a certain speed (100-200r / min), and the laser head and the cutting tool are fed along the helix.
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Abstract
The invention relates to a laser-assisted cutting processing method for a transparent material. The laser-assisted cutting processing method is characterized in that a proper laser type is selected according to characteristics of the transparent material; before the transparent material is processed, a finite element simulation method is adopted to simulate a laser-assisted heating process of thetransparent material; a transverse distance and a longitudinal distance between a laser beam and a cutting tool are determined according to a temperature field distribution condition and a melting point of a workpiece; the laser beam comes in from one side of the transparent workpiece, a laser focus is gathered at the other side of the transparent workpiece, a heat affected zone is generated underaction of laser heat effect, and the transparent workpiece generates a local softening state within a laser irradiation range; and the cutting tool is adopted for removing materials in a to-be-processes region of the transparent workpiece, so that ductile removal for difficult-to-process materials is realized. The laser-assisted cutting processing method solves the problems that the laser beam iseasily shielded, laser burn-out is caused as a laser lens is adhered with cuttings, the cutting tool is high in abrasion speed, processing efficiency is low, and processing surface quality is poor.
Description
technical field [0001] The invention relates to the field of precision cutting processing, in particular to laser-assisted cutting processing technology for transparent materials. Background technique [0002] In industrial production, some transparent materials, such as optical glass, LBO, KDP, etc., are usually required to be cut, drilled, and polished during the processing of some electronic components and core components of optoelectronic products. Since these materials are usually hard and brittle materials with low fracture toughness, defects such as surface microcracks and subsurface damage are easily produced during processing, which makes processing difficult and low yield, especially under the premise of satisfying precision. Guarantee the efficiency of processing. With the increasing demand for products of transparent hard and brittle materials, traditional machining methods are also facing new challenges. [0003] As a non-contact, non-polluting special energy ...
Claims
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IPC IPC(8): B23K26/00B23K26/38B23K26/402B23K26/70
CPCB23K26/0093B23K26/38B23K26/402B23K26/702
Inventor 张全利张振徐九华傅玉灿苏宏华丁文锋陈燕
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS