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A kind of rtm type boron phenolic resin and preparation method thereof

A technology of boron phenolic resin and dihydric phenol, which is applied in the field of RTM type boron phenolic resin and its preparation, can solve the problems of poor storage stability of boron phenolic resin, large porosity of boron phenolic resin, poor interlayer shear strength, etc., and achieve Improve storage stability, increase crosslink density, and enhance stability

Active Publication Date: 2021-06-04
北京玻钢院复合材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The first technical problem solved by the present invention lies in the problems of poor storage stability, short pot life and high viscosity of the boron phenolic resin in the prior art, and further provides a kind of good storage stability, long pot life, low viscosity, and has RTM type boron phenolic resin with good heat resistance
[0005] The second technical problem solved by the present invention is: the boron phenolic resin obtained by the preparation process of the boron phenolic composite material in the prior art has large porosity, poor interlayer shear strength, and poor ablation and erosion resistance, and then provides a kind of Preparation method of RTM type boron phenolic resin with low porosity, high interlaminar shear strength and good ablation and erosion resistance

Method used

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  • A kind of rtm type boron phenolic resin and preparation method thereof

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Embodiment 1

[0042] The RTM type boron phenolic resin of this embodiment comprises the following components in molar ratio: 10 parts of phenol; 13 parts of aldehyde; 3 parts of boron-containing compound; 1 part of crosslinking agent.

[0043] Wherein, the phenol is a monohydric phenol, and the monohydric phenol is phenol; the aldehyde is a formaldehyde solution with a mass fraction of 36 wt %; the boron-containing compound is boric acid; and the crosslinking agent is phenylboronic acid.

[0044] Its preparation method is as follows:

[0045] Take phenol and boron-containing compound according to the selected number of parts, mix them uniformly, and react at 120°C to obtain an intermediate product; then add a selected number of aldehydes to the intermediate product, react at 150°C for 10 minutes, and then add to the intermediate product A crosslinking agent is added therein, and the RTM type boron phenolic resin is obtained after the reaction is completed.

[0046]As an alternative impleme...

Embodiment 2

[0048] The RTM type boron phenolic resin of this embodiment includes the following components in molar ratio: 120 parts of phenol; 300 parts of aldehyde; 50 parts of boron-containing compound; 50 parts of crosslinking agent.

[0049] Wherein, the phenol is a dihydric phenol, and the dihydric phenol is catechol; the aldehyde is a formaldehyde solution with a mass fraction of 45% by weight; the boron-containing compound is a boric acid derivative; the boric acid derivative is Boron oxide; the cross-linking agent is terephthalaldehyde.

[0050] Its preparation method is as follows:

[0051] Take phenol and boron-containing compound according to the selected number of parts, mix them uniformly, and react at 200°C to obtain an intermediate product; then add a selected number of aldehydes to the intermediate product, react at 100°C for 120min, and then add to the intermediate product A crosslinking agent is added therein, and the RTM type boron phenolic resin is obtained after the ...

Embodiment 3

[0054] The RTM type boron phenolic resin of this embodiment includes the following components in molar ratio: 105 parts of phenol; 130 parts of aldehyde; 20 parts of boron-containing compound; 25 parts of crosslinking agent.

[0055] Wherein, the phenol is formed by mixing monohydric phenol and dihydric phenol according to a weight ratio of 1:2; the monohydric phenol is o-cresol; the dihydric phenol is resorcinol; the aldehyde is a mass fraction of 40 wt% acetaldehyde solution; the boron-containing compound is a boric acid derivative; the boric acid derivative is methylphenylboronic acid; and the crosslinking agent is salicylaldehyde.

[0056] Its preparation method is as follows:

[0057] Take phenol and boron-containing compound according to the selected number of parts, mix them evenly, and react at 160°C to obtain an intermediate product; then add a selected number of aldehydes to the intermediate product, react at 60°C for 60 minutes, and then add to the intermediate prod...

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Abstract

The invention provides an RTM type boron phenolic resin, which comprises the following components in molar ratio: 10-200 parts of phenol; 10-300 parts of aldehyde; 1-100 parts of boron-containing compound; 1-50 parts of crosslinking agent. The RTM boron phenolic resin of the invention has good storage stability, long pot life, low viscosity and good heat resistance. The present invention also provides a preparation method of RTM type boron phenolic resin, the preparation method of RTM type boron phenolic resin of the present invention, the prepared composite material has low porosity, high interlayer shear strength, and is resistant to ablation and erosion. Good sex.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, in particular, the invention relates to an RTM type boron phenolic resin and a preparation method thereof. Background technique [0002] The rapid development of aerospace technology puts forward more stringent requirements on the performance of ablation and heat-resistant materials. Phenolic resin is widely used as the resin matrix of ablation-resistant and heat-resistant composite materials due to its advantages of good heat resistance and low price. In order to improve the ablation resistance of phenolic resin, it usually needs to be modified. Boron phenolic resin is currently one of the most successful modified phenolic resin varieties, with excellent heat resistance. However, firstly, the storage stability of boron phenolic resin is poor, it is easy to precipitate boric acid or agglomerate, and the B-O bond is easy to hydrolyze, resulting in poor water resistance of the resin. Mo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G8/28
CPCC08G8/28
Inventor 张力王雷田谋锋姚亚琳贾晨辉魏旭孙燚涂晨辰孙洪鑫宋金梅刘晶
Owner 北京玻钢院复合材料有限公司
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