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A kind of aluminum-silicon composite material for electronic packaging and preparation method thereof

A composite material and electronic packaging technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problem of uneven distribution of ceramic particles, process parameters such as airflow velocity and liquid diameter, and melt temperature. problems, to achieve the effect of reducing pores and cracks, promoting bonding, and improving pressing power.

Active Publication Date: 2020-03-10
DONGGUAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are many main shortcomings in the spray deposition method. Key process parameters such as air velocity, liquid flow diameter, and melt temperature are difficult to control, and generally can only be grasped through experience.
Due to the uneven distribution of ceramic particles due to the fluid dynamic instability and flight mode in powder injection, this inhomogeneity can only be reduced or eliminated by changing the spray parameters and subsequent processes. The porosity of the spray-molded semi-finished product is about 5 % must go through secondary processing, which increases the production cost

Method used

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  • A kind of aluminum-silicon composite material for electronic packaging and preparation method thereof
  • A kind of aluminum-silicon composite material for electronic packaging and preparation method thereof
  • A kind of aluminum-silicon composite material for electronic packaging and preparation method thereof

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Embodiment 1

[0039] An aluminum-silicon composite material for electronic packaging, which contains components and the mass percentage of each component: Si is 60%, and the balance is Al;

[0040] The purity of the Si is ≥99.59wt.%, and the median particle size is 20 μm;

[0041] The purity of the Al is ≥99.59wt.%, and the median particle size is 18 μm;

[0042] A method for preparing an aluminum-silicon composite material for electronic packaging, comprising the following steps:

[0043] Step 1: Preheat the mold

[0044] Preheat the mold to 300°C for 1 hour to obtain the preheated mold;

[0045] Step 2: Pure aluminum sheath and powder preheating

[0046] According to the ratio. Weigh the raw material powder, mix the raw material powder evenly, put it into an aluminum sheath with a wall thickness of 0.3 mm, wherein the aluminum sheath is not capped, preheat to 300 ° C, and keep it for 10 minutes to obtain the preheated wrapped aluminum material;

[0047] Step Three: Compression

[0048...

Embodiment 2

[0054] An aluminum-silicon composite material for electronic packaging, which contains components and the mass percentage of each component: Si is 60%, and the balance is Al;

[0055] The purity of the Si is ≥99.59wt.%, and the median particle size is 20 μm;

[0056] The purity of the Al is ≥99.59wt.%, and the median particle size is 18 μm;

[0057] A method for preparing an aluminum-silicon composite material for electronic packaging, comprising the following steps:

[0058] Step 1: Preheat the mold

[0059] Preheat the mold to 300°C for 1 hour to obtain the preheated mold;

[0060] Step 2: Pure aluminum sheath and powder preheating

[0061] According to the proportion, weigh the raw material powder, mix the raw material powder evenly, put it into an aluminum sheath with a wall thickness of 0.3mm, wherein the aluminum sheath is not capped, preheat to 300°C, keep it warm for 10min, and get the preheated package aluminum material;

[0062] Step Three: Compression

[0063]...

Embodiment 3

[0068] An aluminum-silicon composite material for electronic packaging, which contains components and the mass percentage of each component: Si is 50%, and the balance is Al;

[0069] The purity of the Si is ≥99.59wt.%, and the median particle size is 20 μm;

[0070] The purity of the Al is ≥99.59wt.%, and the median particle size is 18 μm;

[0071] A method for preparing an aluminum-silicon composite material for electronic packaging, comprising the following steps:

[0072] Step 1: Preheat the mold

[0073] Preheat the mold to 350°C for 1 hour to obtain the preheated mold;

[0074] Step 2: Pure aluminum sheath and powder preheating

[0075] According to the proportion, weigh the raw material powder, mix the raw material powder evenly, put it into an aluminum sheath with a wall thickness of 0.3mm, wherein the aluminum sheath is not capped, preheat to 300°C, keep it warm for 10min, and get the preheated package aluminum material;

[0076] Step Three: Compression

[0077]...

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Abstract

The invention provides an aluminum-silicon composite for electronic packaging and a preparation method thereof and belongs to the field of electronic packaging material preparation. The aluminum-silicon composite for electronic packaging comprises, by mass, 50-70% of Si, and the balance Al, wherein the purity of Si is greater than or equal to 99.59 wt.%, and the median particle diameter is 10-30 microns; the purity of Al is greater than or equal to 99.5 wt.%, and the median particle diameter is 10-30 microns. The preparation method of the aluminum-silicon composite for electronic packaging comprises the steps that raw material powder is mixed, filled into an aluminum package, placed in a preheated mold to be pressed at 800 MPa-1100 MPa and heated to 750-1000 DEG C at the vacuum degree lessthan or equal to 10<-1> Pa at the rate of 1-5 DEG C / min and then is subjected to heat preservation for 1-4 h. The prepared aluminum-silicon composite for electronic packaging is high in compactness and heat conductivity and low in heat expansion coefficient. Through the preparation method of the aluminum-silicon composite for electronic packaging, the aluminum-silicon composite for electronic packaging can suitable for mass production.

Description

technical field [0001] The invention belongs to the technical field of preparation of electronic packaging materials, more specifically the technical field of aluminum-silicon composite materials for electronic packaging prepared by powder metallurgy, and in particular provides an aluminum-silicon composite material for electronic packaging and a preparation method thereof Background technique [0002] Electronic packaging materials are base materials used to carry electronic devices and their interconnections, and play a role in heat dissipation, mechanical support, sealing, environmental protection, signal transmission and shielding. With the development of microelectronics technology, electronic components have higher integration, faster operation speed and larger capacity. This leads to an increase in the heat generation of the circuit and an increase in the operating temperature. The failure rate of electronic devices increases sharply with the increase of operating te...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C21/02C22C28/00C22C1/04B22F3/10B22F3/02H01L23/29
CPCB22F3/1007B22F3/14B22F2003/145B22F2998/10C22C1/04C22C1/0416C22C21/02C22C28/00H01L23/29
Inventor 李润霞于宝义黄海滨郑黎冀恩龙
Owner DONGGUAN UNIV OF TECH