Double-component room-temperature curing adhesive and preparation method thereof

A room temperature curing and adhesive technology, applied in the direction of adhesives, non-polymer adhesive additives, adhesive types, etc., can solve the problems of short storage time of adhesives, inability to form conductive circuits, long curing time, etc., to speed up room temperature curing Speed, prolonged anti-settling effect, excellent anti-settling effect

Inactive Publication Date: 2019-03-22
WUHAN KEDA MARBLE PROTECTIVE MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the manufacturing and assembly process of electronic products, due to the inevitable high temperature, flame or arc, the conventional metal welding connection will more or less cause damage to precision electronic components, and the metals such as lead and tin used for welding are easy to Cause pollution and poisoning; on the other hand, ordinary adhesives cannot form a normal conductive circuit due to the low conductivity of their polymer materials; while commercially available conductive

Method used

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  • Double-component room-temperature curing adhesive and preparation method thereof
  • Double-component room-temperature curing adhesive and preparation method thereof
  • Double-component room-temperature curing adhesive and preparation method thereof

Examples

Experimental program
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Effect test

preparation example Construction

[0048] The preparation method of the modified graphite powder that the embodiment of the present invention uses is:

[0049] In an empty tank equipped with ultrasonic treatment, vacuuming and feeding devices, inject expandable graphite and inject general-purpose o-phthalic unsaturated polyester premixed with 0.5-1.2% cobalt salt accelerator and 1-2% methyl ethyl ketone peroxide resin so that it just submerges the top of the expandable graphite. After sealing, evacuate to -0.1Mpa, and ultrasonically disperse for 2-3 hours, then take out the expandable graphite and place it in an oven at 60-80°C for thermal curing for 5-12 hours. Take out the solidified material, remove the corners, top and bottom materials, cut the material into small pieces and put it into a dry ball mill to grind to get a semi-finished product, then transfer it to a fine grinder and grind it to 800 mesh to 1250 mesh, and pass through the screen three times Finally, modified graphite powder is obtained.

[0...

Embodiment 1

[0052] This embodiment provides a two-component room temperature curing adhesive. The raw materials in the A component of the two-component room temperature curing adhesive include: 50 parts of phenolic vinyl ester resin, bisphenol A type epoxy ethylene 30 parts of base resin, 12 parts of conductive carbon black, 1.5 parts of BYK-142, 0.04 parts of hydroquinone, 0.5 parts of N,N-dimethylaniline, and 5 parts of modified graphite powder.

[0053] The raw materials of the B component include: 60 parts of benzoyl peroxide, 30 parts of dibutyl phthalate, and 30 parts of flake graphite powder in parts by weight.

[0054] When used, A component and B component are mixed in a weight ratio of 100:4.

[0055] Among them, the preparation method of component A includes: putting novolac vinyl ester resin, bisphenol A type epoxy vinyl resin into a planetary stirring tank equipped with feeding device, temperature control equipment, high-speed shear dispersion disc and vacuum equipment. Resi...

Embodiment 2

[0058] The preparation method of component A and component B in the two-component room temperature curing adhesive provided in Examples 2-15 is the same, the difference is that the selection of each raw material and the proportion of each substance in component A and component B are different, wherein , in each embodiment, the raw materials of component A are shown in Table 1, and the raw materials of component B are shown in Table 2. Wherein, in Example 2, A component and B component are mixed in a weight ratio of 100:4, and in Examples 3-15, A component and B component are mixed in a weight ratio of 100:3.

[0059] A component table in table 1 embodiment 1~15 (example 1~15)

[0060]

[0061]

[0062] In table 1 embodiment 1~15 (example 1~15) A component composition list (continued)

[0063]

[0064] B component composition list in table 2 embodiment 1~15 (example 1~15)

[0065]

[0066]

[0067] B component composition list (continued) in table 2 embodiment ...

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Abstract

The invention provides a double-component room-temperature curing adhesive and a preparation method thereof. The double-component room-temperature curing adhesive is prepared from a component A and acomponent B, wherein the component A is prepared from the following raw materials in parts by weight: 40 to 50 parts of novolac vinyl ester resin and 30 to 40 parts of bisphenol A type epoxy vinyl resin; the component B comprises a peroxide initiator; the weight ratio of the component A to the component B meets the following conditions: after the component A and the component B are mixed, the peroxide initiator accounts for 0.5 to 3.5 percent of the total weight of the mixture of component A and component B. According to the double-component room-temperature curing adhesive, the novolac vinylester resin and the bisphenol A type epoxy vinyl resin are selected as main body resin of the component A, and the peroxide initiator is selected as an effective component of the component B, so thatthe room-temperature curing speed of the adhesive is extremely increased and the adhesive shows more excellent stability when being used for bonding electronic products.

Description

technical field [0001] The invention relates to the field of conductive adhesives, in particular to a two-component room temperature curing adhesive and a preparation method thereof. Background technique [0002] With the progress of the times, electronic products have become more and more important roles in human's daily life. In the manufacturing and assembly process of electronic products, due to the inevitable high temperature, flame or arc, the conventional metal welding connection will more or less cause damage to precision electronic components, and the metals such as lead and tin used for welding are easy to Cause pollution and poisoning; on the other hand, ordinary adhesives cannot form a normal conductive circuit due to the low conductivity of their polymer materials; while commercially available conductive adhesives are mostly cured at high temperature or ultraviolet light, and the curing conditions are relatively harsh and the curing time is long ; or to reduce ...

Claims

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Application Information

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IPC IPC(8): C09J163/10C09J163/00C09J11/04C09J11/06
CPCC09J11/04C09J11/06C09J163/10C08L63/00C08K3/04C08K5/12C08K7/00
Inventor 杜昆文杜昆武邓宇昊邱国峰熊善高周哲毛攀峰
Owner WUHAN KEDA MARBLE PROTECTIVE MATERIALS
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