Pellet glue and preparation method thereof

A technology of epoxy resin and curing agent, which is applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., can solve the problems of insufficient adhesive force of pill adhesive, difficult to clean residual glue, poor water resistance, etc. Not high, strong adhesion, fast curing at room temperature

Inactive Publication Date: 2015-12-09
云南光电辅料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problems of insufficient adhesive force, poor water resistance, too slow curing at room temperature, too high temperature when heating to remove glue, and difficult cleaning of residual glue, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] Embodiment 1 (weight ratio)

[0014] Component A formula:

[0015] E51 epoxy resin 60 parts nitrile-4025 parts

[0016] F-30VS heating expandable microspheres 20 parts Tri-n-butyl citrate 10 parts

[0017] 500 mesh calcium carbonate 20 parts R-103 titanium dioxide 5 parts

[0018] A380 fumed silica 5 parts.

[0019] Component B formula:

[0020] MS1085 ketimine epoxy curing agent 60 parts Hexadiamine adduct epoxy curing agent 20 parts

[0021] H113-1 aromatic amine epoxy curing agent 40 parts KH550 silane coupling agent 3 parts

[0022] K54 epoxy curing accelerator 4 parts F-30VS heating expandable microspheres 8 parts

[0023] 500 mesh calcium carbonate 40 parts carbon black 5 parts

[0024] A380 fumed silica 5 parts.

[0025] When preparing, first put E51 epoxy resin, nitrile-40 and tri-n-butyl citrate in the reaction kettle according to the proportion, stir and mix evenly at 40 ° C ~ 60 ° C, then add 500 mesh calcium carbonate, R- 103 Titanium dioxide, A380 ...

Embodiment 2

[0027] Embodiment 2 (weight ratio)

[0028] Component A formula:

[0029] E51 epoxy resin 50 parts F46 epoxy resin 15 parts

[0030] JL-121 polysulfide rubber 30 parts F-30 heating expandable microspheres 15 parts

[0031] Acetyl lemon triethyl ester 20 parts 500 mesh silicon powder 75 parts

[0032] 6 parts of R-103 titanium dioxide.

[0033] Component B formula:

[0034] 70 parts of bis-N, N'-(methyl-butylmethylene)-diethylenetriamine

[0035] Hexylenediamine adduct epoxy curing agent 15 parts m-xylylenediamine 40 parts

[0036] KH550 silane coupling agent 3 parts K54 epoxy curing accelerator 5 parts

[0037] 30 parts of 500 mesh silicon powder and 20 parts of 300 mesh aluminum powder.

[0038] When preparing, first put E51 epoxy resin, F46 epoxy resin, JL-121 polysulfide rubber, and acetyl triethyl citrate in the reaction kettle according to the proportion, stir and mix evenly at 40 ° C ~ 60 ° C, and then add 500 Mesh silica powder, R-103 titanium dioxide and mix ev...

Embodiment 3

[0040] Embodiment 3 (weight ratio)

[0041] Component A formula:

[0042] E51 epoxy resin 60 parts JL-121 polysulfide rubber 25 parts

[0043] F-30VS heating expandable microspheres 10 parts Tri-n-butyl citrate 10 parts

[0044] 50 parts of 500 mesh silicon powder 5 parts of A380 fumed silica.

[0045] Component B formula:

[0046] MS1085 ketimine epoxy curing agent 60 parts Trimethylhexamethylene diamine 20 parts

[0047] H113-1 aromatic amine epoxy curing agent 40 parts KH560 silane coupling agent 3 parts

[0048] F-30VS heating expandable microspheres 5 parts 500 mesh silicon powder 30 parts

[0049] 20 parts of 300 mesh aluminum powder and 5 parts of A380 fumed silica.

[0050]When preparing, first put E51 epoxy resin, JL-121 polysulfide rubber, and tri-n-butyl citrate in the reaction kettle according to the proportion, stir and mix evenly at 40 ° C ~ 60 ° C, then add 500 mesh silica powder, A380 fumed silica and mix evenly, after cooling down to room temperature, a...

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PUM

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Abstract

The invention relates to the field of auxiliary materials for photoelectric element processing, in particular to pellet glue and a preparation method thereof. The pellet glue is prepared from a first component and a second component. The weight ratio of the first component to the second component is 2.5-3.5:1. The first component comprises epoxy resin, elastomers, heating expandable microspheres, citrate, filler and a thixotropic agent. The second component comprises a ketimine oxygen curing agent, a fatty amine oxygen curing agent, an arylamine oxygen curing agent, a silane coupling agent, an epoxy curing catalyst, heating expandable microspheres, filler and a thixotropic agent. When the glue is used for bonding diamond pellets and a diamond milling and grinding wheel to form a solid abrasive grinding tool, water resistance is good, bonding force is high, and room temperature curing is quick; temperature is not high in the heating and glue removing process, and residual glue is easy to remove.

Description

technical field [0001] The invention relates to the field of auxiliary materials for photoelectric element processing, in particular to a pellet glue and a preparation method thereof. Background technique [0002] With the maturity of high-efficiency cold processing technology for optoelectronic components, consolidated abrasives represented by bonded diamond pellets and diamond milling wheels have replaced loose abrasives and are widely used in high-speed grinding of optoelectronic components such as optical glass and crystal materials. Their application increases the grinding efficiency by several times or even dozens of times, the quality of the processed surface is also greatly improved, and the aperture is stable, which creates favorable conditions for the timing and fixed aperture of polishing. At the same time, it reduces labor intensity and improves the working environment. It is beneficial to realize mechanization and automatic processing. When diamond precision gr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J109/02C09J181/04C09J11/04C09J11/06
Inventor 句红兵谭立杨小祥
Owner 云南光电辅料有限公司
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