LED lamp excellent in heat dissipation performance

A technology of LED lamps and high heat dissipation, applied in lighting and heating equipment, damage prevention measures for lighting devices, semiconductor devices of light-emitting elements, etc., can solve the problems of low cost and high thermal conductivity of aluminum, and achieve good elasticity and thermal conductivity Excellent, long-lasting effect

Inactive Publication Date: 2019-03-29
ANHUI LANRUI ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In terms of traditional materials, aluminum has high thermal conductivity and low cost, and is the main material for radiators. At present, under the premise o

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] A high heat dissipation aluminum alloy housing for LED lamps, comprising: an aluminum alloy substrate, and a heat dissipation coating coated on the surface of the aluminum alloy substrate;

[0019] The raw materials of the heat-dissipating coating include: main material 60kg, sepiolite compound 40kg, tetrabutyl titanate 0.1kg, epoxy-terminated polyetheramine 1.9kg, phthalic anhydride 0.4kg, α-sulfo fatty acid methyl ester 1.8kg, 0.5kg of 1,5-naphthalene disulfonic acid, 1.4kg of sodium fatty alcohol polyoxyethylene ether sulfate, 1kg of glycerin, 2kg of calcium stearate, 1kg of pigment, 1kg of dispersant, and 0.4kg of leveling agent.

[0020] The main material is composed of tetrafluoroethylene particles and epoxy resin in a weight ratio of 67:15.

[0021] The sepiolite composite was prepared by the following process: Stir 12kg sepiolite and 50kg water for 16min, let it stand for 2h, add 8kg chlorosulfonated polyethylene, 1kg acrylic acid and stir at high speed for 12mi...

Embodiment 2

[0024] A high heat dissipation aluminum alloy housing for LED lamps, comprising: an aluminum alloy substrate, and a heat dissipation coating coated on the surface of the aluminum alloy substrate;

[0025] The raw materials of the heat-dissipating coating include: main material 100kg, sepiolite compound 20kg, tetrabutyl titanate 0.18kg, epoxy-terminated polyetheramine 1kg, phthalic anhydride 1kg, α-sulfo fatty acid methyl ester 1kg, 1kg of 1,5-naphthalene disulfonic acid, 0.6kg of sodium fatty alcohol polyoxyethylene ether sulfate, 2kg of glycerin, 1kg of calcium stearate, 1.8kg of pigment, 0.4kg of dispersant, and 1kg of leveling agent.

[0026] The main material is composed of tetrafluoroethylene particles and epoxy resin in a weight ratio of 45:34.

[0027] The sepiolite composite was prepared by the following process: 6kg sepiolite and 100kg water were stirred for 10 minutes, left to stand for 4 hours, 2kg chlorosulfonated polyethylene and 5kg acrylic acid were added and st...

Embodiment 3

[0030] A high heat dissipation aluminum alloy housing for LED lamps, comprising: an aluminum alloy substrate, and a heat dissipation coating coated on the surface of the aluminum alloy substrate;

[0031] The raw materials of the heat-dissipating coating include: main ingredient 70kg, sepiolite compound 35kg, tetrabutyl titanate 0.12kg, epoxy-terminated polyetheramine 1.7kg, phthalic anhydride 0.6kg, α-sulfo fatty acid methyl ester 1.6kg, 0.6kg of 1,5-naphthalene disulfonic acid, 1.2kg of sodium fatty alcohol polyoxyethylene ether sulfate, 1.3kg of glycerin, 1.8kg of calcium stearate, 1.3kg of pigment, 0.8kg of dispersant, 0.6kg of leveling agent .

[0032] The main material is composed of tetrafluoroethylene particles and epoxy resin in a weight ratio of 60:20.

[0033] The sepiolite composite was prepared by the following process: Stir 10kg sepiolite and 60kg water for 14min, let it stand for 2.5h, add 6kg chlorosulfonated polyethylene, 2kg acrylic acid and stir at high spe...

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PUM

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Abstract

The invention discloses an LED lamp aluminum alloy shell high in heat dissipation performance. The LED lamp aluminum alloy shell comprises an aluminum alloy substrate and a heat-dissipation coating, wherein the surface of the aluminum alloy substrate is coated with the heat-dissipation coating. The heat-dissipation coating comprises, by weight part, 60-100 parts of main ingredients, 20-40 parts ofa sepiolite compound, 0.1-0.18 part of tetrabutyl titanate, 1-1.9 parts of epoxy end-capping polyether amine, 0.4-1 part of phthalic anhydride, 1-1.8 parts of alpha-sulpho fatty acid methyl ester, 0.5-1 part of 1, 5-naphthalene disulfonic acid, 0.6-1.4 parts of fatty alcohol-polyoxyethylene ether sodium sulfate, 1-2 parts of glycerinum, 1-2 parts of calcium stearate, 1-1.8 parts of pigment, 0.4-1part of a dispersing agent and 0.4-1 part of a flatting agent. The invention discloses an LED lamp excellent in heat dissipation performance. The LED lamp excellent in heat dissipation performance comprises the LED lamp aluminum alloy shell high in heat dissipation performance and an LED chip, wherein the LED chip is encapsulated onto the LED lamp aluminum alloy shell high in heat dissipation performance.

Description

technical field [0001] The invention relates to the technical field of LED lamps, in particular to an LED lamp with excellent heat dissipation performance. Background technique [0002] LED (Light Emitting Diode, Light Emitting Diode) is a solid-state semiconductor device that can convert electrical energy into visible light. LED has the characteristics of energy saving, environmental protection, long life, small size, etc., and can be widely used in various indications, displays, decorations, backlights, general lighting and urban night scenes and other fields. LED lamps have high requirements for heat dissipation. 70% of LED lamp failures are caused by untimely heat dissipation, and 90% of the heat generated by LEDs is diffused outward through conduction. At present, the key to the life of LED lamps is the quality of the light source and the heat dissipation effect of the whole lamp. It is urgent to develop high-performance heat dissipation materials. [0003] In terms o...

Claims

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Application Information

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IPC IPC(8): F21V15/01F21V29/87F21V29/89C09D127/18C09D163/00C09D7/62F21Y115/10
CPCC09D7/62C09D127/18F21V15/01F21V29/87F21V29/89F21Y2115/10C08L63/00C08K9/10C08K7/10
Inventor 胡广储昭学
Owner ANHUI LANRUI ELECTRONICS TECH
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