Metal microchannel heatsink structure applied to chip heat dissipation and manufacturing method thereof

A chip heat dissipation and manufacturing method technology, applied in the direction of microstructure technology, microstructure devices, processing microstructure devices, etc., to achieve efficient heat dissipation, solve manufacturing process compatibility, and solve the effects of integration compatibility problems

Pending Publication Date: 2019-04-02
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the above problems, the purpose of the present invention is to provide a three-dimensional metal microchannel heat sink structure to solve the defects faced by the existing high-power chip integrated heat dissipation technology

Method used

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  • Metal microchannel heatsink structure applied to chip heat dissipation and manufacturing method thereof
  • Metal microchannel heatsink structure applied to chip heat dissipation and manufacturing method thereof
  • Metal microchannel heatsink structure applied to chip heat dissipation and manufacturing method thereof

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Embodiment Construction

[0038] In order to make the object, technical solution and advantages of the present invention clearer, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0039] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0040] The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, components and arrangements of specific examples are described below. Of course, they are only examples and are not int...

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Abstract

The invention provides a metal microchannel heatsink structure applied to chip heat dissipation and a manufacturing method thereof. The structure has the beneficial effects that through the design ofa microchannel system with a three-dimensional vertical structure, microfluid flows in from the bottom layer of a packaging shell, climbs up the steps, is divided to cool hot spots of a high-power radio frequency chip, climbs down the steps and flows out to realize the high density of the chip and the efficient heat dissipation function at the same time, so that the problems of low heat conductivity of traditional microchannels, manufacturing process compatibility of metal microchannels and the like are solved and the structure is of great significance.

Description

technical field [0001] The invention relates to the field of microelectronic packaging, and further relates to a metal microfluidic heat sink structure with a vertical structure based on metal micromachining technology, which is applied to high-power chips for high-efficiency heat dissipation. Background technique [0002] With the rapid development of 5G wireless communications, radar, drones, satellites and other fields, the application prospects of high-power radio frequency chips are becoming more and more broad. The current structure of highly integrated microwave front-end active components based on high-density interconnect substrates is as follows. Microwave printed circuit boards or LTCC / HTCC interconnect substrates are assembled on aluminum alloy substrates, high-power radio frequency devices are installed on molybdenum copper or diamond copper high-performance carrier boards embedded in aluminum alloy structures, and assembled side by side on aluminum alloy substr...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/427B81C3/00
CPCH01L23/427B81C3/001B81B2201/05H01L2224/48091H01L2924/00014
Inventor 马盛林夏雁鸣胡鑫欣蔡涵陈兢李轩杨
Owner XIAMEN UNIV
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