Micro-nano particle added composite soldering paste
A micro-nano particle and composite welding technology, applied in welding media, welding equipment, metal processing equipment, etc., can solve the problems of poor solder paste formability, poor mechanical properties, poor thermal conductivity, etc., and achieve low cost, excellent performance, and strength. Effect
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specific Embodiment approach 1
[0035] Specific embodiment one: In this embodiment, a composite solder paste with micro-nano particles is composed of metal powder and flux: the mass fraction of the metal powder in the composite solder paste with micro-nano particles is 80%- 90%, the mass fraction of flux is 10%-20%.
specific Embodiment approach 2
[0036] Specific embodiment two: This embodiment is different from specific embodiment one in that the metal powder in the composite solder paste with micro-nano particles is composed of Cu@Ag particles, Cu@Ag particles, Ag particles, and Cu particles. It is composed of Ni particles and Sn10Sb particles, and the metal powders are in accordance with the mass content of Cu@Ag 0.10%~5.00%, Ag 0.30%~1.20%, Cu 0.50%~0.90%, Ni 0.03%~0.05%, and the rest are Sn10Sb powder According to the composition, the flux of the composite solder paste with micro-nano particles is composed of 20% active agent, 32.5% film-forming agent, 1.5% thixotropic agent, 1% regulator, 1.5% surfactant, 1 % Corrosion inhibitor and the rest are composed of solvents, and the others are the same as in the first embodiment.
specific Embodiment approach 3
[0037] Specific embodiment three: This embodiment is different from one of specific embodiments one or two in that the composite solder paste added with micro and nano particles is characterized in that the particle size of the added metal powder Cu@Ag is 30 ~70nm, 3~7μm or 15~25μm; Ag particle size is 1~2μm; Cu particle size is 4~6μm; Ni particle size is 40~50nm; Sn10Sb particle size is 30~70μm, other and specific The first or second embodiment is the same.
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