Micro-nano particle added composite soldering paste

A micro-nano particle and composite welding technology, applied in welding media, welding equipment, metal processing equipment, etc., can solve the problems of poor solder paste formability, poor mechanical properties, poor thermal conductivity, etc., and achieve low cost, excellent performance, and strength. Effect

Inactive Publication Date: 2019-04-05
HARBIN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the technical problems such as poor formability, poor thermal conductivity, poor electrical conductivity and poor mechanical properties of the existing solder paste, and to provide a composite solder paste with added micro-nano particles and its preparation method

Method used

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  • Micro-nano particle added composite soldering paste

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specific Embodiment approach 1

[0035] Specific embodiment one: In this embodiment, a composite solder paste with micro-nano particles is composed of metal powder and flux: the mass fraction of the metal powder in the composite solder paste with micro-nano particles is 80%- 90%, the mass fraction of flux is 10%-20%.

specific Embodiment approach 2

[0036] Specific embodiment two: This embodiment is different from specific embodiment one in that the metal powder in the composite solder paste with micro-nano particles is composed of Cu@Ag particles, Cu@Ag particles, Ag particles, and Cu particles. It is composed of Ni particles and Sn10Sb particles, and the metal powders are in accordance with the mass content of Cu@Ag 0.10%~5.00%, Ag 0.30%~1.20%, Cu 0.50%~0.90%, Ni 0.03%~0.05%, and the rest are Sn10Sb powder According to the composition, the flux of the composite solder paste with micro-nano particles is composed of 20% active agent, 32.5% film-forming agent, 1.5% thixotropic agent, 1% regulator, 1.5% surfactant, 1 % Corrosion inhibitor and the rest are composed of solvents, and the others are the same as in the first embodiment.

specific Embodiment approach 3

[0037] Specific embodiment three: This embodiment is different from one of specific embodiments one or two in that the composite solder paste added with micro and nano particles is characterized in that the particle size of the added metal powder Cu@Ag is 30 ~70nm, 3~7μm or 15~25μm; Ag particle size is 1~2μm; Cu particle size is 4~6μm; Ni particle size is 40~50nm; Sn10Sb particle size is 30~70μm, other and specific The first or second embodiment is the same.

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Abstract

The invention discloses micro-nano particle added composite soldering paste, belongs to the technical field of lead-free composite brazing filler metal, particularly relates to micro-nano wrapping particle added enhanced tin-antimony-series composite soldering paste and a preparing method thereof, and mainly solves the problems that Sn-Sb series brazing filler metal in high-temperature brazing filler metal at present is poor in wettability, thermal conductivity and mechanical performance, and application and popularization of the Sn-Sb series brazing filler metal are limited. The novel composite soldering paste is mainly characterized in that compared with SnSb series soldering paste, wettability is good, and mechanical performance is excellent. The brazing filler metal is composed of 1%-5% of Cu@Ag core-shell particles and 95%-99% of SnSb, the Sn-Sb soldering paste serves as a base body, and reinforced phase Cu@Ag particles are added for achieving. The method comprises the steps thatfirstly, the Cu@Ag core-shell particles are prepared; secondly, scaling powder is prepared; and thirdly, the composite soldering paste is prepared through the Cu@Ag core-shell particles and the Sn-Sbseries soldering paste in a mechanical mixing manner. According to the composite soldering paste, the microstructure of welding spots is refined, and the wettability and shearing strength of the brazing filler metal are greatly improved. The micro-nano particle added composite soldering paste is used for preparing Sn-Sb series composite brazing filler metal which is composite brazing filler metalconforming to the development tendency of the electronic industry.

Description

Technical field [0001] The invention relates to a composite solder paste and a preparation method thereof. Background technique [0002] The integrated circuit industry continues to develop in the direction of high density, high power, and multi-function. The packaging density is getting higher and higher, the solder joints are getting smaller and smaller, and the mechanical, electrical and thermal loads carried by it are getting heavier and heavier. The reliability of points puts forward higher requirements. [0003] The third-generation semiconductors represented by SiC and their power devices, field-effect devices, Schottky diodes, etc. have been widely used, and their operating temperature is relatively high, but the solder used for electrode extraction materials and chip packaging cannot withstand this. High temperature, so there is an urgent need to develop lead-free solders for microelectronic packages that can be used in high temperature and high pressure environments. How...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40
CPCB23K35/262B23K35/40
Inventor 刘洋吴楠张涛赵凯马文友李科焦鸿浩孙凤莲
Owner HARBIN UNIV OF SCI & TECH
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