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Ultrathin bamboo-wood fiber board with bio-based non-formaldehyde adhesive and manufacturing method thereof

A technology of bamboo and wood fiber and a manufacturing method, which is applied to the field of ultra-thin bamboo and wood fiber board and its manufacturing, can solve the problems of high formaldehyde emission, low mechanical properties, poor water resistance, etc., and achieves smooth and compact surface, good mechanical properties, and uniform material in all directions. Effect

Inactive Publication Date: 2019-04-12
NANNING KETIAN SHUIXING TECH LTD CO
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  • Claims
  • Application Information

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Problems solved by technology

[0003] In order to solve the shortcomings of the current ultra-thin fiberboard, such as high formaldehyde emission, high cost, low mechanical properties, and poor water resistance, the present invention provides an ultra-thin bamboo-wood fiberboard using bio-based formaldehyde-free glue and its manufacturing method

Method used

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  • Ultrathin bamboo-wood fiber board with bio-based non-formaldehyde adhesive and manufacturing method thereof

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Embodiment

[0035] A kind of 1.5mm ultra-thin bamboo fiber board manufacture method, the steps are as follows:

[0036] 1) Peeling: The wood is conveyed into the peeling machine for peeling treatment, and the bark content is required to be less than 5%; the bamboo is directly sent to the chips without peeling.

[0037] 2) Chipping: Bamboo wood is made into bamboo chips by a chipping mechanism, and bamboo chips, bamboo shreds, and bamboo chips account for 40% of the total mass; pine wood is made into pine chips by a chipping mechanism, and pine chips account for 30% of the total mass; 1. Miscellaneous wood chips are made into eucalyptus chips by chippers, eucalyptus chips account for 20% of the total mass, and miscellaneous wood chips account for 10% of the total mass;

[0038] 3) Cooking and grinding: Bamboo chips and wood chips are softened by cooking. The cooking time is 2.5min, the temperature is 175°C, and the pressure is 0.8MPa. The softened wood chips are ground into bamboo and wood...

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Abstract

The invention discloses an ultrathin bamboo-wood fiber board with bio-based non-formaldehyde adhesive and a manufacturing method thereof. The manufacturing method sequentially comprises the proceduresof peeling, slicing, washing with water or air, cooking and hot grinding, adhesive application and drying, spreading for pre-pressing, hot pressing, cooling for curing, sanding and sawing, inspectionfor classification, and packaging. The ultrathin bamboo-wood fiber board does not contain toxic substances such as formaldehyde, benzene and xylene, and the problem of formaldehyde pollution cauasedby boards is effectively solved. The texture is uniform in all directions, the surface is smooth and dense, the mechanical property is good, the dampproof property is good, the size is stable, the application and field of the fiber board are extended and stretched, and the board is a novel product beneficial for environment protection, energy saving and comprehensive utilization of regenerative resources.

Description

technical field [0001] The invention relates to the field of bamboo and wood processing, in particular to an ultra-thin bamboo-wood fiber board using bio-based formaldehyde-free glue and a manufacturing method thereof. Background technique [0002] Fiberboard is one of the important varieties of wood-based panels, widely used in furniture, interior decoration, packaging and other industries. Ultra-thin high-density fiberboard is generally defined as having a thickness of ≤2mm and a density of 900-1000kg / m 3 fiberboard. Formaldehyde is one of the main pollution sources of toxic and harmful gases for interior decoration. It is a highly irritating chemical substance and has been listed as a Class I carcinogen by the World Health Organization. With the improvement of people's living standards and the strengthening of environmental protection awareness, formaldehyde-free panels are widely used as interior decoration materials, and the demand is increasing. At present, ultra-thi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B27N3/04B27N3/12B27N3/18B27N3/20B27N1/02
CPCB27N1/0209B27N3/04B27N3/12B27N3/18B27N3/206
Inventor 戴家兵马丁息曾灵谢明峰
Owner NANNING KETIAN SHUIXING TECH LTD CO
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