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High-performance thick-film resistor paste composition

A technology of thick-film resistors and compositions, which is applied in the field of resistor paste compositions for high-performance thick-film circuits. Resistance accuracy and reliability, and the effect of excellent withstand voltage

Inactive Publication Date: 2019-04-16
西安宏星电子浆料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The resistance paste prepared by the traditional process has poor resistance accuracy, wide TCR range, large electrostatic discharge changes, and poor reliability under high temperature, high humidity, high cold, vibration and long-term power load conditions.

Method used

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  • High-performance thick-film resistor paste composition
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  • High-performance thick-film resistor paste composition

Examples

Experimental program
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Effect test

preparation example Construction

[0049] Preparation and evaluation method of lead borosilicate glass powder:

[0050] Weigh each raw material according to the mass ratio, fully mix the weighed raw materials, put the mixed mixture into a crucible, and then put it into an electric furnace at 1200 ° C ~ 1400 ° C for melting, keep it warm for 30 min ~ 60 min, and wait for the compound It is completely melted and no bubbles are eliminated. The molten glass is poured into cold water and quenched. The granular glass is ball-milled to the target particle size. The ball-milled glass powder is dried, crushed, sieved, tested, and packaged.

[0051] The glass powder is first die-cast into a cylinder with a film pressing machine, and pre-sintered at 600°C to 900°C, and then the softening point and expansion coefficient are tested with DTA.

[0052] Evaluation method of resistance paste:

[0053] Conductive powder, lead-borosilicate glass powder, inorganic additives, and organic carrier are formulated according to Table 2...

Embodiment 1

[0057] A high-performance thick film resistor paste composition, comprising the following materials by mass, specifically:

[0058] Conductive powder: 2 parts of ruthenium dioxide, 10 parts of lead ruthenate;

[0059] Lead borosilicate glass powder: 60 parts;

[0060] Inorganic additives: 5 parts;

[0061] Organic vehicle: 23 parts;

[0062] Lead-borosilicate glass powder is two kinds of glass, and the ratio of glass powder A is: Pb 3 o 4 55%, CaO 18%, SiO 2 23%, B 2 o 3 4%, the component in the slurry is 39 parts, the ratio of glass powder B is: Pb 3 o 4 70%, SiO 2 19%, B 2 o 3 11%, the component in the slurry is 21 parts.

[0063] Inorganic additives consist of Ta 2 o 5 3%, Nb 2 o 5 1%, CuO 0.5%, ZrO 2 0.5%.

[0064] The organic carrier is composed of resin ethyl cellulose 15%, soybean lecithin 1%, terpineol 84%.

Embodiment 2

[0066] A high-performance thick film resistor paste composition, comprising the following materials by mass, specifically:

[0067] Conductive powder: 4 parts of ruthenium dioxide, 10 parts of lead ruthenate;

[0068] Lead borosilicate glass powder: 55 parts;

[0069] Inorganic additives: 4.5 parts;

[0070] Organic vehicle: 24.5 parts;

[0071] Lead-borosilicate glass powder is two kinds of glass, and the ratio of glass powder A is: Pb 3 o 4 55%, CaO 18%, SiO 2 23%, B 2 o 3 4%, the component in the slurry is 33 parts, the ratio of glass powder B is: Pb 3 o 4 70%, SiO 2 19%, B 2 o 3 11%, the component in the slurry is 22 parts.

[0072] Inorganic additives consist of Ta 2 o 5 2.5%, Nb 2 o 5 1%, CuO 0.5%, ZrO 2 0.5%.

[0073] The organic carrier is composed of resin ethyl cellulose 15%, soybean lecithin 5%, terpineol 80%.

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Abstract

The invention discloses a high-performance thick-film resistor paste composition. The composition comprises 12-44 parts of conductive powder, 20-60 parts of lead borosilicate glass powder, 0.5-5 partsof inorganic additive and 35-45 parts of organic carrier based on 100 parts in total; the conductive powder is one or a mixture of two of ruthenium dioxide or lead ruthenate subjected to surface-treatment by using a phosphate ester organic treating agent. The conductive powder comprises the components: 40-100% of ruthenium dioxide and 20-100% of lead ruthenate. According to the high-performance thick-film resistor paste composition disclosed by the invention, the materials of ruthenium dioxide with extremely low resistivity and lead ruthenate with high resistivity are adopted as main conductive powder, the resistor paste is guaranteed to have excellent resistance value stability, excellent voltage resistance and power resistance characteristics at different resistance values; and the resistor has good compactness after being sintered.

Description

technical field [0001] The invention relates to a resistance paste composition, in particular to a resistance paste composition for high-performance thick film circuits. Background technique [0002] High-performance thick-film circuits are mainly used in aviation, aerospace, high-power, high-precision, high-tech cutting-edge technology products and other fields that have high reliability requirements for thick-film circuits. At present, the global demand for high-performance thick-film circuit products is increasing Therefore, the electronic paste required for the preparation of high-performance thick film circuits, especially the resistance paste products, has higher requirements. [0003] High-performance thick-film circuit products require resistor paste to have the characteristics of high resistance precision, good stability, and strong power resistance. In applications, they will withstand conditions such as high temperature, high humidity, extreme cold, vibration, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/14H01B1/20H01B13/00
Inventor 鹿宁陆冬梅周宝荣王要东王大林雷莉君李艳张亚鹏刘丝颖殷美赵科良
Owner 西安宏星电子浆料科技股份有限公司
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