A kind of preparation method of high-purity titanium-nickel-copper shape memory alloy casting ingot

Abstract

The invention discloses a preparation method for high-purity titanium nickel copper shape memory alloy ingots, and relates to the technical field of shape memory alloy preparation. Raw materials are screened, cleaned and dried; the raw materials comprise sponge titanium particles, electrolytic nickel particles, high-purity copper particles and phosphorus copper intermediate alloys; after the driedraw materials are weighed, the materials are paved in a smelting furnace in sequence according to a first preset condition; the materials are smelted according to a vacuum induction smelting technology, wherein the smelting process comprises power supply, degassing, refining and casting; the aftertreatment is performed on ingots after casting according to a second preset condition by adopting a hot isostatic pressing method; and then, the flaw detection, the riser cutting and the bottom cushioning are performed on the ingots after aftertreatment in sequence to obtain high-purity titanium nickel copper ingots. The preparation method achieves the technical effects of convenience to prepare the ingots, controllable and lower content of impurity element O, high content stability of the O element, fine grain structure and great reduction of metallurgy defects.

Description

technical field [0001] The invention belongs to the technical field of shape memory alloy preparation, in particular to a method for preparing high-purity titanium-nickel-copper shape memory alloy ingot. Background technique [0002] Titanium-nickel-copper shape memory alloy is a shape memory alloy obtained by substituting part of Cu atoms for Ni atoms on the basis of titanium-nickel shape memory alloy. Due to its small loading platform stress and long-lasting and stable recovery force, it has been widely used in aerospace and biomedical fields in recent years. [0003] However, due to the sensitivity of its compositional fluctuations (Ni atoms and the content of Cu atoms replacing Ni atoms), especially the stability of the content of impurity elements (O, C, N elements) in the same batch of materials has a greater impact on its performance. Therefore, in the process of production and processing, controlling the content of main elements and impurity elements has become a ke...

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Problems solved by technology

[0004] The embodiment of the present application provides a method for preparing a high-purity titanium-nickel-copper shape memory alloy ingot, which solves the problem in the prior art that the content of O in the ingot cannot be reduced, and the treatment of the coarse grain structure obtained after smelting is limited. , can not better eliminate the technical problems of metallurgical defects formed by smelting, and achieve the technology of simple ingot preparation, controllable and low content of impurity element O, good stability of O element content, fine grain structure and greatly reduced metallurgical defects Effect

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