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Graphite microsphere and preparation method thereof

A technology of microspheres and graphite, which is applied in chemical instruments and methods, inorganic chemistry, non-metallic elements, etc., can solve the problems of complex processing and the inability to meet the integration of electronic products, and achieve high thermal conductivity and good interface bonding ability , the effect of excellent thermal conductivity

Inactive Publication Date: 2019-04-26
PEKING UNIV SHENZHEN GRADUATE SCHOOL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It has been reported that Ag-doped PS microspheres are used as thermal conductive materials, and the heat sink requires special abrasive processing, metal stretching, etc. The processing process is complicated and gradually unable to meet the integration requirements of electronic products.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] (1) In this embodiment, the hydroxyl-containing diamine monomer and the dianhydride monomer are polymerized in the process of preparing polyimide microspheres, wherein the ratio of the two is 1:0.95. The hydroxyl-containing diamine monomer is introduced into the molecular structure of polyimide microspheres to form hydrogen bonds between polymer macromolecules, which effectively improves the pressure resistance and heat resistance of polyimide microspheres And the bonding performance with the resin interface. Therefore, the polyimide microsphere prepared by the method provided by the invention has a small density and is a hollow microsphere, has good compression resistance and heat resistance, and has good interfacial binding ability with resin. Experimental result shows, the apparent density of polyimide microsphere provided by the present invention is 0.42g / cm 3 , The breakage rate of the microspheres is less than 30% under the pressure of 16MPa, and the operating te...

Embodiment 2

[0035] (1) In this embodiment, the hydroxyl-containing diamine monomer and the dianhydride monomer are polymerized in the process of preparing polyimide microspheres, and the hydroxyl-containing diamine monomer is introduced into the polyimide microsphere polymer molecule In the structure, hydrogen bonds are formed between polymer macromolecules, which effectively improves the compression resistance, heat resistance and bonding performance of polyimide microspheres with the resin interface. Therefore, the polyimide microsphere prepared by the method provided by the invention has a small density and is a hollow microsphere, has good compression resistance and heat resistance, and has good interfacial binding ability with resin. Experimental result shows, the apparent density of polyimide microsphere provided by the present invention is 0.46g / cm 3 , The microsphere breakage rate is 20% under the pressure of 18MPa, and the service temperature is 260°C.

[0036](2) Carbonization ...

Embodiment 3

[0040] (1) In this embodiment, the hydroxyl-containing diamine monomer and the dianhydride monomer are polymerized in the process of preparing polyimide microspheres, and the hydroxyl-containing diamine monomer is introduced into the polyimide microsphere polymer molecule In the structure, hydrogen bonds are formed between polymer macromolecules, which effectively improves the compression resistance, heat resistance and bonding performance of polyimide microspheres with the resin interface. Therefore, the polyimide microsphere prepared by the method provided by the invention has a small density and is a hollow microsphere, has good compression resistance and heat resistance, and has good interfacial binding ability with resin. Experimental result shows, the apparent density of the polyimide microsphere provided by the present invention is 0.48g / cm 3 , The microsphere breakage rate is 22% under the pressure of 18MPa, and the service temperature is 250°C.

[0041] (2) Carboniza...

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PUM

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Abstract

The application provides a graphite microsphere. The graphite microsphere is formed by high-temperature carbonization and graphitization of a polyimide microsphere. A preparation method of the graphite microsphere comprises the following steps that S1, preparation of the polyimide microsphere is carried out, specifically, aromatic dianhydride, aromatic diamine and a foam stabilizer are mixed, coprecipitation polymerization is carried out at a certain temperature to obtain the polyimide microsphere, and the polyimide microsphere is subjected to heat treatment after surface modification of the microsphere; S2, carbonization treatment is carried out, specifically, the polyimide microsphere is placed into a carbonization furnace for carbonization treatment, nitrogen or argon is used for performing protecting in the carbonization process, and heat preservation at high temperature for a certain time is carried out and carbonization is carried out to obtain a carbon microsphere; and S3, graphitization treatment is carried out, specifically, the carbon microsphere is placed into a graphitization furnace, graphitization at high temperature is carried out, and the temperature is kept for a certain time to obtain the graphite microsphere. The high thermal conductivity graphite microsphere has high graphitization degree, high thermal conductivity coefficient and stable industrial production quality and is suitable for large-scale production.

Description

technical field [0001] The invention relates to the technical field of heat-conducting materials, and more specifically, relates to a high heat-conducting graphite microsphere and a preparation method thereof. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01B32/205
Inventor 孟鸿贺超范天举
Owner PEKING UNIV SHENZHEN GRADUATE SCHOOL