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A method for laser polishing the surface of a silicon wafer

A silicon wafer surface, laser polishing technology, used in laser welding equipment, manufacturing tools, semiconductor devices, etc., can solve the problems of cumbersome process and complex process, and achieve the effect of simple process, high flexibility and high controllability

Active Publication Date: 2021-07-16
BEIHANG UNIV +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The above-mentioned polishing process technology is mature, but the process is complex and cumbersome

Method used

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  • A method for laser polishing the surface of a silicon wafer
  • A method for laser polishing the surface of a silicon wafer
  • A method for laser polishing the surface of a silicon wafer

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Embodiment Construction

[0020] In order to better understand the content of the present invention, the technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments. The examples given are only used to explain the present invention and are not intended to limit the scope of the present invention.

[0021] A method for laser polishing a silicon wafer surface, comprising the steps of:

[0022] Step 1, put the silicon wafer to be treated into deionized water for ultrasonic cleaning, and dry the surface of the cleaned silicon wafer with cold air to obtain a silicon wafer sample with a clean surface;

[0023] Step 2: Fix the clean silicon wafer sample obtained in Step 1 on the laser processing platform, set the laser scanning process path and laser processing parameters, and use the laser processing system to scan and process the surface of the silicon wafer;

[0024] Step 3: Put the laser-treated silicon wafer sample o...

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Abstract

The invention relates to a method for laser polishing the surface of a silicon chip, belonging to the technical field of semiconductor material surface polishing. The method begins by ultrasonically cleaning silicon wafers and drying them with cold air. Then, the laser surface polishing technology is used to scan and process the surface of the silicon wafer using the set laser scanning process path and laser processing parameters. After processing, it is ultrasonically cleaned and dried with cold air to obtain a high-precision laser-polished surface. The preparation method of the invention is simple in process, high in efficiency, flexible and controllable, has good repeatability, and is easy to realize industrial application.

Description

technical field [0001] The invention relates to a method for laser polishing the surface of a silicon chip, belonging to the technical field of semiconductor material surface polishing. Background technique [0002] Integrated circuit (IC) is the core of the electronic information industry, and electronic information products based on semiconductor integrated circuits have become the world's largest pillar industry. Commonly used semiconductor materials are hard and brittle, and are prone to brittle cracks and cracks during processing. Chemical mechanical polishing (CMP) is currently recognized and widely used in the ultra-precision processing of integrated circuit chips to obtain a smooth and smooth surface. This method combines mechanical friction and chemical corrosion, and has both advantages, and can obtain higher Quality polished finish. However, a large amount of polishing liquid is used in the chemical mechanical polishing process. During the polishing process, the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/352B23K26/60B23K26/70B23K101/40H01L21/02
CPCB23K26/60B23K26/70H01L21/02008H01L21/02013
Inventor 管迎春张震王海鹏方志浩
Owner BEIHANG UNIV
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