Copper cleaning agent

A cleaning agent and raw material technology, applied in the field of cleaning agents, can solve the problems of reducing the amount of industrial three-strong acid usage, over-corrosion, etc., and achieve the effects of remarkable cleaning effect, low cost, and avoiding over-corrosion

Inactive Publication Date: 2019-04-30
陈添就
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a kind of copper cleaning agent in order to overcome the shortcoming of above-mentioned existing prior art, and this copper cleaning agent has solved and reduced the usage amount of industrial three-strong acid, reduces the health hazard of cleaning agent to operator, avoids cleaning The problem of over-corrosion of the copper base material caused by the agent. After the copper parts are cleaned and rinsed with distilled water, the surface water film is evenly distributed without oil residue, and the surface color of the copper parts is the basic color of copper. The cleaning effect is remarkable. The method is simple and the cost is low. And the effect is remarkable, suitable for industrial production application

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] A kind of copper cleaning agent described in present embodiment 1 is made up of the raw material component of following parts: 10 parts of benzoic acid, 10 parts of pyrosulfuric acid, 12 parts of iodic acid, 25 parts of ethyl acetate, 5 parts of silicon hydroxide, 3 parts sodium carbonate, 10 parts fatty acid, 3 parts succinic acid, 5 parts permanganic acid, 2 parts cetearyl glucoside, 4 parts sodium lignosulfonate, 3 parts dimethyl fumarate, 2 parts titanium tetrabutyl ketone, 7 parts of methyl isobutyl ketone, 3 parts of trimethylolpropane, 3 parts of polydimethylsiloxane, 5 parts of sodium carboxymethyl cellulose, 4 parts of carbon tetrachloride, 1 part of hydroxy Benzyl ester, 2 parts of modified starch, 6 parts of triethyl phosphate, 100 parts of pure water.

Embodiment 2

[0012] A kind of copper cleaning agent described in present embodiment 2 is made up of the raw material component of following parts: 15 parts of benzoic acid, 15 parts of pyrosulfuric acid, 15 parts of iodic acid, 30 parts of ethyl acetate, 8 parts of silicon hydroxide, 5 parts sodium carbonate, 12 parts fatty acid, 5 parts succinic acid, 8 parts permanganate, 3 parts cetearyl glucoside, 5 parts sodium lignosulfonate, 5 parts dimethyl fumarate, 4 parts titanium tetrabutyl ketone, 9 parts of methyl isobutyl ketone, 6 parts of trimethylolpropane, 5 parts of polydimethylsiloxane, 8 parts of sodium carboxymethyl cellulose, 8 parts of carbon tetrachloride, 3 parts of hydroxy Benzyl ester, 5 parts of modified starch, 8 parts of triethyl phosphate, 200 parts of pure water.

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PUM

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Abstract

The invention discloses a copper cleaning agent. The copper cleaning agent comprises the following raw material components: 10-15 parts of benzoic acid, 10-15 parts of disulfuric acid, 12-15 parts ofiodic acid, 25-30 parts of ethyl acetate, 5-8 parts of orthosilicic acid, 3-5 parts of sodium carbonate, 10-12 parts of fatty acid, 3-5 parts of succinic acid, 5-8 parts of permanganic acid, 2-3 partsof cetearyl glucoside, 4-5 parts of sodium lignosulfonate, 3-5 parts of dimethyl fumarate, 2-4 parts of tetrabutyl titanate, 7-9 parts of methyl isobutyl ketone, 3-6 parts of trimethylolpropane, 3-5parts of polydimethylsiloxane, 5-8 parts of sodium carboxymethylcellulose, 4-8 parts of carbon tetrachloride, 1-3 parts of methylparaben, 2-5 parts of modified starch, 6-8 parts of triethyl phosphate,and 100-200 parts of pure water. The copper cleaning agent solves the problems of reducing the use of industrial three strong acids, reducing the health hazards of the cleaning agent to operators, and avoiding the over-corrosion of the cleaning agent to copper substrates. After a copper is cleaned and rinsed with distilled water, a surface water film is evenly distributed without oil stain remaining.

Description

technical field [0001] The invention relates to the technical field of a cleaning agent, in particular to a copper cleaning agent. Background technique [0002] Copper and its alloys are widely used in material engineering due to their excellent electrical conductivity, thermal conductivity and ductility, especially in the high-voltage electrical industry as conductive contact surfaces. During the use of copper alloys, different use environments such as alkaline, acidic, neutral solutions and marine environments can cause corrosion of copper alloys, thereby affecting their electrical conductivity; in the electrical industry, copper is used as a conductive contact surface , before assembly or electroplating, it is necessary to ensure that the surface is clean. The surface of the copper part must be cleaned. The quality of the cleaning directly affects the performance and quality of the subsequent film layer. [0003] The volatilization of the acid solution during the use of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23G1/20
CPCC23G1/20
Inventor 陈添就
Owner 陈添就
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