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Elastic conductive microsphere for anisotropic conductive adhesive film, and preparation method thereof

An elastic conductive and conductive adhesive film technology, used in conductive adhesives, liquid chemical plating, coatings, etc., can solve the problems of difficult operation, limited crimping pressure, poor elasticity, etc. Large crimping pressure range, the effect of improving elasticity

Active Publication Date: 2019-05-03
苏州纽劢特新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the elasticity of polystyrene microspheres and polymethyl methacrylate microspheres is poor, and the crimping pressure must be strictly limited during interconnection, which makes the operation difficult

Method used

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  • Elastic conductive microsphere for anisotropic conductive adhesive film, and preparation method thereof
  • Elastic conductive microsphere for anisotropic conductive adhesive film, and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] (1) Add 1-vinylimidazole and 2-bromoethanol into the reaction vessel, stir magnetically at a speed of 130r / min, and heat for a certain period of time, then add anhydrous ether, reflux for 26min, stop heating and cool to room temperature , filtered, washed, and vacuum-dried to obtain 1-hydroxyethyl-3-vinylimidazolium bromide; the parts by weight of each raw material are 43 parts by weight of 1-vinylimidazole, 57 parts by weight of 2-bromoethanol, anhydrous 15 parts by weight of diethyl ether; the reaction temperature is 89°C, and the time is 43h; the temperature of vacuum drying is 56°C, and the time is 9h;

[0024] (2) Add 1-hydroxyethyl-3-vinylimidazolium bromide, butadiene, ethylene glycol tert-butyl ether, and sodium lauryl sulfate prepared in step (1) into cyclohexane, and continue Feed nitrogen, after stirring for 26min, add alkyllithium initiator, heat up to carry out polymerization reaction, centrifuge after reaction, wash, vacuum dry, make polyionic liquid-butad...

Embodiment 2

[0027](1) Add 1-vinylimidazole and 2-bromoethanol into the reaction vessel, stir magnetically at a speed of 130r / min, and heat for a certain period of time, then add anhydrous ether, reflux for 22min, stop heating and cool to room temperature , filtered, washed, and vacuum-dried to obtain 1-hydroxyethyl-3-vinylimidazolium bromide; the parts by weight of each raw material are: 41 parts by weight of 1-vinylimidazole, 59 parts by weight of 2-bromoethanol, anhydrous 12 parts by weight of diethyl ether; the reaction temperature is 89°C, and the time is 43h; the temperature of vacuum drying is 53°C, and the time is 9.5h;

[0028] (2) Add 1-hydroxyethyl-3-vinylimidazolium bromide, butadiene, ethylene glycol tert-butyl ether, and sodium lauryl sulfate prepared in step (1) into cyclohexane, and continue Feed nitrogen, after stirring for 23min, add alkyllithium initiator, heat up to carry out polymerization reaction, centrifuge after the end of the reaction, wash, and vacuum dry to obta...

Embodiment 3

[0031] (1) Add 1-vinylimidazole and 2-bromoethanol into the reaction vessel, stir magnetically at a speed of 140r / min, and heat for a certain period of time, then add anhydrous ether, reflux for 28min, stop heating and cool to room temperature , filtered, washed, and vacuum-dried to obtain 1-hydroxyethyl-3-vinylimidazolium bromide; the parts by weight of each raw material are 44 parts by weight of 1-vinylimidazole, 56 parts by weight of 2-bromoethanol, anhydrous 18 parts by weight of diethyl ether; the reaction temperature is 91°C, and the time is 41h; the temperature of vacuum drying is 58°C, and the time is 8.5h;

[0032] (2) Add 1-hydroxyethyl-3-vinylimidazolium bromide, butadiene, ethylene glycol tert-butyl ether, and sodium lauryl sulfate prepared in step (1) into cyclohexane, and continue Pass into nitrogen, after stirring for 28min, add alkyllithium initiator, heat up to carry out polymerization reaction, centrifuge after reaction finishes, wash, vacuum dry, make polyio...

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Abstract

The invention relates to the technical field of conductive adhesive film fillers, and provides an elastic conductive microsphere for an anisotropic conductive adhesive film, and a preparation method thereof. The method comprises the following steps: preparing 1-hydroxyethyl-3-vinylimidazolium bromide from 1-vinylimidazole and 2-bromoethanol, carrying out block copolymerization on the 1-hydroxyethyl-3-vinylimidazolium bromide and butadiene to obtain poly(ionic liquid)-butadiene elastic microspheres, and roughening, sensitizing, activating and chemically silvering the poly(ionic liquid)-butadiene elastic microspheres to obtain the elastic conductive microsphere for the anisotropic conductive adhesive film. Compared with conventional methods, the method for preparing the block copolymerized elastic microspheres from 1-hydroxyethyl-3-vinylimidazolium bromide and butadiene has the advantages of significant improvement of the elasticity of the microsphere by introducing a soft chain segment,reduction of breaking of the microsphere during crimping interconnection, broadening of the operable crimping pressure range, and reduction of the operation difficulty.

Description

technical field [0001] The invention belongs to the technical field of conductive film fillers, and provides elastic conductive microspheres for anisotropic conductive film and a preparation method thereof. Background technique [0002] Packaging materials in the electronics industry play a dominant role in the assembly of electronic components. However, the traditional welding process has defects such as poor environmental protection and complicated processes. Therefore, the use of conductive adhesives that will have both conductivity and bonding functions has gradually replaced traditional welding technology. Among them, the conductive adhesive film is a very important category, and the conductive adhesive film is mainly composed of resin binder and conductive particles. As electronic components continue to be miniaturized, thinned, and flexible, the application of conductive adhesive films is becoming more and more widespread. [0003] Conductive adhesive film is divide...

Claims

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Application Information

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IPC IPC(8): C09J9/02C08J7/06C08F293/00C08F226/06C23C18/24C23C18/28C23C18/30C23C18/44
Inventor 蒋涛
Owner 苏州纽劢特新材料科技有限公司