High heat conductive epoxy sealant, and preparation method thereof

An epoxy sealing, high thermal conductivity technology, used in epoxy resin adhesives, adhesives, non-polymer adhesive additives, etc., can solve the problems of insufficient heat dissipation of products, loss of domestic customers, and shortened storage time. Achieve the effect of wide product application, low cost and suitable viscosity

Inactive Publication Date: 2019-05-03
SHANGHAI JORLE FINE CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the thermal conductivity of epoxy glue on the market is basically 0.2-0.8W/(m k), which can also meet the heat dissipation requirements in the use of conventional electronic products, but in high-power electrical appliances and large heat release, high heat dissipation requirements In some occasions, the heat diss

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0019] Example 1

[0020] A high thermal conductivity epoxy sealant, including the following materials: epoxy resin, high thermal conductivity filler, curing agent, defoamer and wetting and dispersing agent;

[0021] The epoxy resin is selected from bisphenol A epoxy resin, the high thermal conductivity filler is a mixture of silica and graphene, the addition amount is 40 wt%, and the curing agent is a mixture of dicyandiamide and urea.

[0022] The defoamers are 900 defoamer and JUST5501 defoamer, and the addition amount is 0.1% by weight.

[0023] The wetting and dispersing agent is BYK-W996 wetting and dispersing agent, and the addition amount is 1 wt%.

[0024] A preparation method of high thermal conductivity epoxy sealant is prepared according to the following method: mix and stir epoxy resin, high thermal conductivity filler, defoamer and wetting and dispersing agent evenly, the stirring speed is 500r / min, the stirring time is 1h, After cooling to below 40°C, adding curing agent...

Example Embodiment

[0025] Example 2

[0026] A high thermal conductivity epoxy sealant, including the following materials: epoxy resin, high thermal conductivity filler, curing agent, defoamer and wetting and dispersing agent;

[0027] The epoxy resin is selected from a mixture of bisphenol A epoxy resin and bisphenol F epoxy resin, the high thermal conductivity filler is a mixture of zinc oxide, copper powder and graphene, and the addition amount is 50% by weight. The curing agent is a mixture of imidazole and urea.

[0028] The defoamer is BYK-141 defoamer, and the addition amount is 0.5wt%.

[0029] The wetting and dispersing agent is BYK-P104S wetting and dispersing agent, and the addition amount is 1.5 wt%.

[0030] A preparation method of high thermal conductivity epoxy sealant is prepared according to the following method: mix and stir epoxy resin, high thermal conductivity filler, defoamer and wetting and dispersing agent evenly, the stirring speed is 700r / min, the stirring time is 1h, After coo...

Example Embodiment

[0031] Example 3

[0032] A high thermal conductivity epoxy sealant, including the following materials: epoxy resin, high thermal conductivity filler, curing agent, defoamer and wetting and dispersing agent;

[0033] The epoxy resin is a bisphenol F epoxy resin, the high thermal conductivity filler is a mixture of graphene and alumina, the mass ratio is 1:3, and the addition amount is 40 wt%.

[0034] The curing agent is a mixture of dicyandiamide and imidazole, and the mass ratio is 1:1.

[0035] The defoamer is 6800 defoamer, and the addition amount is 0.2wt%.

[0036] The wetting and dispersing agent is BYK-W969 wetting and dispersing agent, and the addition amount is 1.1 wt%.

[0037] A preparation method of high thermal conductivity epoxy sealant is prepared according to the following method: mixing epoxy resin, high thermal conductivity filler, defoamer and wetting and dispersing agent evenly, stirring speed is 600r / min, stirring time is 1h, After cooling to below 40°C, adding cur...

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PUM

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Abstract

The invention provides a high heat conductive epoxy sealant. The high heat conductive epoxy sealant comprises following raw materials: epoxy resin, a high heat conductive filling material, a curing agent, an antifoaming agent, and a wetting dispersant; the epoxy resin is one or a mixture of two components selected from bisphenol A epoxy resin and bisphenol F epoxy resin; the high heat conductive filling material is one or a mixture of a plurality of components selected from silica, alumina, zinc oxide, copper powder, and graphene; the curing agent is one or a mixture of a plurality of components selected from dicyandiamide, imidazole, and carbamide. The heat conductive performance of the high heat conductive epoxy sealant is obviously better that that of commercially available products, and is as high as 2.0W/(m.k); cost is low, and the cost is 1/3 of that of foreign products; the high heat conductive epoxy sealant is a single component material; middle and low temperature curing can be realized; the curing technology is simple; product suitable range is wide; using is convenient; low temperature storage time can be longer than 6 months; the high heat conductive epoxy sealant is convenient to store; and waste is avoided.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a high thermal conductivity epoxy sealant and a preparation method thereof. Background technique [0002] Epoxy resin sealant is a sealant based on epoxy resin. It has excellent sealing performance and high bonding strength. It is often used in high vacuum and high airtight parts in aerospace, electronics, machinery and other fields. sealant joints. [0003] At present, the thermal conductivity of epoxy glue on the market is basically 0.2-0.8W / (m k), which can also meet the heat dissipation requirements in the use of conventional electronic products, but in high-power electrical appliances and large heat release, high heat dissipation requirements In some cases, the heat dissipation of the product may not meet the demand, resulting in a burn-in problem. There are related products in foreign countries, but they are expensive and not convenient to purchase. Long purchas...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04
Inventor 陈华唐晓燕朱博雅
Owner SHANGHAI JORLE FINE CHEM
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