High heat conductive epoxy sealant, and preparation method thereof

Abstract

The invention provides a high heat conductive epoxy sealant. The high heat conductive epoxy sealant comprises following raw materials: epoxy resin, a high heat conductive filling material, a curing agent, an antifoaming agent, and a wetting dispersant; the epoxy resin is one or a mixture of two components selected from bisphenol A epoxy resin and bisphenol F epoxy resin; the high heat conductive filling material is one or a mixture of a plurality of components selected from silica, alumina, zinc oxide, copper powder, and graphene; the curing agent is one or a mixture of a plurality of components selected from dicyandiamide, imidazole, and carbamide. The heat conductive performance of the high heat conductive epoxy sealant is obviously better that that of commercially available products, and is as high as 2.0W / (m.k); cost is low, and the cost is 1 / 3 of that of foreign products; the high heat conductive epoxy sealant is a single component material; middle and low temperature curing can be realized; the curing technology is simple; product suitable range is wide; using is convenient; low temperature storage time can be longer than 6 months; the high heat conductive epoxy sealant is convenient to store; and waste is avoided.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a high thermal conductivity epoxy sealant and a preparation method thereof. Background technique [0002] Epoxy resin sealant is a sealant based on epoxy resin. It has excellent sealing performance and high bonding strength. It is often used in high vacuum and high airtight parts in aerospace, electronics, machinery and other fields. sealant joints. [0003] At present, the thermal conductivity of epoxy glue on the market is basically 0.2-0.8W / (m k), which can also meet the heat dissipation requirements in the use of conventional electronic products, but in high-power electrical appliances and large heat release, high heat dissipation requirements In some cases, the heat dissipation of the product may not meet the demand, resulting in a burn-in problem. There are related products in foreign countries, but they are expensive and not convenient to purchase. Long purchas...

AI Technical Summary

Problems solved by technology

[0003] At present, the thermal conductivity of epoxy glue on the market is basically 0.2-0.8W / (m k), which can also meet the heat dissipation requirements in the use of conventional electronic products, but in high-power electrical appliances and large heat release, high heat dissipation requirements In some occasions, the heat dissipation of the product may not meet the demand, resulting in a burn-in problem

There are related products in foreign countries, but they are expensive and not convenient to purchase. Long purchase time will also shorten the storage time. The shelf life may only be 2-3 months, which will cause losses and troubles for domestic customers.