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Surface treatment method for IC carrier board

A technology of surface treatment and carrier board, which is applied in the direction of electrical components, printed circuit manufacturing, printed circuit, etc., can solve problems such as surface treatment connection instability, quality problems, etc., to improve connection instability, reduce usage, and save energy. The effect of board space

Inactive Publication Date: 2019-05-03
GUANGDONG KINGSHINE ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The surface treatment process of the IC substrate is nickel (Ni) / palladium (Pd) / gold (Au) process, the thickness of nickel should be >150μinch, the thickness of palladium should be >2μinch, and the thickness of gold should be >2μinch; this surface treatment connection (bonding) The bit is unstable and there are quality problems

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A surface treatment method for an IC carrier board, which is characterized in that it includes the following specific steps:

[0024] S1. Pretreatment of the substrate, including cutting and drilling;

[0025] S2. Immersion copper, board power;

[0026] S3. Dry film, acid etching;

[0027] S4.AOI, anti-welding processing;

[0028] S5. Bright nickel / hard gold plating on the gold finger surface;

[0029] S6. Plating matte nickel layer and soft gold layer on the connecting surface;

[0030] S7. Post-processing, including molding, testing, FQC, FQA, and packaging.

[0031] Further, in the step S5, the thickness of the bright nickel layer is 155 μinch.

[0032] Further, in the step S5, the thickness of the hard gold layer is 5 μinch.

[0033] Further, in the step S6, the thickness of the matte nickel layer is 155 μinch, and the thickness of the soft gold layer is 15 μinch.

[0034] Further, the electroplating method adopted in the steps S5 and S6 includes: covering the surface of the circui...

Embodiment 2

[0038] A surface treatment method for an IC carrier board, which is characterized in that it includes the following specific steps:

[0039] S1. Pretreatment of the substrate, including cutting and drilling;

[0040] S2. Immersion copper, board power;

[0041] S3. Dry film, acid etching;

[0042] S4.AOI, anti-welding processing;

[0043] S5. Bright nickel / hard gold plating on the gold finger surface;

[0044] S6. Plating matte nickel layer and soft gold layer on the connecting surface;

[0045] S7. Post-processing, including molding, testing, FQC, FQA, and packaging.

[0046] Further, in the step S5, the thickness of the bright nickel layer is 120 μinch.

[0047] Further, in the step S5, the thickness of the hard gold layer is 1 μinch.

[0048] Further, in the step S6, the thickness of the matte nickel layer is 120 μinch, and the thickness of the soft gold layer is 5 μinch.

[0049] Further, the electroplating method adopted in the steps S5 and S6 includes: covering the surface of the circuit...

Embodiment 3

[0052] A surface treatment method for an IC carrier board, which is characterized in that it includes the following specific steps:

[0053] S1. Pretreatment of the substrate, including cutting and drilling;

[0054] S2. Immersion copper, board power;

[0055] S3. Dry film, acid etching;

[0056] S4.AOI, anti-welding processing;

[0057] S5. Bright nickel / hard gold plating on the gold finger surface;

[0058] S6. Plating matte nickel layer and soft gold layer on the connecting surface;

[0059] S7. Post-processing, including molding, testing, FQC, FQA, and packaging.

[0060] Further, in the step S5, the thickness of the bright nickel layer is 250 μinch.

[0061] Further, in the step S5, the thickness of the hard gold layer is 10 μinch.

[0062] Further, in the step S6, the thickness of the matte nickel layer is 250 μinch, and the thickness of the soft gold layer is 25 μinch.

[0063] Further, the electroplating method adopted in the steps S5 and S6 includes: covering the surface of the circu...

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PUM

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Abstract

The invention provides a surface treatment method for an IC carrier board. The method is characterized in that the method comprises the following specific steps: S1. performing pre-treatment on a substrate, namely a step including cutting materials and drilling holes; S2. performing electroless plating copper and copper plating by electroplating; S3. drying a film and performing acid etching; S4.performing AOI and anti-welding processing; S5. electroplating a bright nickel layer / hard gold layer on a gold finger surface; S6. electroplating a matte nickel layer and a soft gold layer on a bonding surface; and S7. performing post-treatment, namely a step including moulding, testing, performing FQC, performing FQA, and packaging. In the surface treatment method for the IC carrier board, the gold finger surface adopts electroplated nickel (Ni) / gold (Au), the bonding surface replaces an existing chemical nickel / palladium / gold process with an electroplating matte nickel + electroplating softgold process, thereby effectively improving a quality problem of instability of a connection position, and the quality of the IC carrier board is improved.

Description

Technical field [0001] The invention belongs to the technical field of circuit board processing, and specifically relates to a surface treatment method for an IC carrier board. Background technique [0002] The IC package substrate or IC carrier is mainly used as an IC carrier and provides signal interconnection between the chip and the PCB, heat dissipation channels, and chip protection. It is a key component in packaging, accounting for 35-55% of packaging process cost. The basic materials of IC substrate process include copper foil, resin substrate, dry film (solid photoresist), wet film (liquid photoresist), and metal materials (copper, nickel, gold salt), etc. The process is similar to PCB, but Its wiring density, line width, line spacing, interlayer alignment accuracy and material reliability are all higher than that of PCB. [0003] The IC carrier board is formed by stacking materials of different thicknesses, with conductive materials and non-conductive materials; via ho...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/18
Inventor 苏化友郑晓蓉
Owner GUANGDONG KINGSHINE ELECTRONICS TECH CO LTD
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