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Normal-temperature curing silicate high-temperature resistant binder and preparation method thereof

A room temperature curing and adhesive technology, applied in non-polymer adhesive additives, adhesives, inorganic adhesives, etc., can solve problems such as affecting the performance of bonded products and increasing inconvenience in construction, avoiding adverse effects, reducing Cost investment, the effect of improving high temperature resistance

Active Publication Date: 2019-05-14
SHANDONG RES & DESIGN ACADEMY OF IND CERAMICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Moreover, the existing high-temperature-resistant adhesives are generally cured at relatively high temperatures and must go through a heating process, and the high temperature during the heating and curing process can easily affect the performance of the bonded product and increase the inconvenience of construction.

Method used

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  • Normal-temperature curing silicate high-temperature resistant binder and preparation method thereof

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Effect test

Embodiment 1

[0036] The composition raw material of present embodiment high temperature resistant adhesive is as follows:

[0037] Water glass (modulus 2.5) 60%

[0038] Aluminum oxide powder (fineness 500) 20%

[0039] Alumina chopped fibers (length to diameter ratio 20:1) 10%

[0040] Silicon nitride (fineness 500) 6%

[0041] Lanthanum oxide (fineness 500) 2%

[0042] Zirconium diboride (fineness 500) 2%.

[0043] The preparation process of the high temperature resistant adhesive product of the embodiment of the present invention is as follows:

[0044] Grind alumina powder, silicon nitride, lanthanum oxide, and zirconium diboride for more than 30 minutes, mix evenly, add alumina chopped fibers into water glass, and gradually stir until uniformly dispersed before use. The application period is about 1.5h.

[0045] The fiber-reinforced high-temperature-resistant adhesive of the embodiment of the present invention can be completely cured after standing for 48 hours at normal tempera...

Embodiment 2

[0047] The composition raw material of present embodiment high temperature resistant adhesive is as follows:

[0048] Water glass (modulus 3.3) 50%

[0049] Aluminum oxide powder (fineness 200) 30%

[0050] Alumina chopped fibers (length-to-diameter ratio 5:1) 5%

[0051] Silicon nitride (fineness 200) 5%

[0052] Lanthanum oxide (fineness 200) 5%

[0053] Zirconium diboride (fineness 200) 5%.

[0054] The preparation process of the high temperature resistant adhesive product of the embodiment of the present invention is as follows:

[0055] Grind alumina powder, silicon nitride, lanthanum oxide, and zirconium diboride for 40 minutes, mix evenly, add alumina chopped fibers into water glass, and gradually stir until uniformly dispersed before use. The application period is about 1.5h.

[0056] The fiber-reinforced high-temperature-resistant adhesive of the embodiment of the present invention can be completely cured after standing for 48 hours at normal temperature and pre...

Embodiment 3

[0058] The composition raw material of present embodiment high temperature resistant adhesive is as follows:

[0059] Water glass (modulus 2.0) 40%

[0060] Aluminum oxide powder (fineness 300) 40%

[0061] Alumina Chopped Fiber (Aspect Ratio 10:1) 10%

[0062] Silicon nitride (fineness 200) 5%

[0063] Lanthanum oxide (fineness 100) 2%

[0064] Zirconium diboride (fineness 500) 3%.

[0065] The preparation process of the high temperature resistant adhesive product of the embodiment of the present invention is as follows:

[0066] Grind alumina powder, silicon nitride, lanthanum oxide, and zirconium diboride for more than 30 minutes, mix evenly, add alumina chopped fibers into water glass, and gradually stir until uniformly dispersed before use. The application period is about 1.7h.

[0067] The fiber-reinforced high-temperature-resistant adhesive of the embodiment of the present invention can be completely cured after standing for 48 hours at normal temperature and pres...

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Abstract

The invention discloses a normal-temperature curing silicate high-temperature resistant binder and a preparation method thereof. The binder comprises 2-10% by weight of chopped fibers, and is preparedfrom the following raw materials in parts by weight: 40-70 parts of water glass, 20-52 parts of alumina powder, 2-10 parts of chopped fibers, 2-6 parts of silicon nitride, 2-5 parts of lanthanum oxide and 2-5 parts of zirconium diboride. The chopped fibers are toughened to enhance the strength of the normal-temperature curing silicate high-temperature resistant binder and improve the high-temperature resistance of the binder; the binder is resistant to high temperature of 1600 DEG C, at 1600 DEG C, the shear strength of the binder is multiple times of the strength of the conventional inorganic binder under the same conditions, and the high-temperature resistance is far superior to the conventional inorganic binder.

Description

technical field [0001] The invention belongs to the technical field of binders based on inorganic components, and in particular relates to a normal-temperature curing silicate high-temperature-resistant binder and a preparation method thereof. Background technique [0002] At present, the inorganic adhesives used in high-temperature bonding in aviation, aerospace, metallurgy, construction and other industries have low bonding strength, and the required curing temperature is high and the curing time is long, which is difficult to meet the needs. Especially with the development of society, more and more high-temperature fields require inorganic adhesives to strengthen and seal the connecting parts to ensure the safe use of products. The requirements for temperature resistance and bond strength are getting higher and higher. [0003] Moreover, the existing high-temperature-resistant adhesives are generally cured at relatively high temperatures and must undergo a temperature-ra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J1/02C09J11/04
Inventor 王守兴魏美玲周长灵牟善浩
Owner SHANDONG RES & DESIGN ACADEMY OF IND CERAMICS
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