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Welding tool and method for airtight type high silicon aluminum package shell body

A technology for encapsulating shells and welding tooling, applied in welding equipment, laser welding equipment, manufacturing tools, etc., can solve the problem of affecting the quality of packaging, affecting the high air tightness, high strength, and thermal stability of electronic packaging joints. Applicable to welding methods and welding tooling, etc., to achieve the effect of improving welding quality, small thermal deformation, and good welding quality

Active Publication Date: 2019-05-24
成都雷电微力科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to aim at the fact that there is no applicable welding method and welding tooling when using high-silicon aluminum alloy electronic packaging materials for electronic packaging, which affects the use of electronic packaging joints with high air tightness, high strength, and thermal stability. Requirements, technical issues that affect packaging quality, provide a welding tool and welding method for airtight high-silicon aluminum packaging shell

Method used

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  • Welding tool and method for airtight type high silicon aluminum package shell body
  • Welding tool and method for airtight type high silicon aluminum package shell body
  • Welding tool and method for airtight type high silicon aluminum package shell body

Examples

Experimental program
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Effect test

Embodiment 1

[0036] Such as Figure 1-5 As shown, a welding tool for an airtight high-silicon-aluminum packaging shell includes a base 1 and a pressure plate 2, the base 1 is made of 6-series aluminum alloy, and the pressure plate 2 is made of stainless steel. The base 1 is provided with a limit groove 11 adapted to the shape of the packaging case 3, and the pressure plate 2 is provided with a number of flow guide grooves 4 passing through the pressure plate 2. When the pressure plate 2 and the base 1 are connected, the guide The launder 4 communicates with the area to be welded of the packaging case 3 .

[0037]In this embodiment, a welding tool for hermetically sealing a high-silicon-aluminum packaging case uses a pressure plate 2 made of a specific material to restrict the packaging case 3 in a base 1 made of a specific material, so that the packaging case 3 Effective position restriction is obtained during the welding process to ensure the welding quality and avoid welding deformation...

Embodiment 2

[0043] Such as Figure 1-5 As shown, a welding tool for an airtight high-silicon-aluminum packaging case of this embodiment has the same structure as that of Embodiment 1, the difference is that: the base 1 is provided with at least one communication limiting groove 11 Notch with external space5.

[0044] A welding tool for an airtight high-silicon-aluminum packaging case in this embodiment preferably has two notches 5 arranged on the base 1, and the two notches 5 are respectively located on the two opposite side walls of the base 1, and the notches 5 runs through the top and bottom surfaces of the base 1. On the one hand, it is convenient for the air in the welding tool to be discharged from the gap 5, and it is convenient to embed the package shell 3 into the base 1. On the other hand, the heat generated during welding is dissipated from the gap 5, so as to avoid heat in the Accumulation in the limit groove 11 affects the service life of the electronic devices in the packag...

Embodiment 3

[0046] Such as Figure 1-6 As shown, a welding method for an airtight high-silicon-aluminum packaging casing, the packaging casing 3 includes a casing 31 and a cover plate 32, and the casing 31 and the cover plate 32 are embedded and fitted. The penetration direction of the welding seam 8 of the shell 31 and the cover plate 32 is perpendicular to the front direction of the cover plate 32, including the following steps: Step 1: Assemble the packaging shell 3: Insert the cover plate 32 into the shell 31 to complete the package shell 3 assembly; Step 2: Assembling the welding tool: embed the packaging shell 3 into the base 1 of the welding tool, and fix it by the pressure plate 2 to complete the assembly of the welding tool; Step 3: Laser spot welding: use the laser head in the diversion groove 4 Spot weld the weld 8; step 4: set the positioning piece 7: adjust the positioning piece 7 on the base 1, and limit the packaging shell 3 in the base 1 through the positioning piece 7; st...

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Abstract

The invention relates to the technical field of electric package, in particular to a welding tool and method for an airtight type high silicon aluminum package shell body. The welding tool comprises abase and a pressing plate, the base is internally provided with a limiting groove matched with the shape of the package shell body, the pressing plate is provided with a plurality of flow guiding grooves penetrating through the pressing plate, when the pressing plate is connected with the base, the flow guiding grooves communicate with the to-be-welded area of the package shell body, thus the flow guiding grooves of the pressing plate are connected with the to-be-welded area of the package shell body, thus the package shell body is limited by the welded tool, the position is fixed, the heat is conducted out from the base and the cover plate during welding, meanwhile, welding point protection gas can be effectively conducted in the welding process through arrangement of the flow guiding grooves, it is ensured that no impurity enters a molten pool in the welding process, thus the welding quality of the package shell body is great, the influence of welding heat on electron devices in thepackage shell body is decreased, and great airtight performance is achieved.

Description

technical field [0001] The invention relates to the technical field of electronic packaging, in particular to a welding tool and a welding method for an airtight high-silicon-aluminum packaging shell. Background technique [0002] With the rapid development of global information technology and microelectronics technology, electronic packaging technology is also developing towards miniaturization, low weight, high performance, and high reliability. With the miniaturization of electronic packaging and the improvement of chip integration, the power of integrated circuits It is also getting higher and higher. When the integrated circuit is working, the heat generated by the chip rises sharply, and if the chip temperature is too high, it will directly lead to unstable working performance and directly reduce the service life of the chip. Therefore, the quality of the chip package will directly affect the integrated circuit. performance of the circuit. [0003] High-silicon alumin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/02B23K26/21B23K26/22B23K26/70
CPCY02E60/10
Inventor 王渝皓吴凤鼎夏辉李丹王小伟管玉静
Owner 成都雷电微力科技股份有限公司
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