A modular spray cooler

Abstract

The invention discloses a modular spray cooler which is composed of a plurality of unit cooling modules. A heating unit is tightly attached to one side of the cooler, refrigerant fluid on the other side is condensed and liquefied by cold air, each unit cooling module comprises a nozzle, a piezoelectric ceramic piece, a liquid phase channel fin, a gas phase channel fin, a copper sheet cooling plate, a miniature one-way valve and a structure channel; and the structure channel of each unit cooler comprises a cold air channel, a condensation channel, a liquid phase channel, a gas phase channel, aliquid supply channel, a liquid storage cavity, a power channel and a spraying cavity, wherein the power channel is powered by the piezoelectric ceramic piece and is connected with the spraying cavity, the upper end of the spraying cavity is connected with the gas-phase channel, the lower end of the spraying cavity is connected with the liquid-phase channel, the gas phase channel is connected withthe condensation channel, the liquid phase channel is connected with the liquid supply channel, and the liquid supply channel is connected with the liquid storage cavity. The piezoelectric ceramic isused as a power source, the advantages of good heat exchange performance and uniform temperature of spray cooling are achieved, the efficient cooling capacity and adaptability are achieved, and the modular spray cooler can be applied to cooling of microelectronic chips with high heat flux density.

Description

technical field [0001] The invention belongs to the technical field of refrigeration, and relates to a modular cooling device based on piezoelectric ceramic material as a power source and combined with spray cooling. Background technique [0002] With the deepening of the information age, the heat flux generated by microelectronic chips is increasing. With the advent of the 5G era, thermal management has become an important bottleneck restricting the development of chips. How to dissipate the high heat flow generated by microelectronic chips and control the temperature of microelectronic chips has increasingly become a key issue that needs to be solved urgently, and has received widespread attention. [0003] Microelectronic cooling technology is becoming more and more important due to the surge of data processing. Traditional cooling technologies include air cooling and water cooling. Air-cooled cooling technology mainly uses forced convection cooling of microelectronic co...

AI Technical Summary

Problems solved by technology

Heat pipe cooling uses the principle of heat pipes, one end condenses, the other end evaporates, and the internal circulation is carried out under capillary action at the same time. However, compared with other cooling methods, the heat pipe itself is prone to thermal deformation and blockage.

Thermoelectric cooling is a refrigeration technology based on Peltier. It has the advantages of no noise and small size, but it also has problems such as low thermoelectric conversion efficiency.

Ejection cooling is to cool the heating surface by directly spraying air or other refrigerants, but it brings problems such as uneven temperature cooling

These cooling technologies are all in the research stage, have different shortcomings, and have not been put into large-scale production

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