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Diamond wire saw saw-cutting machining performance evaluating testing machine

A diamond wire saw and processing performance technology, applied in the field of testing machines, can solve the problems of large size, complex structure and high cost, and achieve the effect of eliminating tension control mechanism, small overall volume and simplified control

Active Publication Date: 2019-05-31
SHANDONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the performance detection index of diamond wire saw is not perfect, which leads to insufficient correlation between detection index and sawing processing performance, and diamond wire saw with good performance detection index cannot meet the requirements of sawing processing
The processing parameters during the sawing process of the diamond wire saw do not match its performance, and it is difficult to ensure efficient and precise sawing process
[0004] The existing enterprise-level slicing machine has complex structure and large size, and the cost of sawing processing test is very high. There is an urgent need to evaluate the sawing performance of diamond wire saw through a simple and general sawing test machine.

Method used

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  • Diamond wire saw saw-cutting machining performance evaluating testing machine

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Embodiment Construction

[0024] Diamond wire saw sawing performance evaluation test machine of the present invention is used for diamond wire saw sawing performance evaluation test, its overall structure is as follows figure 1 As shown, it includes a frame 10, a constant force feeding unit, a sawing processing unit and a control unit. The constant force feeding unit, the sawing processing unit and the control unit are all arranged on the frame 10 .

[0025] The constant force feeding unit includes a rolling guide rail 5 , an object stage 7 , a working table 9 and a weight 6 . The structure of stage 7 is as figure 2 As shown, a long hole is provided on it, and the workbench 9 is installed and fixed on the stage 7 through the bolt inserted into the long hole, so that the stage 7 is installed on the workbench 9 and its position can be adjusted, and the workpiece 8 is fixed. It is installed on the stage 7 to realize the adjustment of slice thickness. The workbench 9 is fixedly installed on the rolling...

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Abstract

A diamond wire saw saw-cutting machining performance evaluating testing machine comprises a rack, a constant-force feeding unit and a saw cutting machining unit. The constant-force feeding unit comprises a linear guide rail, a carrying table and a workbench, wherein the carrying table is arranged on the workbench, the workbench is arranged on the linear guide rail, and the linear guide rail is arranged on the rack. The saw cutting machining unit comprises a wire saw, wire guiding wheels, a first rotation wheel and a second rotation wheel, wherein the two rotation wheels are arranged on two rotation wheel servo motors correspondingly, and the two ends of the wire saw are wound around the first rotation wheel and the second rotation wheel correspondingly and tensioned on the two wire guidingwheels. The testing machine is simple in structure, wire saw constant-force tensioning and workpiece constant-force feeding saw cutting machining are achieved, reliability is high, the testing machine can be used for evaluating the saw cutting machining efficiency, the saw cutting machined surface quality, the wire saw surface grinding particle disengaging rate, wire saw abrasion and other saw cutting machining performance of a diamond wire saw, and saw cutting machining technology parameters and the like of the diamond wire saw are determined and optimized.

Description

technical field [0001] The invention relates to a testing machine for evaluating the sawing processing performance of a diamond wire saw, and belongs to the technical field of diamond wire saw sawing processing. Background technique [0002] Diamond wire saw refers to a cutting tool made by consolidating high hardness and high wear resistance diamond abrasive grains on the steel wire substrate by a certain method. According to the different methods of consolidating abrasive grains on the substrate, Diamond wire saws are divided into resin bonded diamond wire saws, electroplated diamond wire saws, etc. Diamond wire saw has the advantages of high sawing efficiency, good sawing surface quality, small kerf loss, less environmental pollution, and can realize multi-piece sawing of large-diameter workpieces. It has been widely used in monocrystalline silicon, Sawing processing of hard and brittle materials such as polysilicon, sapphire, and single crystal silicon carbide. [0003...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D1/08G01M13/00
CPCB28D1/08G01M13/00
Inventor 葛培琪毕文波郑楚夕
Owner SHANDONG UNIV
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