A kind of high-temperature-resistant low-transfer organosilicon release agent and preparation method thereof

Abstract

The invention provides a high-temperature-resistant low-transfer organosilicone release agent and a preparation method thereof. Phenyl-contained methyl vinyl polysiloxane is taken as main release agent to obtain a phenyl-contained release agent formula to replace the traditional release agent which takes methyl vinyl polysiloxane as main agent. The main release agent and other materials are simplystirred and dispersed at a ratio to obtain the high-temperature-resistant low-transfer organosilicone release agent, and in addition, phenyl vinyl MTQ silicon resin is collocated at different ratiosto obtain release agent products of different release forces. Since a phenyl-contained polysiloxane macromolecular chain has high movement steric hindrance, the formula can effectively solve the silicon transfer problem of traditional organosilicone release agent. Meanwhile, since the phenyl-contained polysiloxane has a high thermal decomposition temperature, due to the introduction of the phenyl,the organosilicone release agent is endowed with excellent high temperature resistance. According to the release agent formula in the invention, the application field of traditional organosilicone release agent is further widened.

Description

technical field [0001] The invention relates to the field of silicone release agents, in particular to a formulation of a high-temperature-resistant and low-transfer silicone release agent and a preparation method thereof. Background technique [0002] The release agent in the present invention is mainly used for coating on the surface of the substrate, and is used to isolate the viscous substance after coating and curing, so as to achieve the purpose of making the viscous substance easy to peel off from the surface while the viscous substance remains sticky. Among them, the substrate is generally a film, and the release agent is coated on the film and dried and cured to obtain a release film, which is mainly used in the electronics industry; there are also substrates that are paper, and the release agent is coated on the paper and dried and cured. Finally, the release paper is made for self-adhesive labels and the like. [0003] There are many types of release agents. Sili...

AI Technical Summary

Problems solved by technology

[0004] (1) The phenomenon of silicon transfer causes the viscosity of the isolated viscous substance to decrease. The industry usually uses the residual rate to indicate the severity of the silicon brick migration phenomenon. The weaker the brick migration phenomenon, the better the performance of the release agent; the lower the residual rate, the greater the decrease in the viscosity of the isolated viscous material, indicating that the more serious the silica brick migration phenomenon is, the worse the performance of the release agent is.

[0005] (2) After the release agent is coated on the film and cured and formed, the release force of the obtained release film is unstable under high temperature storage conditions for a long time, and has a tendency to increase significantly

[0009] The prior art discloses a solvent-free silicone release agent with light peeling force, using ordinary polydimethylsiloxane as the main agent, although it can obtain lower release force, but the heat resistance is poor , and the phenomenon of silica brick migration is serious, the application range is limited

[0010] The prior art discloses a release agent capable of multiple releases, the main body of which is vinyl silicone oil. Although this formula can effectively prevent the material from sticking to the mold, due to the strong chain mobility of methyl vinyl silicone oil, a small amount of Polysiloxane molecules that are not involved in cross-linking and curing will migrate to the surface of the material, so after the material is formed, the surface will still be covered with some silicon-containing substances, which will affect the appearance of the product

Secondly, the heat resistance of vinyl silicone oil is much lower than that of phenyl silicone oil, so this release agent formula cannot be used in high temperature occasions

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