Device testing device and working method thereof, semiconductor device
A technology for equipment testing and working methods, applied in measurement devices, semiconductor/solid-state device manufacturing, optical testing flaws/defects, etc., can solve the problems of semiconductor equipment performance to be improved, device electrical performance failure, loss of protection, etc., to reduce Risk of contamination, fast inspection time, yield improvement effect
Active Publication Date: 2021-11-30
淮安西德工业设计有限公司
View PDF3 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, after a period of time, the protection board may fail early due to quality problems, lose its protective effect or cause pollution, resulting in failure of the final electrical performance of the device
[0004] Therefore, the performance of the semiconductor equipment formed by the prior art needs to be improved
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0031] As described in the background, prior art semiconductor devices have poor performance.
[0032] A rapid annealing device, comprising: a cavity for carrying an object to be measured; a cavity cover for heating the object to be measured; a heating device and a protective plate located in the cavity cover, the protective plate is located at the bottom of the heating device, The heating device is used to provide heat energy.
[0033] In the above rapid annealing equipment, the protective plate is located at the bottom of the heating device, and is used to protect the heating device and prevent foreign objects on the heating device from falling onto the surface of the object to be measured. When the rapid annealing equipment is in operation, the cavity cover is sealed with the cavity, and the pressure in the cavity is low; when the cavity cover is opened, the pressure in the cavity is atmospheric pressure, and the protective plate can avoid changes in air pressure Effects o...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
An equipment detection device and its working method, semiconductor equipment, the equipment detection device includes: a protection board; a plurality of discrete emission units arranged on the side wall of the protection board, and the transmission unit is used to transmit a first signal into the protection board; A plurality of discrete receiving units on the side wall of the protective board, the receiving unit is used to receive the second signal, the second signal is the signal after the first signal penetrates the protective board and attenuates, and each receiving unit is connected with each transmitting unit One-to-one correspondence; the data processing unit is used to obtain the crack information of the protective plate through the second signal. The semiconductor equipment includes: a cavity; a base located in the cavity, used to carry the object to be measured; a cavity cover, used to heat the cavity; a heating device located in the cavity cover, used to provide heat; any of the above-mentioned equipment The detection device is located between the heating device and the base, and is used for protecting the heating device. The performance of the equipment detection device is improved.
Description
technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to an equipment detection device, a working method thereof, and semiconductor equipment. Background technique [0002] With the rapid development of semiconductor manufacturing technology, semiconductor equipment, as the core of manufacturing technology, has also developed rapidly. Advanced integrated circuit manufacturing processes generally contain hundreds of steps, including several major process modules such as photolithography, etching, cleaning, film growth, and ion implantation. [0003] Semiconductor manufacturing processes often need to be carried out in a high-temperature environment, so semiconductor equipment needs to adapt to a high-temperature environment. The annealing process is an important process in the semiconductor manufacturing process. The rapid annealing process is mainly realized by a rapid annealing device. The working principle of the rapid ann...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): G01N21/958G01N21/95H01L21/67
Inventor 韦伟洪纪伦吴宗祐林宗贤
Owner 淮安西德工业设计有限公司