Resin matrix composite and preparing method thereof

A composite material and resin-based technology, which is applied in the field of resin-based composite materials and their preparation, can solve the problems of large dielectric loss and large leakage current of composite materials, and can improve the dielectric constant, reduce the dielectric loss, and reduce the amount of addition. Effect

Inactive Publication Date: 2019-07-05
SHANGHAI AMPHENOL AIRWAVE COMM ELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, a problem existing in organic-inorganic composite materials is that people find that when inorganic fillers with high dielectric constant are added to the organic matrix to improve the dielectric constant of the composite material, it is often necessary to add distant fillers to the organic matrix. Inorganic fillers in excess of theoretically predicted proportions
In addition, people have also found that based on the percolation theory, a small proportion of conductive fillers can be used to greatly increase the dielectric constant of the composite material, but the problem with conductive fillers is that the leakage current is too large, which often causes the dielectric loss of the composite material very big

Method used

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  • Resin matrix composite and preparing method thereof
  • Resin matrix composite and preparing method thereof
  • Resin matrix composite and preparing method thereof

Examples

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Embodiment 1

[0062] This embodiment provides a polyphenylene ether-based composite material, the core structure of the inorganic filler is spherical, the particle size of the core is 5 μm, the material of the core of the inorganic filler is barium zincate doped with barium tantalate, and the material of the first shell layer nickel with a thickness of 25 μm, and the material of the second shell layer is nickel oxide with a thickness of 5 μm. The proportion of the inorganic filler to the total volume of the composite material is 30%, the dielectric constant of the composite material is 6.72, and the dielectric loss is 0.00154. The composite material of this embodiment has a low proportion of inorganic filler, and also has a relatively high dielectric constant; the inorganic filler of this embodiment is added with a conductive first shell layer, but the dielectric loss of the composite material is still very low, There is no increase in dielectric loss due to the addition of conductive fille...

Embodiment 2

[0064] This embodiment provides a composite material based on phenylpropanolamine, in which phenylpropanolamine is the matrix, calcium titanate is used as the core of the inorganic filler, the structure of the core is fibrous, the material of the first shell layer is carbon, and the thickness is 10 μm , the material of the second shell layer is polydopamine, the thickness is 2 μm, and the proportion of the inorganic filler to the total volume of the composite material is 20%. The composite material has a dielectric constant of 9.09 and a dielectric loss of 0.00239.

Embodiment 3

[0066] This embodiment provides a composite material based on polyphenylene sulfide, which uses polyphenylene sulfide as the matrix, and copper calcium titanate as the core of the inorganic filler. The structure of the core is spherical, and the particle size of the core is 5 μm. The first The shell layer is aluminum with a thickness of 15 μm and the second shell layer is aluminum oxide with a thickness of 1 μm. The inorganic filler accounts for 40% of the total volume of the composite material. The composite material has a dielectric constant of 10.45 and a dielectric loss of 0.00132.

[0067] see image 3 , the present invention also provides a method for preparing a resin-based composite material, comprising the following steps:

[0068] S1: provide the core of inorganic filler;

[0069] S2: Depositing the first shell on the surface of the core;

[0070] S3: Depositing a second shell layer on the surface of the first shell layer to obtain an inorganic filler;

[0071] ...

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Abstract

The invention discloses a resin matrix composite and a preparing method thereof. The composite is a composite which is mainly composed of a resin matrix and an inorganic filler dispersed in the resinmatrix, wherein the inorganic filler is of a double-layer core-shell structure. The inorganic filler is composed of a core prepared from an insulating material, a first shell layer covering the core and a second shell layer covering the first shell layer, wherein the material of the first shell layer has conductivity, and the material of the second shell layer has insulativity. According to the composite, by optimizing the structure of the inorganic filler, the inorganic filler has different properties of insulativity and conductivity, the volume proportion of the inorganic filler is lowered,the dielectric constant can also be increased, and the dielectric loss can be lowered.

Description

technical field [0001] The invention belongs to the technical field of electronic composite material preparation, and in particular relates to a resin-based composite material and a preparation method thereof. Background technique [0002] With the development of today's electronic circuits in the direction of miniaturization, integration, and lightweight, people have put forward higher requirements for the electromagnetic properties, mechanical properties, thermal properties, cost, and processability of materials used in the preparation of electronic circuits. . In order to meet multiple requirements at the same time, the research of organic-inorganic composite materials has been paid more and more attention. As we all know, the advantages of organic materials are low cost and easy molding, but the disadvantages are poor mechanical properties and heat resistance, and small dielectric constant, which is not conducive to the miniaturization of electronic circuits, especially...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L71/12C08L77/00C08L69/00C08L79/08C08L27/18C08L81/02C08L101/12C08L27/16C08L61/16C08K9/10C08K9/02C08K3/24
CPCC08K9/10C08K9/02C08K3/24C08K2201/003C08K2201/006C08K2201/016C08L71/12C08L81/02
Inventor 吴昊曹海强
Owner SHANGHAI AMPHENOL AIRWAVE COMM ELECTRONICS CO LTD
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