Modified maleimide resin composition as well as prepreg and laminated board prepared from modified maleimide resin composition

A maleimide resin, maleimide technology, applied in synthetic resin layered products, chemical instruments and methods, layered products, etc., can solve the problem of exudation, difficult to achieve dielectric properties, and poor compatibility and other problems, to achieve the effect of low thermal expansion, excellent dielectric properties and good compatibility

Active Publication Date: 2019-07-05
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this technical problem, the existing method is to add polybutadiene with excellent dielectric properties. However, polybutadiene has poor compatibility with resins such as epoxy and double horses, and, due to reactivity and viscosity If the control is not good, it is easy to ooze out during the curing process, making it difficult to achieve the ideal dielectric properties

Method used

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  • Modified maleimide resin composition as well as prepreg and laminated board prepared from modified maleimide resin composition
  • Modified maleimide resin composition as well as prepreg and laminated board prepared from modified maleimide resin composition
  • Modified maleimide resin composition as well as prepreg and laminated board prepared from modified maleimide resin composition

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0051] In a 500mL four-necked flask with a reflux device, add 100g of solvent N,N-dimethylformamide, 50 parts of bis(4-maleimidephenyl)methane, and 30 parts of maleic anhydride-modified polybutadiene compound part (maleic anhydride content 15%), 20 parts of polysiloxane compound (X-22-163A, manufactured by Shin-Etsu Chemical Co., Ltd.) terminated by diepoxy group, 0.1 part of free radical initiator DCP, 0.03 part of antigelling agent acetanilide Parts, reacted at 100°C for 300min to obtain epoxysiloxane modified maleimide prepolymer Y 1 .

Synthetic example 2

[0053] In a 500mL four-necked flask with a reflux device, add 100g of solvent propylene glycol methyl ether, 60 parts of 2,2-bis[4-(4-maleimidephenoxy-phenyl]propane (BM I-80, Japan KI group), 20 parts of maleic anhydride-modified polybutadiene compound (maleic anhydride content 15%), 20 parts of diepoxy group-terminated polysiloxane compound (X-22-163A, manufactured by Shin-Etsu Chemical Co., Ltd.), Free radical initiator DCP 0.1 part, anti-gelling agent acetanilide 0.03 part, react at 115°C for 300 minutes to obtain epoxysiloxane modified maleimide prepolymer Y 2 .

Synthetic example 3

[0055] Add 100 g of solvent propylene glycol methyl ether and 55 parts of bis(3-ethyl-5-methyl-4-maleimidophenyl)methane (BMI-70, manufactured by Japan KI) into a 500 mL four-necked flask with a reflux device , 30 parts of maleic anhydride-modified polybutadiene compound (maleic anhydride content 5%), 15 parts of diepoxy group-terminated polysiloxane compound (X-22-163B, manufactured by Shin-Etsu Chemical Co., Ltd.), free radical initiation Agent DCP 0.1 part, acetanilide 0.03 part, react at 115 ° C for 300 min, and obtain epoxysiloxane modified maleimide prepolymer Y 3 .

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Abstract

The invention discloses a modified maleimide resin composition. A maleimide compound, epoxy polysiloxane and maleic anhydride modified polybutadiene react by adopting a method of simultaneously prepolymerizing three components to obtain an epoxy polysiloxane modified maleimide prepolymer, so that the problem of compatibility of siloxane and polybutadiene in a maleimide compound is solved; a prepreg and a laminated board which are prepared from the modified maleimide resin composition disclosed by the invention have a relatively low X/Y-axis thermal expansion coefficient, and board deformationcaused by temperature change is not easy to generate, so that the problem of poor connection between a semiconductor element and a substrate and between the substrate and a PCB is avoided to a certainextent; and meanwhile, the relatively low dielectric constant and dielectric loss are also beneficial to increment of transmission speed of a signal and reduction of transmission loss of the signal,and therefore, the modified maleimide resin composition has a wide application prospect.

Description

technical field [0001] The invention relates to a modified maleimide resin composition and a prepreg and a laminate prepared by using the modified maleimide resin composition, belonging to the technical field of electronic materials. Background technique [0002] In the existing technology, with the continuous development of miniaturization and multi-function of electronic products and the continuous improvement of operating speed, the integration of chips is getting higher and higher, and the chip packaging technology is also improving, which has a great impact on the performance of substrate materials carrying semiconductor components , especially put forward higher requirements on the coefficient of thermal expansion (CTE). If the CTE difference between the semiconductor element and the substrate is too large, the substrate will easily warp due to the difference in CTE under heated conditions, resulting in serious problems such as poor connection between the semiconductor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08L63/00C08L79/04C08K3/36C08J5/24B32B15/08B32B15/20B32B27/06B32B27/20B32B27/28
CPCB32B15/08B32B15/20B32B27/06B32B27/20B32B27/281B32B2262/101B32B2307/204B32B2307/306B32B2457/08C08J5/24C08J2379/08C08J2463/00C08J2479/04C08L79/04C08L79/085C08L2201/08C08L2205/02C08L2205/03C08L63/00C08K3/36
Inventor 黄荣辉戴善凯谌香秀崔春梅
Owner SHENGYI TECH SUZHOU
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