Regeneration cycle method of acidic etching solution

Abstract

The invention discloses a regeneration cycle method of an acidic etching solution. The regeneration cycle method comprises the following steps that S1, an acidic etching waste solution generated on anacidic etching line of a PCB is collected into an etching waste solution tank; S2, the waste solution in the etching waste solution tank is conveyed into an electrolytic cell, and copper ions in thewaste solution is precipitated to form electrolytic copper sheets through electrolysis action in a cathode region; S3, waste solution in an anode area of the electrolytic cell is conveyed to an acid mist absorption cylinder; S4, chlorine gas is conveyed into the waste liquid in the acid mist absorption cylinder, and an regenerated etching solution is prepared through the reaction with the chlorinegas; and S5, the regenerated etching solution in the acid mist absorption cylinder is conveyed to the acidic etching line (developing-etching-stripping (DES)) for being used in an etching process torealize the regeneration cycle of the acidic etching solution. According to the regeneration cycle method, the reuse rate of the regenerated etching solution can be enabled to reach to 100%, the addition of hydrochloric acid and an oxidant is reduced by about 80%, and the material cost is greatly reduced.

Description

technical field [0001] The invention relates to the technical field of waste liquid recovery, in particular to an acid etching liquid regeneration cycle method. Background technique [0002] Current electronic devices are mainly assembled from components soldered onto PCB boards (electronic printed circuit boards). A large amount of copper metal is used in the manufacturing process of these PCB boards. Advanced electronic equipment, such as computers, require PCB boards with very complex structures and corresponding production processes. These PCB boards are usually multi-layered, including inner and outer layers, and the inner layer is etched by an etching solution. [0003] Current PCB boards usually include a substrate made of plastic or laminate and a copper clad film deposited on the substrate. The conductive pattern, i.e. the layout, consists of a protective plastic film (photoresist) covering the surface of the copper clad film. During the etching process the plas...

AI Technical Summary

Problems solved by technology

When the concentration of monovalent copper ions is too high in etching, the etching rate slows down and cannot meet the etching requirements

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