Gradient-sized pore sintered core vapor chamber heat exchanger for electronic chip heat dissipation and preparation method of vapor chamber heat exchanger

Abstract

The invention discloses a gradient-sized pore sintered core vapor chamber heat exchanger for electronic chip heat dissipation and a preparation method of the vapor chamber heat exchanger, belongs to the technical field of electronic chip heat dissipation. The vapor chamber heat exchanger is composed of a sintered core vapor chamber, heat dissipation fins, and a heat dissipation fan. A vapor chamber housing is filled with a gradient-sized pore sintered core. A vein-shaped channel is milled on the chamber top of the vapor chamber. Fins are welded to the outer top of the vapor chamber. The vaporchamber and the heat dissipation fan are fixedly installed. The bottom center of the vapor chamber is in contact with the chip in order to take away the heat released by the chip. The gradient-sized pore sintered core interacts with the top vein-shaped channel, thereby contributing to the rapid diffusion of steam to a cold wall, the return of a condensation liquid to the heated area at the bottomcenter of the vapor chamber with a small resistance under the effect of high capillary suction force, and the enhancement of the boiling and condensation heat capacity, increasing the boiling and condensation heat exchange area, greatly improving the heat transfer capability of the sintered core and expanding an applicable environment.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation for electronic chips, and relates to a heat pipe heat exchanger, in particular to a gas-liquid two-phase flow phase conversion heat exchanger and a homogenizer which adopts a gradient-scale pore sintered core structure in order to improve the heat transfer effect. Method for preparing a hot plate heat exchanger. Background technique [0002] With the rapid development of electronic technology, the high frequency and high speed of electronic chips and the densification and miniaturization of integrated circuits, heat dissipation has become one of the main factors restricting the development of electronic technology. Therefore, the research on heat dissipation technology of electronic chips is becoming more and more important. In confined space structures, it is urgent to develop new high-efficiency thermal control devices that are miniaturized and driven without pumps. [0003] Existing ...

AI Technical Summary

Problems solved by technology

As far as the working cycle process of the vapor chamber is concerned, the two are a contradictory unity. It is difficult for the uniform-scale capillary core to take into account the needs of the two, and it is not conducive to the chamber to reduce the starting working temperature, increase the limit heat flux and reduce temperature fluctuation

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