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Preparation method of thermal insulation microsphere filler with high emissivity and ablation resistance

A high emissivity, microsphere filler technology, applied in ceramic products, other household appliances, household appliances, etc., can solve problems such as catastrophic damage, thermal shock failure, etc., achieve high emissivity, good mechanical properties, high specific strength Effect

Active Publication Date: 2019-07-23
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as a ceramic material, UHTCs are a typical class of brittle materials, which are prone to thermal shock failure in extreme heating environments, resulting in catastrophic failure.

Method used

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  • Preparation method of thermal insulation microsphere filler with high emissivity and ablation resistance
  • Preparation method of thermal insulation microsphere filler with high emissivity and ablation resistance
  • Preparation method of thermal insulation microsphere filler with high emissivity and ablation resistance

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] This embodiment realizes above-mentioned performance through following technical solution:

[0032] (1) Powder preparation and mixing: use isopropanol or ethanol as the grinding medium, and use high-energy ball milling to grind UHTC components, high-emissivity self-healing components and sintering aids at a mass ratio of 50:50:5 Ball milling and mixing, the ball milling time is 36h, the ball milling speed is 2000r / min, after the ball milling, dry the obtained slurry for 24h to constant weight, grind and sieve to get the mixed powder, the primary particle size of the powder after ball milling should not be greater than 200nm ;

[0033] (2) Preparation of precursor slurry: put the powder obtained in step (1) into an organic solvent with a mass ratio of 3:9 to fully stir and disperse, and then put it into an ultrasonic pulverizer for ultrasonic dispersion for 30 minutes to eliminate nano-powder The physical agglomeration between them can obtain a uniform powder suspension...

Embodiment 2

[0050] The present invention realizes above-mentioned performance through following technical scheme:

[0051](1) Powder preparation and mixing: use isopropanol or ethanol as the grinding medium, and use high-energy ball milling to grind UHTCs components, high-emissivity self-healing components and sintering aids at a mass ratio of 20:80:10 Ball milling and mixing, the ball milling time is 24h, the ball milling rate is 1000r / min, after the ball milling is completed, dry the obtained slurry for 24h to constant weight, grind and sieve to obtain the mixed powder, the primary particle size of the powder after ball milling should not be greater than 200nm ;

[0052] (2) Preparation of precursor slurry: put the powder obtained in step (1) into an organic solvent with a mass ratio of 1:7 to fully stir and disperse, and then put it into an ultrasonic pulverizer for ultrasonic dispersion for 10 minutes to eliminate nano-powder The physical agglomeration between them can obtain a unifo...

Embodiment 3

[0066] The present invention realizes above-mentioned performance through following technical scheme:

[0067] (1) Powder preparation and mixing: use isopropanol or ethanol as the grinding medium, and use high-energy ball milling to grind UHTCs components, high-emissivity self-healing components and sintering aids at a mass ratio of 80:80:7 Ball milling and mixing, the ball milling time is 48h, the ball milling speed is 4000r / min, after the ball milling is completed, dry the obtained slurry for 24h to constant weight, grind and sieve to obtain the mixed powder, the primary particle size of the powder after ball milling should not be greater than 200nm ;

[0068] (2) Preparation of precursor slurry: put the powder obtained in step (1) into an organic solvent with a mass ratio of 6:7 to fully stir and disperse, and then put it into an ultrasonic pulverizer for ultrasonic dispersion for 60 minutes to eliminate nano-powder The physical agglomeration between them can obtain a unif...

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Abstract

The invention relates to a preparation method of thermal insulation microsphere filler with high emissivity and ablation resistance. The preparation method of the thermal insulation microsphere fillerwith high emissivity and ablation resistance comprises the steps as follows: preparation and mixing of powder, preparation of precursor slurry, preparation of precursor powder, sintering and the like. Compared with the prior art, the preparation method has the advantages that the production efficiency is high, the production period is short, equipment is simple, operation is convenient, preparedspray powder has better degree of sphericity and special pore structures, and a coating prepared from microspheres as filler has low mass ablation rate, high self-radiance and good mechanical properties and can effectively resist heat flow impact of 800 kW / m<2> or above and protect matrixes from deformation and failure due to high temperature erosion.

Description

technical field [0001] The invention relates to the field of heat insulation, in particular to a preparation method of a high-emissivity ablation-resistant heat-insulation microsphere filler. Background technique [0002] Thermal protection systems and thermal protection materials are the cornerstones for the development and guarantee of safe service of hypersonic vehicles and reusable vehicles in extreme environments. In order to improve the survivability of aircraft and break through the "new thermal barrier" problem of thermal protection, high-efficiency thermal protection systems and thermal protection materials must improve the ability to resist extreme service environments and meet the temperature resistance, durability and reliability requirements of aircraft thermal protection systems . Among the existing thermal protection systems, the most mature and the best thermal insulation system is the ablative thermal insulation system. Ablation heat protection means that ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B38/00C04B35/56C04B35/58C04B35/584C04B35/622
CPCC04B38/009C04B35/58078C04B35/5805C04B35/58092C04B35/5622C04B35/584C04B35/622C04B2235/3839C04B2235/3813C04B2235/3886C04B2235/3826C04B2235/38C04B2235/428C04B2235/408C04B2235/3804C04B2235/3873C04B2235/3895C04B2235/3281
Inventor 张瑞吉孙序成郭芳威赵晓峰
Owner SHANGHAI JIAO TONG UNIV
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