Heatproof coating layer and preparation method thereof
A technology of heat-resistant coating and aminophenylsulfone amide terminated, which is applied in coatings, fireproof coatings, electrical components, etc., can solve the problem that heat-resistant coatings cannot take into account thinner thickness and excellent heat resistance, and achieve Low heat shrinkage, excellent heat shrinkage resistance, and the effect of eliminating the force of aggregation
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Embodiment 1
[0027] A preparation method of a heat-resistant coating, the steps are as follows:
[0028] (1) After mixing isophthaloyl dichloride and p-phenylenediaminodiphenyl sulfone in a dimethyl sulfoxide solvent at a molar ratio of 5:5.1 to obtain a mixed solution, polycondensation reaction was carried out at a temperature of 1°C for 30 minutes. Terminated aminophenylsulfone amide surfactant, wherein, when the reaction started, the sum of isophthaloyl chloride and p-phenylenediaminodiphenylsulfone weight was 5% of the mixed solution weight, and the prepared aminophenylsulfone amide surfactant Molecular structure is NH 2 -C 6 h 4 -SO 2 -C 6 h 4 -NH-[CO-C 6 h4 -CO-NH-C 6 h 4 -SO 2 -C 6 h 4 ] n -NH 2 , n is 9, and the molar ratio of terminal amino group and sulfone group is 1:5;
[0029] (2) Dissolve the aminophenylsulfoneamide surfactant, aluminum oxide and polysulfoneamide in dimethylacetamide to form a coating solution, wherein the aminophenylsulfoneamide surfactant, alu...
Embodiment 2
[0035] A method for preparing a heat-resistant coating, the steps of which are as follows:
[0036] (1) After mixing isophthaloyl dichloride and p-phenylenediaminodiphenyl sulfone in a dimethyl sulfoxide solvent at a molar ratio of 5:5.2 to obtain a mixed solution, polycondensation reaction was carried out at a temperature of 2°C for 40 minutes. Terminated aminophenylsulfone amide surfactant, wherein, when the reaction started, the sum of isophthaloyl chloride and p-phenylenediaminodiphenylsulfone weight was 6% of the mixed solution weight, and the prepared aminophenylsulfone amide surfactant Molecular structure is NH 2 -C 6 h 4 -SO 2 -C 6 h 4 -NH-[CO-C 6 h 4 -CO-NH-C 6 h 4 -SO 2 -C 6 h 4 ] n -NH 2 , n is 11, and the molar ratio of the terminal amino group to the sulfone group is 1:6;
[0037] (2) dissolving the aminophenylsulfoneamide surfactant, zirconium dioxide and polyimide in dimethylformamide to form a coating solution, wherein the aminophenylsulfoneamide...
Embodiment 3
[0043] A method for preparing a heat-resistant coating, the steps of which are as follows:
[0044] (1) After mixing isophthaloyl dichloride and p-phenylenediaminodiphenyl sulfone in a dimethyl sulfoxide solvent at a molar ratio of 5:5.3 to obtain a mixed solution, polycondensation reaction was carried out at a temperature of 3°C for 50 minutes. Terminated aminophenylsulfone amide surfactant, wherein, when the reaction started, the sum of isophthaloyl chloride and p-phenylenediaminodiphenylsulfone weight was 10% of the mixed solution weight, and the prepared aminophenylsulfone amide surfactant Molecular structure is NH 2 -C 6 h 4 -SO 2 -C 6 h 4 -NH-[CO-C 6 h 4 -CO-NH-C 6 h 4 -SO 2 -C 6 h 4 ] n -NH 2 , n is 13, and the molar ratio of the terminal amino group to the sulfone group is 1:7;
[0045] (2) dissolving the aminophenylsulfoneamide surfactant, titanium dioxide and polysulfoneamide in dimethyl sulfoxide to form a coating solution, wherein the mass of the ami...
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