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Preparation method of surface acoustic wave sensor, and prepared sensor and application thereof

A surface acoustic wave and sensor technology, which is applied in the use of sound waves/ultrasonic waves/infrasonic waves to analyze fluids, use sound waves/ultrasonic waves/infrasonic waves for material analysis, and instruments, etc. It can solve the problems of reducing success rate, damage, and secondary pollution of SAW sensors. , to achieve a good nanoscale, improve the preparation efficiency, and improve the effect of utilization

Active Publication Date: 2019-09-06
SOUTHWEST JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, nanostructured ZnO is mainly prepared on the surface of the SAW chip as a waveguide layer by chemical synthesis, hydrothermal method, and sol-gel method. However, these methods cannot accurately control the film thickness, and it is difficult to achieve repeatable and large-scale mass production
In order to achieve repeatable and large-scale production, there are also studies on the preparation of ZnO thin films by magnetron sputtering, but the existing technology cannot form nano-particle ZnO thin films by magnetron sputtering, and there are a large number of defects or flaws inside the thin films, while the microscopic properties of ZnO The shape and scale directly affect the performance of the final SAW sensor. Therefore, in order to obtain a relatively excellent ZnO film as a waveguide layer, it is necessary to transfer the SAW sensor after the magnetron sputtering ZnO waveguide layer to the annealing equipment, which is difficult to avoid. It will cause secondary pollution to the prepared SAW sensor
[0004] Secondly, the preparation of waveguide layers based on SAW sensors mainly relies on traditional photolithography technology. The SAW sensor substrate and electrodes cause contamination or damage, reducing its success rate
In addition, the traditional micromachining lithography process can only batch process the SAW chip array on a whole piece of ST-cut quartz wafer at a time, and cannot realize the micromachining of the surface of a single SAW device after cutting

Method used

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  • Preparation method of surface acoustic wave sensor, and prepared sensor and application thereof
  • Preparation method of surface acoustic wave sensor, and prepared sensor and application thereof
  • Preparation method of surface acoustic wave sensor, and prepared sensor and application thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0021] A preparation method of a surface acoustic wave sensor, the steps are as follows:

[0022] S1. Preparation of SAW chip: select piezoelectric substrate, and prepare interdigital electrodes on the piezoelectric substrate through photolithography and micromachining process;

[0023] S2. Preparation of a magnetron sputtering mold: the magnetron sputtering mold is connected by bolts or magnetically by an upper mold and a lower mold; the lower mold is provided with an array of SAW chip card slots in which SAW chips can be placed, and the upper mold is provided with The multiple rectangular through holes corresponding to the delay line area of ​​the SAW chip; the mold prepared in this example is as figure 1 As shown in the figure, 1.0 is the upper mold, 1.1 is the rectangular through hole corresponding to the SAW chip delay line area (the area of ​​the delay line area is 8.4×4.3mm 2 ), 2.0 is the lower mold, 2.1 is the SAW chip card slot array that can place the SAW chip.

[0024] S3...

Embodiment 2

[0034] A preparation method of a surface acoustic wave sensor, the steps are as follows:

[0035] S1. Preparation of SAW chip: select piezoelectric substrate, and prepare interdigital electrodes on the piezoelectric substrate through photolithography and micromachining process;

[0036] S2. Preparation of a magnetron sputtering mold: the magnetron sputtering mold is connected by bolts or magnetically by an upper mold and a lower mold; the lower mold is provided with an array of SAW chip card slots in which SAW chips can be placed, and the upper mold is provided with The multiple rectangular through holes corresponding to the delay line area of ​​the SAW chip; the mold prepared in this example is as figure 1 As shown in the figure, 1.0 is the upper mold, 1.1 is the rectangular through hole corresponding to the SAW chip delay line area (the area of ​​the delay line area is 8.4×4.3mm 2 ), 2.0 is the lower mold, 2.1 is the SAW chip card slot array that can place the SAW chip.

[0037] S3...

Embodiment 3

[0042] A preparation method of a surface acoustic wave sensor, the steps are as follows:

[0043] S1. Preparation of SAW chip: select piezoelectric substrate, and prepare interdigital electrodes on the piezoelectric substrate through photolithography and micromachining process;

[0044] S2. Preparation of a magnetron sputtering mold: the magnetron sputtering mold is connected by bolts or magnetically by an upper mold and a lower mold; the lower mold is provided with an array of SAW chip card slots in which SAW chips can be placed, and the upper mold is provided with The multiple rectangular through holes corresponding to the delay line area of ​​the SAW chip; the mold prepared in this example is as figure 1 As shown in the figure, 1.0 is the upper mold, 1.1 is the rectangular through hole corresponding to the SAW chip delay line area (the area of ​​the delay line area is 8.4×4.3mm 2 ), 2.0 is the lower mold, 2.1 is the SAW chip card slot array that can place the SAW chip.

[0045] S3...

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Abstract

The invention discloses a preparation method of a surface acoustic wave sensor, and a prepared sensor and application thereof. The preparation method comprises the following steps: S1, preparing an SAW chip; S2, preparing a magnetron sputtering mold; to be specific, connecting an upper mold and a lower mold by a bolt or magnetically to form the magnetron sputtering mold, arranging an SAW chip clamp slot array for placing the SAW chip in the lower mold, and opening a plurality of rectangular through holes corresponding to an SAW chip delay line region in the upper mold; S3, depositing a ZnO thin film; to be specific, depositing a nano-participle-shaped ZnO thin film having the size of 25 to 45 nm on the surface of the SAW chip by means of magnetron sputtering; to be specific, depositing theZnO thin film by means of magnetron sputtering in a multi-layer manner and adjusting magnetron sputtering parameter differences of different deposition layers to control the shape of the ZnO thin film deposited on the surface of the SAW chip. According to the invention, the surface acoustic wave prepared by the above preparation method is used for detecting the humidity in air; and the average linear sensitivity in the humidity detection reaches up to 573.4 Hz / % RH.

Description

Technical field [0001] The invention relates to a preparation method of a surface acoustic wave sensor, the prepared sensor and its application, and belongs to the field of surface acoustic wave sensors. Background technique [0002] Surface Acoustic Wave (SAW) sensor, as a new detection technology, has the advantages of miniaturization, high sensitivity, fast response speed, and low detection limit. It has become a research hotspot in related fields in the academic community. Its application fields Covers environmental monitoring, food safety, medical diagnosis, etc. [0003] SAW sensors are mainly divided into four categories, active delay line type, active resonator type, passive delay line type and passive resonator type. Among them, the SAW sensor structure of the active delay line type is mainly composed of input and output fingers. The transducer is deposited on the surface of the piezoelectric substrate. The input interdigital transducer is used to generate excitation sign...

Claims

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Application Information

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IPC IPC(8): G01N29/02
CPCG01N29/022
Inventor 永远李盼召许章亮贺正琦吴浪陈伯仲
Owner SOUTHWEST JIAOTONG UNIV
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