Method for improving performance of Mg/Ti connecting interface
A technology for connecting interface and performance, which is applied in the field of preparation of "titanium/aluminum matrix composites/magnesium/aluminum matrix composites/titanium" layered materials, can solve problems affecting the bonding strength and mechanical properties of plates, and achieve improved casting. Defects, grain refinement, performance improvement effect
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specific Embodiment approach 2
[0039] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the volume fraction of spherical SiCp described in step 1 is 5%, and the others are the same as Embodiment 1.
specific Embodiment approach 3
[0040] Embodiment 3: The difference between this embodiment and Embodiment 1 is that the volume fraction of spherical SiCp described in step 1 is 15%, and the others are the same as Embodiment 1.
specific Embodiment approach 4
[0041] Embodiment 4: The difference between this embodiment and Embodiment 1 is that the rolling temperature in step 2 is 400° C., and the others are the same as Embodiment 1.
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