High-performance electronic glue

An electronic glue, high-performance technology, applied in the field of electronic glue, can solve the problems of poor temperature resistance, easy inversion, poor toughness, etc., to achieve the effect of expanding the application range, large difference in chromaticity, and high temperature resistance.

Inactive Publication Date: 2019-09-20
江苏方成生物科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the shortcomings of existing electronic adhesives in the prior art, such as poor toughness, poor temperature resistance, high brittleness, large shrinkage, easy reversibility and no anti-counterfeiting, and propose a high-performance electronic adhesive.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A high-performance electronic glue is composed of base resin, curing agent, flame retardant, initiator, discoloration agent, filler and auxiliary agent, wherein the base resin is bisphenol A epoxy resin, and the curing agent is modified polysulfide Alcohol urea compound, the flame retardant adopts decabromo compound, and the initiator adopts a free radical ultraviolet initiator, and the free radical ultraviolet initiator is benzil and its derivatives and acetophenone and its derivatives in a ratio of 1:2 by weight The mixture, the discoloration agent adopts redox type photochromic polymer, the filler adopts calcium silicate, and its composition is by weight percentage: bisphenol A type epoxy resin 30%, modified polythiol urea compound 8%, 1% of decabromo compound, 1% of free radical ultraviolet initiator, 1% of redox photochromic polymer, 20% of calcium silicate, and the rest are additives, which mainly include coupling agent, fumed silica , Organic bentonite, zinc powd...

Embodiment 2

[0025] A high-performance electronic glue is composed of base resin, curing agent, flame retardant, initiator, discoloration agent, filler and auxiliary agent, wherein the base resin is bisphenol A epoxy resin, and the curing agent is modified polysulfide Alcohol urea compound, the flame retardant adopts decabromo compound, and the initiator adopts a free radical ultraviolet initiator, and the free radical ultraviolet initiator is benzil and its derivatives and acetophenone and its derivatives in a ratio of 1:2 by weight The mixture, the discoloration agent adopts redox type photochromic polymer, the filler adopts calcium silicate, and its composition is by weight percentage: bisphenol A type epoxy resin 40%, modified polythiol urea compound 10%, 2% of decabromo compound, 2% of free radical ultraviolet initiator, 3% of redox photochromic polymer, 25% of calcium silicate, and the rest are auxiliary agents, which mainly include coupling agent, fumed silica , Organic bentonite, z...

Embodiment 3

[0033] A high-performance electronic glue is composed of base resin, curing agent, flame retardant, initiator, discoloration agent, filler and auxiliary agent, wherein the base resin is bisphenol A epoxy resin, and the curing agent is modified polysulfide Alcohol urea compound, the flame retardant adopts decabromo compound, and the initiator adopts a free radical ultraviolet initiator, and the free radical ultraviolet initiator is benzil and its derivatives and acetophenone and its derivatives in a ratio of 1:2 by weight The mixture, the discoloration agent adopts redox type photochromic polymer, the filler adopts calcium silicate, and its composition is by weight percentage: bisphenol A type epoxy resin 50%, modified polythiol urea compound 15%, 3% of decabromo compound, 5% of free radical ultraviolet initiator, 4% of redox photochromic polymer, 20% of calcium silicate, and the rest are additives, which mainly include coupling agent, fumed silica , Organic bentonite, zinc pow...

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Abstract

The invention relates to the technical field of electronic glue, in particular to high-performance electronic glue. The high-performance electronic glue comprises base resin, curing agents, flame retardants, initiators, color changing agents, fillers and auxiliary agents, and specifically comprises, by weight, 30-50% of bisphenol-A epoxy resin, 8-15% of modified polythiol urea composites, 1-5% of decabromo composites, 1-5% of free radical ultraviolet initiators, 1-5% of redox photochromic polymers, 20-35% of calcium silicate ad the balance of the auxiliary agents. The high-performance electronic glue has the advantages that the color is stable before curing, and chromaticity differences are large before and after curing; the electronic glue has high temperature resistance through introduction of the flame retardants and the color changing agents, can emit strong fluorescence under the excitation of ultraviolet light, and has a certain anti-counterfeiting performance; the application field of adhesives is widened.

Description

technical field [0001] The invention relates to the technical field of electronic glue, in particular to a high-performance electronic glue. Background technique [0002] Polyester resins used in coatings are generally low-molecular-weight, amorphous, branched, and cross-linkable polymers, which are generally formed from polyols and polybasic acid esterification, with pure linear and branched There are two types of structures, and the paint film prepared by pure linear structure resin has better flexibility and processing performance; Glue, the common problem is that the toughness of the glue is not enough, which shows that the adhesion and impact resistance are not up to standard, and the damage always occurs in the triangular position of the PMMA lens. For the backlight strips used in LED TVs, it is necessary to improve the drop resistance of the one-component epoxy electronic adhesive. At the same time, the hot melt, unsaturated resin and curing agent used in electronic ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08
CPCC08K2003/0893C08L2201/08C09J11/04C09J11/06C09J11/08C09J163/00C08K13/02C08K3/34C08K3/36C08K3/346C08K3/08
Inventor 朱世昌
Owner 江苏方成生物科技有限公司
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