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A solar silicon wafer wire saw cutting machine

A technology for solar silicon wafers and saw cutting machines, which is applied in the directions of manufacturing tools, stone processing equipment, fine working devices, etc., can solve problems such as insufficient adjustment methods.

Active Publication Date: 2021-07-06
安徽三优光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this adjustment method has the disadvantage of not being convenient enough

Method used

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  • A solar silicon wafer wire saw cutting machine
  • A solar silicon wafer wire saw cutting machine
  • A solar silicon wafer wire saw cutting machine

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0025] see Figure 1-5 As shown, a solar silicon wafer wire saw cutting machine, such as figure 1 As shown, it includes a supporting device 1, a cutting device 2 and a cutting fluid device 3, the cutting device 2 is installed on the supporting device 1, and the cutting fluid device 3 is installed on the cutting device 2;

[0026] Such as figure 2 As shown, the supporting device 1 includes a supporting base plate 11, and the upper surface of the supporting base p...

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Abstract

The invention discloses a solar silicon chip wire saw cutting machine, which comprises a supporting device, a cutting device and a cutting fluid device, the cutting device is installed on the supporting device, the cutting fluid device is installed on the cutting device; the upper surface of the supporting bottom plate of the supporting device There is a bar-shaped limit groove, and the first mounting plate is fixed, and the threaded rod is installed on the first mounting plate; the cutting device includes two second mounting plates that are relatively arranged on the upper surface of the supporting base plate, and the second mounting plate is fixed with A first gear, two second gears and two sector gears; the cutting fluid device includes a first cutting fluid pipe and a second cutting fluid pipe, and the second cutting liquid pipe is sheathed on the first cutting fluid pipe. The invention can realize the adjustment of the cutting line width and the cutting fluid spray width at the same time according to the width of the solar silicon wafer to be cut, which is simple and convenient; through the adjustment of the cutting line width and the cutting fluid spraying width, the cutting fluid slurry can be saved , Improve processing adaptability and work efficiency.

Description

technical field [0001] The invention belongs to the technical field of solar silicon wafer manufacturing, and in particular relates to a solar silicon wafer wire saw cutting machine. Background technique [0002] As we all know, under the circumstance that fossil fuels are decreasing day by day, solar energy has become an important part of energy used by human beings, and it has been continuously developed. There are two ways to use solar energy: photothermal conversion and photoelectric conversion. Solar power is a new type of renewable energy. With the continuous development of solar cell technology, solar cells based on the photovoltaic effect have a bright application prospect. Solar cells are components assembled and packaged by solar silicon wafers, tempered glass, EVA, etc. [0003] During the production and processing of solar silicon wafers, steps such as polishing, chamfering, cutting, cleaning, and testing are required. In the cutting process of silicon wafers,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/00B28D5/04
CPCB28D5/0058B28D5/0076B28D5/045
Inventor 陈梅业肖鹏李进
Owner 安徽三优光电科技有限公司
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