Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Chemical palladium solution applied to PCB chemical gold palladium clad layer

A chemical gold and solution technology, applied in liquid chemical plating, metal material coating process, coating, etc., can solve problems that are difficult to deal with fine and complex electronic circuit design products, and achieve excellent ductility and stable coordination system , to ensure a stable effect

Active Publication Date: 2019-10-11
深圳市溢诚电子科技有限公司
View PDF1 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing surface treatment methods such as spray tin, tin, silver, and OSP are mainly used for solder connection processes. The main disadvantage is that they can only be applied to the most basic circuit design and electronic products, because the solder itself limitations, it is difficult to deal with fine and complex electronic circuit design products

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chemical palladium solution applied to PCB chemical gold palladium clad layer
  • Chemical palladium solution applied to PCB chemical gold palladium clad layer
  • Chemical palladium solution applied to PCB chemical gold palladium clad layer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] Palladium sulfate (as Pd 2+ total): 0.3g / L, ethylenediamine: 5g / L, 4-fluorobenzylamine: 2g / L, hydroxylamine sulfate: 3g / L, 7-(diethylamino)coumarin: 15mg / L, glycine: 5g / L, ammonium sulfate: 8g / L, tetrabutylammonium bisulfate: 2mg / L temperature: 60°C, pH7.5.

[0076] The appearance of the palladium layer obtained under the above parameters is flat and bright, there is no penetration plating on the fine lines, there is no missing plating in the micro and blind holes, and the lines are not whitish or falling off. The thickness of the coating is 4.3μinch (plating for 15 minutes). The stability of the solution reaches 6MTO (the circular experiment of palladium plating on the copper substrate is carried out. In the case of the plating solution with a palladium concentration of 0.3g / L in the construction of the tank, it is called 1MTO to deposit 0.3g / L palladium on the substrate), 3M Adhesive force of adhesive tape coating is good. At the same time, after the bending resista...

Embodiment 2

[0078] Palladium Ammonium Sulfate (as Pd 2+ Total): 0.6g / L, ethylenediamine: 10g / L, benzylamine: 1g / L, N,N-diethylhydroxylamine: 10g / L, 7-(diethylamino)coumarin: 50mg / L , Glycine: 1g / L, Ammonium Sulfate: 4g / L, Tetrabutylammonium Bisulfate: 0.1mg / L Temperature: 40°C, pH 7.0

[0079] The appearance of the palladium layer obtained under the above parameters is flat and bright, there is no penetration plating on the fine lines, there is no missing plating in the micro and blind holes, and the lines are not whitish or falling off. The thickness of the coating is 3.2μinch (plating for 10 minutes). Liquid stability up to 6MTO, 3M adhesive tape coating has good adhesion. At the same time, after the bending resistance test of the coating, no obvious cracks were observed at 100 times magnification; the solder test showed that the pads were well wetted and the tin was full; the bonding performance was excellent, and the gold wire tensile test reached more than 10g.

Embodiment 3

[0081] Palladium Ammonium Sulfate (as Pd 2+ Total): 0.4g / L, furfurylamine: 5g / L, benzylamine: 10g / L, D-mannitol: 2g / L, thiodiglycolic acid: 100mg / L, glycine: 3g / L, ammonium sulfate : 15g / L, cetyltrimethylammonium bisulfate: 5mg / L Temperature: 50℃, pH 7.2

[0082] The appearance of the palladium layer obtained under the above parameters is smooth and bright, there is no penetration plating on the fine lines, there is no missing plating in the micro and blind holes, and the lines are not whitish or falling off. The thickness of the coating is 4.6μinch (plating for 15 minutes). Liquid stability reaches 5.5MTO, 3M adhesive tape coating has good adhesion. At the same time, after the bending resistance of the coating, no obvious cracks were observed when magnified 100 times; the solder test showed that the pads were well wetted and the tin was full; the bonding performance was excellent, and the gold wire tensile test reached more than 10g.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a chemical palladium solution applied to a PCB chemical gold palladium clad layer. Main salt, a coordination agent, a reducing agent, a stabilizer, a pH buffering agent and a surface active agent are included. The mass concentration serves as the unit, the components include, by proportion, 0.4-0.6 g / L of the palladium in the main salt according to the concentration, 0.1-30g / L of the coordination agent, 0.1-25 g / L of the reducing agent, 1-150 mg / L of the stabilizer, 1-25 g / l of the pH buffering agent, 0.1-10 mg / L of the surface active agent and the balance pure water.A palladium layer prepared through the palladium solution can meet good welding and bonding requirements, and meanwhile the chemical palladium solution is applicable to surface treatment of a circuitwith the wire width / wire distance being 0.5 mil or below or even smaller.

Description

technical field [0001] The invention relates to the technical field of PCBs, in particular to a chemical palladium solution applied to chemical gold-palladium-gold plating on PCBs. Background technique [0002] COF is an IC packaging technology. It uses the flexible substrate circuit FPC as the carrier of the packaged chip. ) for bonding (Bonding) technology. After the COF production is completed, after the LCD Panel module factory obtains the IC, the IC on the tape will be cut into single pieces by punching (Punch) equipment. Usually, there will be design input on the flexible substrate circuit of COF The outer pins (Outer Lead) at both ends of the input terminal (Input) and the output terminal (Output). PCB) bonding. [0003] In the smart portable era, the rapid development of small electronic products represented by mobile phones, computers and monitors. The COF FPC substrate adopts the SAP semi-additive production method which is completely different from the standar...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/44H05K3/18
CPCC23C18/44H05K3/181
Inventor 许国军卢意鹏吴运会许香林刘高飞
Owner 深圳市溢诚电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com