The invention discloses a chemical
palladium plating solution used in the field of
wafer packaging and a preparation method thereof. With the
mass concentration as the unit, the chemical
palladium plating solution comprises tetraammine
palladium sulfate with the concentration being 25-30 g / L, a complexing agent with the concentration being 30-60 g / L,
malic acid with the concentration being 5-10 g / L, polyamino polyether
methylene phosphonic acid with the concentration being 5-15 g / L,
saccharin with the concentration being 5-9 g / L, a
reducing agent with the concentration being 2-5 g / L, a coordination agent with the concentration being 0.1-10 g / L, a stabilizing agent with the concentration being 0.2-0.4 g / L and a surfactant with the concentration being 0.05-0.2 g / L. The tetraammine palladium
sulfate,
citric acid, the
malic acid, the polyamino polyether
methylene phosphonic acid, the
saccharin, the coordination agent, the stabilizing agent and the surfactant are mixed according to the proportion, the pH value is adjusted to 6.5-8.5 through a
buffering agent, then the palladium plating solution is formed, the temperature is adjusted to 50-60 DEG C, and the palladium plating time is 5-15 min. A plating layer obtained by using the palladium plating solution is compact in structure, and the plating layer is fine and uniform in
crystallization.