Chemical palladium plating solution used in field of wafer packaging and preparation method thereof

A technology of wafer packaging and electroless plating, applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problem of poor corrosion performance, ductility and bending performance, palladium plating deposition rate and dense palladium layer Uncontrollable corrosion resistance, unstable electroless palladium plating, etc., to achieve good corrosion resistance test requirements, excellent ductility, and low cost effects

Active Publication Date: 2021-04-06
江苏矽智半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] 1) If the plated parts are exposed to water or air for a long time, discoloration and oxidation will occur; this will easily affect the use of the plated parts in the later stage; and the palladium tank will be decomposed due to homogeneous catalysis during use. This causes the instability of electroless palladium plating
[0007] 2) Due to the difference in temperature and electroplating time in the electroless palladium plating layer, the deposition rate of palladium plating and the compactness of the palladium layer cannot be controlled, which eventually leads to poor corrosion performance, ductility and bending performance
In addition, water-soluble compounds are mainly used as palladium salts on the market at present, and their storage and transportation are in liquid state, which is not conducive to production operations

Method used

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  • Chemical palladium plating solution used in field of wafer packaging and preparation method thereof
  • Chemical palladium plating solution used in field of wafer packaging and preparation method thereof
  • Chemical palladium plating solution used in field of wafer packaging and preparation method thereof

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preparation example Construction

[0037] In order to achieve the above object, the present invention also provides a preparation method of an electroless palladium plating solution used in the field of wafer packaging, comprising the following specific steps:

[0038] 1) prepare a palladium tank, and carry a stirring pump in this palladium tank;

[0039] 2) in the palladium tank, pour into tetrahydropalladium sulfate, then add deionized water and continuously stir until the tetrahydropalladium sulfate dissolves completely, and be mixed with the mass concentration of tetrahydropalladium sulfate to obtain solution A after 25-30g / L ;

[0040] 3) successively add citric acid and malic acid whose concentration ratio is 6:1 in solution A, and obtain solution B after stirring;

[0041] 4) while continuing to stir solution B and adding the polyaminopolyether methylidene phosphonic acid that concentration is 5-15g / L, the saccharin of concentration 5-9g / L, the reducing agent that concentration is 2-5g / L, Solution C is...

Embodiment 1

[0055]

[0056]

[0057] Among them, the bath temperature is 50°C; the time is 10min.

[0058] Using the palladium plating solution in the present embodiment, the palladium layer of the obtained plated part has a smooth and silver-white appearance; observed with a microscope, it can be clearly seen that the structure of the plated layer is very dense, the crystallization of the plated layer is meticulous and uniform, and has no cracks; after the 180° bending test, the The adhesion of the coating is very good, and no obvious cracks are observed at 100 times magnification.

Embodiment 2

[0060]

[0061] Among them, the bath temperature is 55°C; the time is 12min.

[0062] Using the palladium plating solution in the present embodiment, the palladium layer of the obtained plated part has a smooth and silver-white appearance; observed with a microscope, it can be clearly seen that the structure of the plated layer is very dense, the crystallization of the plated layer is meticulous and uniform, and has no cracks; after the 180° bending test, the The adhesion of the coating is very good, and no obvious cracks are observed at 100 times magnification.

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Abstract

The invention discloses a chemical palladium plating solution used in the field of wafer packaging and a preparation method thereof. With the mass concentration as the unit, the chemical palladium plating solution comprises tetraammine palladium sulfate with the concentration being 25-30 g / L, a complexing agent with the concentration being 30-60 g / L, malic acid with the concentration being 5-10 g / L, polyamino polyether methylene phosphonic acid with the concentration being 5-15 g / L, saccharin with the concentration being 5-9 g / L, a reducing agent with the concentration being 2-5 g / L, a coordination agent with the concentration being 0.1-10 g / L, a stabilizing agent with the concentration being 0.2-0.4 g / L and a surfactant with the concentration being 0.05-0.2 g / L. The tetraammine palladium sulfate, citric acid, the malic acid, the polyamino polyether methylene phosphonic acid, the saccharin, the coordination agent, the stabilizing agent and the surfactant are mixed according to the proportion, the pH value is adjusted to 6.5-8.5 through a buffering agent, then the palladium plating solution is formed, the temperature is adjusted to 50-60 DEG C, and the palladium plating time is 5-15 min. A plating layer obtained by using the palladium plating solution is compact in structure, and the plating layer is fine and uniform in crystallization.

Description

technical field [0001] The present invention relates to the technical field of packaging and materials, in particular to an electroless palladium plating solution used in the field of wafer packaging and a preparation method thereof. Background technique [0002] The general positioning of wafer-level packaging is to perform most or all of the packaging and testing procedures directly on the wafer, and then perform dicing to form a single component. Wafer-level packaging has a smaller package size and better electrical performance. At present, it is mainly used in various semiconductor products, and its demand mainly comes from the requirements of portable products for the characteristics of light, thin and short. [0003] Wafer-level packaging has a very important surface treatment process, which is directly related to the use of subsequent electronic products. Existing surface treatment processes (nickel-gold, nickel-palladium-gold, palladium-gold, silver, tin, OSP, tin s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/44
CPCC23C18/44
Inventor 洪学平姚吉豪
Owner 江苏矽智半导体科技有限公司
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