Photosensitive resin composition for stereolithography

A technology of photosensitive resin and composition, applied in the field of polymer materials, can solve the problems of unsolved odor of thiol monomer, hindering the application of thiol-olefin photosensitive resin, unpleasant smell of small molecule thiol monomer, etc.

Active Publication Date: 2019-10-22
LINGNAN NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The above shows that thiol-olefin photosensitive resins have great application value for light-curing rapid prototyping, but the above-mentioned patents or literature reports are mostly small-molecule thiol monomers, and the taste of small-molecule thiol monomers is unpleasant, which hinders thiol -Application of olefin photosensitive resin in photocuring rapid prototyping
And the preparation method of the polyurethane thiol oligomer that US5,744,514 provides is to utilize small molecular thiol to block isocyanate oligomer, still may be unavoidable that small molecular thiol will remain unavoidably, thereby cause residual taste, still Does not solve the problem of mercaptan monomer odor

Method used

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  • Photosensitive resin composition for stereolithography
  • Photosensitive resin composition for stereolithography
  • Photosensitive resin composition for stereolithography

Examples

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Embodiment 1

[0072] This embodiment provides a polyurethane dihydric thiol prepolymer (odorless polyurethane thiol monomer T1) and a photosensitive resin (photosensitive resin system S1) prepared therefrom.

[0073] The composition (mass fraction) of the photosensitive resin system S1 is as follows: polyamic acid dibasic thiol monomer T1 60%, tetrakis (ethylene glycol) diacrylate 38%, hydroquinone 1%, 2-hydroxy-2- Methyl-p-hydroxyethyl ether phenylacetone 1%.

[0074] Odorless polyurethane thiol monomer T1 and photosensitive resin system S1 can be prepared by the following method:

[0075] (1) Synthesis of odorless polyurethane thiol monomer T1: In a three-necked round-bottomed flask of 1000mL, under nitrogen protection, 181g of 6-bromohexanol, 147g of isophorone diisocyanate (IPDI) and 0.97g of dibutyltin dilaurate, dissolved in 200mL of acetone, reacted at 50°C for 5 hours, then added 21g of polyethylene glycol (molecular weight: 200), raised the temperature to 75°C and continued to rea...

Embodiment 2

[0078] This embodiment provides a polyurethane dihydric thiol prepolymer (odorless polyurethane thiol monomer T2) and a photosensitive resin (photosensitive resin system S2) prepared therefrom.

[0079] The composition (mass fraction) of the photosensitive resin system S2 is as follows: polyamic acid dibasic thiol monomer T2 50%, tetra(ethylene glycol) diacrylate 30%, tripropoxylated glycerol triacrylate 10% , Hydroquinone 5%, 2-hydroxy-2-methyl-p-hydroxyethyl ether phenylacetone 5%.

[0080] Odorless polyurethane thiol monomer T2 and photosensitive resin system S2 can be prepared by the following method:

[0081] (1) Synthesis of odorless polyurethane thiol monomer T2: In a 1000mL three-necked round-bottomed flask, under nitrogen protection, 150g of 2-bromoethanol, 300g of diphenylmethane diisocyanate (MDI) and 0.97 2 g of dibutyltin dilaurate, dissolved in 200 mL of acetone, reacted at 50 ° C for 5 hours, then added 290 g of polyethylene glycol (molecular weight 2000), rais...

Embodiment 3

[0084] This embodiment provides a polyurethane dihydric thiol prepolymer (odorless polyurethane thiol monomer T3) and a photosensitive resin (photosensitive resin system S3) prepared therefrom.

[0085] Odorless polyurethane thiol monomer T3 and photosensitive resin system S3 can be prepared by the following method:

[0086] The composition (mass fraction) of the photosensitive resin system S3 is as follows: polyamic acid dibasic thiol monomer T3 60%, tetra(ethylene glycol) diacrylate 30%, tripropoxylated glycerol triacrylate 6% , Hydroquinone 2%, 2-hydroxy-2-methyl-p-hydroxyethyl ether phenylacetone 2%.

[0087] (1) Synthesis of odorless polyurethane thiol monomer T3: in a three-necked round-bottomed flask of 1000mL, under nitrogen protection, 120g of 6-bromohexanol, 147g of dicyclohexylmethane diisocyanate (HMDI) and 0.2 g of dibutyltin dilaurate was dissolved in 200 mL of acetone, and reacted at 50° C. for 7 hours, then 620 g of polyethylene glycol oxalate (molecular weigh...

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Abstract

The invention relates to a polyurethane-binary thiol prepolymer and a photosensitive resin composition. The prepolymer is as shown in a formula (I) which is described in the specification. In the formula (I), R is as described in the specification, and n1 in R is no less than 2 and no more than 6; R1 is as described in the specification, and in R1, n2 is no less than 1 and no more than 100, n3 isno less than 1 and no more than 100, n4 is no less than 1 and no more than 100, n5 is no less than 1 and no more than 100, n6 is no less than 1 and no more than 100, x is no less than 1 and no more than 3, and y is no less than 1 and no more than 3; and R2 is as described in the specification. According to the invention, the polyurethane-binary thiol prepolymer is prepared by increasing the lengthof the alkyl chain of thiol and through substitution of specific groups, so the volatility of thiol is greatly reduced, and no irritating odor is emitted. The photosensitive resin prepared from the polyurethane-binary thiol prepolymer is also odorless, and has smaller volume shrinkage and a faster polymerization rate.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a photosensitive resin composition for photocuring rapid prototyping. The patent application of the present invention is a divisional application of the invention patent with the application number 2018105251019, the application date is 2018.05.28, and the title is "a polyurethane dithiol prepolymer, photosensitive resin composition and its preparation method and application". Background technique [0002] Light-curing rapid prototyping technology is widely used in automobile manufacturing, mold casting, medical treatment, jewelry and art due to its advantages of low energy consumption, high precision and low cost. In 1986, Dr. Charles W. Hull first disclosed the patent of this rapid prototyping technology in the patent US 4,575,330. The molding material used in stereolithography is a liquid photosensitive resin, which can be cured layer by layer according to the compu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G18/38C08G18/48C08G18/66C08G18/67
CPCC08G18/3876C08G18/4833C08G18/6666C08G18/673
Inventor 余彪杨健潘港元贾永梅周晓平李建鹏
Owner LINGNAN NORMAL UNIV
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