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Method for electroless copper plating on the surface of diamond particles activated by metal coating sensitization

A technology of diamond particles and surface chemistry, applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problems of expensive metal palladium and high cost of electroless copper plating, and achieve the effect of low cost and simple process

Active Publication Date: 2021-11-30
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the traditional diamond electroless plating of Cu must go through SnCl 2 Sensitization, PdCl 2 Activation pretreatment, otherwise plating cannot be done successfully
The expensive metal palladium makes the cost of electroless copper plating too high

Method used

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  • Method for electroless copper plating on the surface of diamond particles activated by metal coating sensitization
  • Method for electroless copper plating on the surface of diamond particles activated by metal coating sensitization

Examples

Experimental program
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Effect test

Embodiment 1

[0025] A method for electroless copper plating on the diamond particle surface of metal coating sensitization activation, its concrete steps are as follows:

[0026] (1) Put diamond particles and W powder with a mass ratio of 10:1 into the mortar, and add NaCl and BaCl with a mass ratio of 1:10 2 Mix salt, mix evenly (mixed powder of diamond particles and W powder with NaCl and BaCl 2 The mass ratio of mixed salt is 1:1), obtains mixed material; Mixed material is placed in heating furnace, under N 2 -H 2 Mixed gas (N 2 and H 2 The volume ratio is 85%:15%) and heated to 1100°C under protection, and kept for 30 minutes; after the product is cooled, it is cleaned and dried to obtain diamond particles coated with tungsten on the surface;

[0027] (2) take by weighing 9.8g of copper sulfate (CuSO 4 ·5H 2 O) and 0.02g of 2,2-bipyridine (C 10 h 8 N 2 ), add 250mL deionized water to dissolve to obtain blue solution A; weigh 27g disodium edetate (C 10 h 14 N 2 Na 2 o 8 2H...

Embodiment 2

[0032] A method for electroless copper plating on the diamond particle surface of metal coating sensitization activation, its concrete steps are as follows:

[0033] (1) Put diamond particles and W powder with a mass ratio of 10:1 into the mortar, and add NaCl and BaCl with a mass ratio of 1:10 2 Mix salt, mix evenly (mixed powder of diamond particles and W powder with NaCl and BaCl 2 The mass ratio of mixed salt is 1:1), obtains mixed material; Said mixed material is placed in heating furnace, under N 2-H 2 Mixed gas (N 2 and H 2 The volume ratio is 85%:15%) and heated to 1100°C under protection, and kept for 30 minutes; after the product is cooled, it is cleaned and dried to obtain diamond particles coated with tungsten on the surface;

[0034] (2) take by weighing 9.8g of copper sulfate (CuSO 4 ·5H 2 O) and 0.02g of 2,2-bipyridine (C 10 h 8 N 2 ), add 250mL deionized water to dissolve to obtain blue solution A; weigh 27g disodium edetate (C 10 h 14 N 2 Na 2 o ...

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Abstract

The invention discloses a method for electroless copper plating on the surface of diamond particles sensitized and activated by metal coating. Firstly, a tungsten coating is applied on the surface of diamond particles by means of tungsten plating in a salt bath to obtain diamond particles coated with tungsten on the surface; It is added to the electroless copper plating solution to electrolessly copper-plate the surface of the tungsten coating; after cleaning and drying, the copper-plated diamond particles are obtained. The method of the invention omits the process of noble metal sensitization and activation in the traditional electroless copper plating process, and the obtained copper plating layer is uniform and dense, and has good combination with diamond particles.

Description

technical field [0001] The invention relates to a method for electroless copper plating on the surface of diamond particles sensitized and activated by metal plating, and belongs to the field of metal matrix composite material preparation. Background technique [0002] Diamond is not only the hardest element in nature, but also has excellent thermal conductivity (2200W m -1 ·K -1 ), low thermal expansion coefficient (0.86×10 -6 / ℃) and low density (3.52g·cm -3 ), so it has many important industrial uses, such as fine grinding materials, electronic packaging materials, various drill , Drawing die , It is also used as a part of many precision instruments. However, diamond tool materials are mostly produced by powder metallurgy, and the sintering temperature is relatively high. When the diamond is heated to about 700°C in the air, it will begin to oxidize and lose weight, and the compression resistance will decrease. When the diamond is above 1000°C, it will be partially ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/38C23C18/18
CPCC23C18/1879C23C18/38
Inventor 程继贵卫陈龙魏邦争陈鹏起徐仙
Owner HEFEI UNIV OF TECH
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