Conductive silver paste and preparation method thereof
A technology of conductive silver paste and silver nanometers, which is applied in the direction of conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc., and can solve problems such as low conductivity, low silver content, and low film density. problem, to achieve the effect of high conductivity, low silver content and high adhesion
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Embodiment 1
[0019] Embodiment 1: Conductive silver paste, is made up of metal powder (tin powder), organic phase carrier, silver nanowire and lead-free glass micropowder, and wherein the fusing point temperature of metal powder (tin powder) is 232 ℃, by mass percentage, Silver nanowire accounts for 69.28%, metal powder (tin powder) accounts for 4.04%, organic phase carrier accounts for 23.65%, and lead-free glass powder accounts for 3.03%; The aspect ratio of silver nanowire is about 40; Metal powder (tin powder) The average particle size is about 8 μm; the particle size of the lead-free glass powder is 5-8 μm, and the softening point is 416 ° C; the organic phase carrier includes a thickener (ethyl cellulose), a plasticizer (hydrogenated castor oil) and an organic solvent ( Butyl carbitol acetate and terpineol) and additives (organosiloxane); in terms of mass percent of the organic phase carrier, thickener (ethyl cellulose) accounts for 4%, plasticizer (hydrogenated castor Sesame oil) ac...
Embodiment 2
[0026] Embodiment 2: conductive silver paste, by metal powder (zinc powder), binary alloy powder (Sn 80 Bi 20 ), organic phase carrier, silver nano wire and lead-free glass powder, wherein the melting point temperature of metal powder (zinc powder) is 419 ℃, in terms of mass percentage, silver nano wire accounts for 72.73%, and metal powder (zinc powder) accounts for 1.05% %, binary alloy powder (Sn 80 Bi 20 ) accounted for 1.95%, organic phase carrier accounted for 20.27%, lead-free glass powder accounted for 4%; the aspect ratio of silver nanowire is about 70; sn 80 Bi 20 ) particle size is about 10μm, binary alloy powder (Sn 80 Bi 20 ) has a melting point of 200°C; the particle size of the lead-free glass powder is 5-8 μm, and the softening point is 416°C; the organic phase carrier includes a thickener (ethyl cellulose), a plasticizer (hydrogenated castor oil) and an organic solvent (butyl carbitol and terpineol) and additives (organosiloxane); based on the mass perc...
Embodiment 3
[0032] Embodiment 3: conductive silver paste, by ternary alloy powder (Sn 99 Ag 0.3 Cu 0.7 ), organic phase carrier, silver nano wire and lead-free glass powder, wherein, in terms of mass percentage, silver nano wire accounts for 60.56%, ternary alloy powder (Sn 99 Ag 0.3 Cu 0.7 ) accounted for 4.05%, organic phase carrier accounted for 33.39%, lead-free glass powder accounted for 2%; the aspect ratio of silver nanowire is 70; ternary alloy powder (Sn 99 Ag 0.3 Cu 0.7 ) particle size is 8μm, ternary alloy powder (Sn 99 Ag 0.3 Cu 0.7 ) has a melting point of 217°C; the particle size of the lead-free glass powder is 5-8 μm, and the softening point is 416°C; the organic phase carrier includes a thickener (ethyl cellulose), a plasticizer (hydrogenated castor oil) and an organic solvent (butyl carbitol and terpineol) and auxiliary agent (organosiloxane); in terms of mass percentage of organic phase carrier, thickener (ethyl cellulose accounts for 4%, unsaturated polyester ...
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