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Conductive silver paste and preparation method thereof

A technology of conductive silver paste and silver nanometers, which is applied in the direction of conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc., and can solve problems such as low conductivity, low silver content, and low film density. problem, to achieve the effect of high conductivity, low silver content and high adhesion

Active Publication Date: 2019-11-01
YUNNAN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Aiming at the silver paste prepared by spherical or quasi-spherical silver powder in the prior art, the printed silver film has high sintering shrinkage rate and low density of the film layer, resulting in low electrical conductivity. A conductive silver paste and its preparation method are provided , the present invention adopts silver nanowires and medium-low melting point metals or alloys (melting point at 90-520° C.) as the conductive phase, so that the conductive silver paste has high conductivity, high printing resolution, and low silver content

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Embodiment 1

[0019] Embodiment 1: Conductive silver paste, is made up of metal powder (tin powder), organic phase carrier, silver nanowire and lead-free glass micropowder, and wherein the fusing point temperature of metal powder (tin powder) is 232 ℃, by mass percentage, Silver nanowire accounts for 69.28%, metal powder (tin powder) accounts for 4.04%, organic phase carrier accounts for 23.65%, and lead-free glass powder accounts for 3.03%; The aspect ratio of silver nanowire is about 40; Metal powder (tin powder) The average particle size is about 8 μm; the particle size of the lead-free glass powder is 5-8 μm, and the softening point is 416 ° C; the organic phase carrier includes a thickener (ethyl cellulose), a plasticizer (hydrogenated castor oil) and an organic solvent ( Butyl carbitol acetate and terpineol) and additives (organosiloxane); in terms of mass percent of the organic phase carrier, thickener (ethyl cellulose) accounts for 4%, plasticizer (hydrogenated castor Sesame oil) ac...

Embodiment 2

[0026] Embodiment 2: conductive silver paste, by metal powder (zinc powder), binary alloy powder (Sn 80 Bi 20 ), organic phase carrier, silver nano wire and lead-free glass powder, wherein the melting point temperature of metal powder (zinc powder) is 419 ℃, in terms of mass percentage, silver nano wire accounts for 72.73%, and metal powder (zinc powder) accounts for 1.05% %, binary alloy powder (Sn 80 Bi 20 ) accounted for 1.95%, organic phase carrier accounted for 20.27%, lead-free glass powder accounted for 4%; the aspect ratio of silver nanowire is about 70; sn 80 Bi 20 ) particle size is about 10μm, binary alloy powder (Sn 80 Bi 20 ) has a melting point of 200°C; the particle size of the lead-free glass powder is 5-8 μm, and the softening point is 416°C; the organic phase carrier includes a thickener (ethyl cellulose), a plasticizer (hydrogenated castor oil) and an organic solvent (butyl carbitol and terpineol) and additives (organosiloxane); based on the mass perc...

Embodiment 3

[0032] Embodiment 3: conductive silver paste, by ternary alloy powder (Sn 99 Ag 0.3 Cu 0.7 ), organic phase carrier, silver nano wire and lead-free glass powder, wherein, in terms of mass percentage, silver nano wire accounts for 60.56%, ternary alloy powder (Sn 99 Ag 0.3 Cu 0.7 ) accounted for 4.05%, organic phase carrier accounted for 33.39%, lead-free glass powder accounted for 2%; the aspect ratio of silver nanowire is 70; ternary alloy powder (Sn 99 Ag 0.3 Cu 0.7 ) particle size is 8μm, ternary alloy powder (Sn 99 Ag 0.3 Cu 0.7 ) has a melting point of 217°C; the particle size of the lead-free glass powder is 5-8 μm, and the softening point is 416°C; the organic phase carrier includes a thickener (ethyl cellulose), a plasticizer (hydrogenated castor oil) and an organic solvent (butyl carbitol and terpineol) and auxiliary agent (organosiloxane); in terms of mass percentage of organic phase carrier, thickener (ethyl cellulose accounts for 4%, unsaturated polyester ...

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Abstract

The invention discloses a conductive silver paste and a preparation method thereof and belongs to the technical field of the conductive silver paste. The conductive silver paste is composed of metal powder and / or alloy powder, organic phase carrier, silver nanowires and lead-free glass micropowder, wherein the metal powder and / or alloy powder has the melting point temperature of 90-520 DEG C, by mass percentage, the silver nanowires account for 56-80%, the metal powder and / or alloy powder accounts for 1-12%, the organic phase carrier accounts for 10-34%, and the lead-free glass powder accountsfor 1-8%. The conductive silver paste is advantaged in that the silver nanowires and the medium-low melting point metal or alloy (the melting point is in a range of 90-520 DEG C) are utilized as theconductive phase, and the conductive silver paste has high conductivity, high printing resolution and low silver content.

Description

technical field [0001] The invention relates to a conductive silver paste and a preparation method thereof, belonging to the technical field of conductive silver paste. Background technique [0002] The existing high-temperature conductive silver paste is generally made into a fluid paste by silver powder, inorganic binder, organic phase carrier and the like. In the prior art, the high-conductivity silver paste and its preparation method, the metal silver powder is a mixture of micron flaky silver powder, submicron spherical silver powder and nanometer silver powder. The silver electrode paste comprises 25-75% of spherical silver powder, 0-35% of flake silver powder, 2-18% of glass powder and 15-48% of organic phase carrier. Since the contact of spherical silver powder particles is point contact, it is easy to shrink during sintering, and has a large shrinkage rate after sintering. Nano silver powder also has the disadvantages of large sintering shrinkage and sintering stre...

Claims

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Application Information

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IPC IPC(8): H01B1/16H01B1/22H01B13/00
CPCH01B1/16H01B1/22H01B13/00
Inventor 韦群燕林志国黄章杰
Owner YUNNAN UNIV