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High-conductivity flame-retardant epoxy resin composition

An epoxy resin and flame-retardant technology, which is applied in the field of epoxy resin composition, can solve problems such as difficult to meet the environmental protection requirements of halogen-free flame retardant, poor dispersion, incompatibility, etc., to improve electrical conductivity and flame retardancy , The effect of simple preparation process

Inactive Publication Date: 2019-11-05
SUZHOU YUXI NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when used as conductive materials, these materials are difficult to meet the environmental protection requirements of halogen-free flame retardant, so it is generally necessary to add a large amount of inorganic flame retardants such as aluminum hydroxide and magnesium hydroxide
In addition, inorganic conductive fillers, inorganic flame retardants and epoxy resins have disadvantages such as incompatibility and poor dispersion.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] (1) Preparation of component A

[0030] Put 60 parts of bisphenol A type epoxy resin, 20 parts of butyl glycidyl ether, and 15 parts of phenolic resin with a softening point of 91°C into the reaction kettle, heat up to 80°C, stir at a stirring speed of 200r / min for 2h, pump After 5 minutes of vacuum, stop stirring, and put the resin into packaging barrel 1 after cooling;

[0031] (2) Preparation of component B

[0032] Put 5 parts of triethylenetetramine and 30 parts of amino-terminated phenylacetylene phosphonate into the reaction kettle, raise the temperature to 30°C, stir at a stirring speed of 200r / min for 0.5h, stop stirring after vacuuming for 5min, cool to room temperature and load into the second packaging barrel;

[0033] (3) Mix the two components A and B at a weight ratio of 100:28, stir at room temperature for 5 minutes, and mix evenly. The evenly mixed resin can be cured and molded at room temperature according to the mold used, and then cured at 80°C for...

Embodiment 2

[0035] (1) Preparation of component A

[0036] Put 75 parts of bisphenol F epoxy resin, 30 parts of aryl glycidyl ether, and 25 parts of phenolic resin with a softening point of 96°C into the reaction kettle, heat to 95°C, stir at a stirring speed of 400r / min for 8h, pump After 60 minutes of vacuum, stop stirring, and put the resin into packaging barrel 1 after cooling;

[0037] (2) Preparation of component B

[0038] 4 parts of triethylenetetramine, 6 parts of tetraethylenepentamine, and 20 parts of amino-terminated phenylacetylene phosphonate were put into the reaction kettle, heated to 65°C, stirred at a stirring speed of 400r / min for 2 hours, and stopped stirring after evacuating for 20 minutes. , after cooling to room temperature, put it into the second packaging drum;

[0039] (3) Stir the two components A and B at room temperature for 20 minutes at a weight ratio of 100:33, and mix evenly. The evenly mixed resin can be cured at room temperature according to the mold u...

Embodiment 3

[0041] (1) Preparation of component A

[0042] Put 65 parts of bisphenol A epoxy resin, 24 parts of butyl glycidyl ether, and 20 parts of phenolic resin with a softening point of 94°C into the reaction kettle, heat to 90°C, stir for 4 hours at a stirring speed of 240r / min, and pump After 30 minutes of vacuum, stop stirring, and put the resin into packaging barrel 1 after cooling;

[0043] (2) Preparation of component B

[0044] Put 8 parts of tetraethylenepentamine and 15 parts of amino-terminated phenylacetylene phosphonate into the reaction kettle, heat up to 60°C, stir at a stirring speed of 240r / min for 0.5-2h, stop stirring after vacuumizing for 10min, and cool to room temperature Put it into the second packaging barrel;

[0045] (3) Mix the two components A and B at a weight ratio of 100:30, stir at room temperature for 10 minutes, and mix evenly. The evenly mixed resin can be cured and molded at room temperature according to the mold used, and then cured at 80°C for 6...

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Abstract

The invention relates to a high-conductivity flame-retardant epoxy resin composition. Epoxy resin comprises a component A and a component B, wherein the component A comprises 60-75 parts of epoxy resin, 20-30 parts of an active diluent and 15-25 parts of phenolic resin, and the component B comprises 5-10 parts of fatty amine and 15-30 parts of amino-terminated phenylacetylene phosphonic acid ester. According to the technical scheme, the amino-terminated phenylacetylene phosphonate and epoxy resin composition has good compatibility, and a prepared finished product has high conductivity and flame retardancy. In addition, the epoxy resin composition is simple in preparation process and suitable for large-scale application and popularization.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to a high-conductivity flame-resistant epoxy resin composition. Background technique [0002] Epoxy resin materials have good corrosion resistance, bonding performance, and low shrinkage. Compared with metal materials, they have the advantages of light weight and high strength. However, due to the chemical structure of epoxy resin itself, its impact toughness, electrical conductivity and flame retardancy are poor. [0003] Generally, polymer composite conductive compositions are various composite materials formed by adding inorganic conductive fillers, such as carbon black, graphite powder, metal powder, carbon fiber, etc., to polymer materials, such as conductive adhesives, conductive rubbers, conductive plastics, Conductive coatings, etc., to meet different application requirements. [0004] However, when used as conductive materials, it is difficult for these materials to meet the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L61/06C08G59/50
CPCC08G59/508C08L63/00C08L2201/02C08L2205/06C08L61/06
Inventor 张宇
Owner SUZHOU YUXI NEW MATERIAL TECH
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