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A Dielectric Ring Field-Effect Transistor with Asymmetric Channel

A technology of field effect transistors and dielectric rings, which is applied in the manufacture of transistors, semiconductor devices, semiconductor/solid-state devices, etc., can solve the problems of serious drain leakage current and damage, reduce static power consumption, reduce static power consumption, and improve The effect of the device switching ratio

Active Publication Date: 2020-11-20
EAST CHINA NORMAL UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the serious problem of gate-induced-drain leakage current of the existing traditional gate-around transistors, in order to reduce the off-state current of the device and reduce static power consumption, a new type of asymmetrical channel dielectric ring is proposed. Field-effect transistors, on the premise that the dynamic performance of the gate-around device is not damaged, reduce the GIDL current of the device and increase the current switching ratio of the device, thereby improving the performance of the integrated circuit

Method used

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  • A Dielectric Ring Field-Effect Transistor with Asymmetric Channel
  • A Dielectric Ring Field-Effect Transistor with Asymmetric Channel
  • A Dielectric Ring Field-Effect Transistor with Asymmetric Channel

Examples

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Embodiment

[0034] See attached Figure 7 , the production process of this embodiment:

[0035] In (a) in the figure, the silicon nanowire channel 1 is prepared by an epitaxial process;

[0036] In (b) in the figure, the end of the nanowire channel 1 close to the drain extension region is photoetched using multiple mask technology or extreme ultraviolet exposure technology, and reactive ion etching is used to remove the nanowire channel 1 exposed by the photoresist ;

[0037] In (c) in the figure, silicon dioxide insulating dielectric ring 3 is grown by atomic layer deposition technology, photolithography and reactive ion etching are performed;

[0038] In (d) in the figure, the gate oxide layer 2 stacked by silicon dioxide and hafnium dioxide is grown by atomic layer deposition technology, photolithography and reactive ion etching are performed;

[0039] In (e) in the figure, the aluminum metal gate electrode 9 is formed by physical vapor deposition deposition, multiple mask technolog...

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Abstract

The invention discloses an asymmetric channel dielectric ring field effect transistor. The transistor comprises a source electrode, a drain electrode, a source electrode extension region, a drain electrode extension region, a channel, a grid electrode, a substrate, an insulating isolation layer in the substrate, and an insulating dielectric ring arranged at the periphery of a nanowire channel close to the drain electrode extension region. Due to the fact that the dielectric constant and the forbidden band width of the insulating medium ring structure are large, the tunneling probability of carriers at the drain end is reduced, the gate-induced drain leakage current is effectively reduced, and the on-state current is hardly affected. And the structure is embedded in the gate oxide layer, sothat the gate-all capacitance is not increased, and the dynamic characteristics are not influenced. Therefore, on the premise that the dynamic performance of a gate-all-around device is not damaged,the GIDL electric leakage of the device is reduced, and the current switching ratio of the device is improved, so that the performance of an integrated circuit is improved.

Description

technical field [0001] The invention belongs to digital logic and storage devices in CMOS very large integrated circuits (VLSI), and in particular relates to an asymmetric channel dielectric ring field effect transistor, which can effectively reduce the gate-induced drain leakage current of semiconductor devices. Background technique [0002] According to Moore's Law, the performance of integrated circuits with the same chip area will double every 18 months. Therefore, with the reduction of device size, the gate-all-around field-effect transistor (GAA MOSFET), with its excellent gate control ability, can effectively reduce the short-channel effect, but at the same time it causes serious gate-induced-drain leakage current. Gate Induced Drain Leakage (GIDL for short), in a gate-around transistor, when the device is turned off, that is, the voltage on the gate is at 0 V and a small bias near 0 V and the drain and positive Connected to the voltage drop, the overlap between the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/786H01L29/06H01L29/423H01L21/336
CPCH01L29/0653H01L29/42356H01L29/66742H01L29/78645
Inventor 唐雅欣田明王昌锋廖端泉曹永峰孙亚宾李小进石艳玲
Owner EAST CHINA NORMAL UNIV
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