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High-thermal-conductive epoxy resin composition and preparation method thereof

A technology of epoxy resin and phenolic epoxy resin, which is applied in the field of high thermal conductivity epoxy resin composition and preparation, can solve the problems of complicated preparation process, high difficulty and high cost, and achieves simple preparation process, low production cost and high component cost. uncomplicated effects

Active Publication Date: 2019-11-08
JIANGXI PINSHENG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiments of the present invention provide a high thermal conductivity epoxy resin composition, which solves the problems of cumbersome, difficult and costly preparation of bulk thermally conductive and insulating polymer materials in the prior art

Method used

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  • High-thermal-conductive epoxy resin composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] This example provides a high thermal conductivity epoxy resin composition, including the following components in parts by weight:

[0048] 20 parts of epoxy resin, 5 parts of curing agent, 65 parts of filler, 20 parts of flame retardant, and 15 parts of solvent.

[0049] Wherein, the epoxy resin is a mixture of bisphenol A epoxy resin and bisphenol F epoxy resin in a mass ratio of 1:1.

[0050] The bisphenol A epoxy resin is GelR28E (Hongchang Electronic Materials Co., Ltd., epoxy equivalent: 185g / eq), and the bisphenol F epoxy resin is FX7900 (Hunan Jiashengde, epoxy equivalent: 200g / eq).

[0051] The curing agent is 4,4-diaminodiphenyl sulfone.

[0052] The filler is a mixture of alumina and boria in a mass ratio of 1:1.

[0053]The flame retardant is a mixture of aluminum hydroxide and silicon dioxide in a mass ratio of 1:1.

[0054] The solvent is acetone.

Embodiment 2

[0056] This example provides a high thermal conductivity epoxy resin composition, including the following components in parts by weight:

[0057] 20 parts of epoxy resin, 8 parts of curing agent, 65 parts of filler, 20 parts of flame retardant, and 15 parts of solvent.

[0058] Wherein, the epoxy resin is a mixture of bisphenol A epoxy resin, bisphenol F epoxy resin, biphenyl type epoxy resin and naphthalene ring type epoxy resin.

[0059] Bisphenol A epoxy resin is GelR28E (Hongchang Electronic Materials Co., Ltd., epoxy equivalent: 185g / eq), bisphenol F epoxy resin is FX7900 (Hunan Jiashengde, epoxy equivalent: 200g / eq), biphenyl The type epoxy resin is NC-3000 (Nippon Kayaku, epoxy equivalent: 280g / eq), and the naphthalene ring type epoxy resin is NPTE4000 (Hunan Jiashengde, epoxy equivalent: 225g / eq).

[0060] The curing agent is dicyandiamide.

[0061] The filler is a mixture of alumina and boria in a mass ratio of 1:1.

[0062] The flame retardant is a mixture of alum...

Embodiment 3

[0065] This example provides a high thermal conductivity epoxy resin composition, including the following components in parts by weight:

[0066] 20 parts of epoxy resin, 8 parts of curing agent, 65 parts of filler, 20 parts of flame retardant, and 15 parts of solvent.

[0067] Among them, the epoxy resin is bisphenol A epoxy resin, bisphenol F epoxy resin, biphenyl type epoxy resin, naphthalene ring type epoxy resin and novolac epoxy resin in a mass ratio of 2:0.5:0.5:0.5: A mix of 2.5.

[0068] Bisphenol A epoxy resin is GelR28E (Hongchang Electronic Materials Co., Ltd., epoxy equivalent: 185g / eq), bisphenol F epoxy resin is FX7900 (Hunan Jiashengde, epoxy equivalent: 200g / eq), biphenyl Type epoxy resin is NC-3000 (Nippon Kayaku, epoxy equivalent: 280g / eq), naphthalene ring type epoxy resin is NPTE4000 (Hunan Jiashengde, epoxy equivalent: 225g / eq), novolac epoxy resin is SQCN702 produced by Shandong Shengquan Chemical Co., Ltd.

[0069] The curing agent is a 1:1 compositi...

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Abstract

The embodiment of the invention provides a high-thermal-conductive epoxy resin composition and a preparation method thereof. According to the high-thermal-conductive epoxy resin composition provided by the embodiment of the invention, through epoxy resin, a filler, a fire retardant and a solvent in appropriate proportion, the epoxy resin composition with the thermal conductivity coefficient beinglarger than 1.5 W / mk and the CTI being up to 600 is prepared, the composition is not complex in component, simple in preparation process, not harsh in preparation condition and low in production cost,and the problems that in the prior art, a body-type thermally conductive and insulating polymer material is cumbersome in preparation process, large in difficulty and high in cost are solved.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board preparation, and in particular relates to a high thermal conductivity epoxy resin composition and a preparation method. Background technique [0002] Printed Circuit Board (PCB for short) is a carrier for carrying electronic components and realizing electrical signal transmission, and plays an indispensable role in electronic products. High molecular polymer is one of the most important dielectric materials in PCB. The most basic substrate of PCB—copper clad laminate is to coat (or impregnate) glass fiber cloth with high molecular polymer and then heat press it with copper foil. production. Polymer materials commonly used in PCBs include phenolic resins, epoxy resins, cyanate esters, polyimides, polytetrafluoroethylene, bismaleimide triazine resins, and polyphenylene ether resins. Polymers have their own advantages and characteristics. With the rapid development of microelectronic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/04C08K3/013C08K3/22C08K3/38C08K3/36
CPCC08L63/00C08L2205/025C08L2205/035C08L2205/02C08K2201/014C08K2003/2227C08K2201/003C08L63/04C08K3/00C08K3/22C08K3/38C08K3/36
Inventor 黄帅民李国法
Owner JIANGXI PINSHENG ELECTRONICS CO LTD
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