Process for processing waste circuit boards to prepare copper alloy powder by mechanical physical method

A technology of waste circuit boards and copper alloys, which is applied in the field of electronic waste resource recycling, can solve the problems of large environmental pollution, high energy consumption, and long metallurgical recycling process, and achieve the goal of short process, low energy consumption, and realization of recycling Effect

Active Publication Date: 2019-11-12
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The purpose of the present invention is to provide a mechanical physical method that avoids short metallurgical process, low energy consumption and less pollution, aiming at the shortcomings of the existing metallurgical recove

Method used

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  • Process for processing waste circuit boards to prepare copper alloy powder by mechanical physical method

Examples

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Example Embodiment

[0030] Example 1

[0031] This embodiment provides a process for preparing copper alloy powder by processing waste circuit boards by mechanical and physical methods, including the following steps:

[0032] (1) Crush 100 kg of waste circuit boards to less than 5 mm, and use airflow sorting to achieve the initial separation of metals and non-metals to obtain iron-containing metal-rich aggregates, with iron content of 16.9 wt.%;

[0033] (2) Magnetically separate the ferrous metal-rich group obtained in step (1) to obtain non-ferrous metal-rich group and ferromagnetic metal-rich group respectively;

[0034] (3) Use a hammer crusher to further pulverize the non-ferrous metal rich mass obtained in step (2) to less than 0.5 mm, and sieve with a screen to obtain coarse particle materials greater than 200 mesh;

[0035] (4) The coarse particle materials larger than 200 meshes obtained in step (3) are separated by hydraulic shaker to remove most of the non-metals and increase the metal content i...

Example Embodiment

[0039] Example 2

[0040] This embodiment provides a process for preparing copper alloy powder by processing waste circuit boards by mechanical and physical methods, including the following steps:

[0041] (1) Crush 100 kg of waste circuit boards to less than 5 mm, and use airflow sorting to achieve the initial separation of metals and non-metals to obtain iron-containing metal-rich aggregates, with iron content of 16.9 wt.%;

[0042] (2) Magnetically separate the ferrous metal-rich group obtained in step (1) to obtain non-ferrous metal-rich group and ferromagnetic metal-rich group respectively;

[0043] (3) Use a hammer crusher to further pulverize the non-ferrous metal rich mass obtained in step (2) to less than 0.5 mm, and sieve with a screen to obtain coarse particle materials greater than 200 mesh;

[0044] (4) The coarse particle materials larger than 200 meshes obtained in step (3) are separated by hydraulic shaker to remove most of the non-metals and increase the metal content i...

Example Embodiment

[0048] Example 3

[0049] This embodiment provides a process for preparing copper alloy powder by processing waste circuit boards by mechanical and physical methods, including the following steps:

[0050] (1) Crush 100 kg of waste circuit boards to less than 5 mm, and use airflow sorting to achieve the initial separation of metals and non-metals to obtain iron-containing metal-rich aggregates, with iron content of 16.9 wt.%;

[0051] (2) Magnetically separate the ferrous metal-rich group obtained in step (1) to obtain non-ferrous metal-rich group and ferromagnetic metal-rich group respectively;

[0052] (3) Use a hammer crusher to further pulverize the non-ferrous metal rich mass obtained in step (2) to less than 0.5 mm, and sieve with a screen to obtain coarse particle materials greater than 200 mesh;

[0053] (4) The coarse particle materials larger than 200 meshes obtained in step (3) are separated by hydraulic shaker to remove most of the non-metals and increase the metal content i...

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Abstract

The invention discloses a process for processing waste circuit boards to prepare copper alloy powder by a mechanical physical method. The process comprises the steps of waste circuit board crushing pretreatment, airflow separation, magnetic separation iron removal, mechanical pulverization, screening, shaking table sorting, ball-milling impurity removing, ball-milling refining, powder purificationtreatment and other procedures, and the copper alloy powder is finally obtained. The process has the following advantages that the obtained copper alloy powder mainly contains Cu, Sn, Pb and Fe, theingredient and content of the obtained copper alloy powder is within the range required by a copper base friction material, the obtained copper alloy powder can be directly applied to prepare the copper base friction material, a small amount of tailings generated in the whole process is easy to process, and full recovery of metal can be realized; and compared with other methods capable of realizing cyclic regeneration of valuable metals in the waste circuit boards, the process adopts the mechanical physical method without a metallurgical process, direct materialization of waste metallic coppercan be realized, and the process is simple, low in production cost and energy consumption and less in pollution.

Description

technical field [0001] The invention relates to the technical field of resource recycling of electronic waste, in particular to a process for preparing copper alloy powder by treating waste circuit boards with mechanical and physical methods. Background technique [0002] With the rapid development of the electronic information industry, the performance requirements of electronic products are constantly improving. Circuit boards are the core components of electronic products. Because of the replacement of electronic products and the leftovers generated in the production of circuit boards, there will be a large amount of waste every year. Circuit boards are produced, and while these electronic wastes occupy social resources, they also cause great harm to the surrounding ecological environment. [0003] The composition of the circuit board is complex and can be simply divided into two parts: metal and non-metal. The content in different circuit boards is different, mostly bet...

Claims

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Application Information

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IPC IPC(8): B09B3/00B03B9/00C22B7/00C22B15/00
CPCB09B3/00B03B9/00C22B7/005C22B15/00Y02P10/20Y02W30/82
Inventor 陈维平王发展刘方方朱德智康志新
Owner SOUTH CHINA UNIV OF TECH
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