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Flexible sensing module for human body inductance dynamic monitoring and manufacturing process and application thereof

A technology for sensing modules and dynamic monitoring, applied in the field of sensing modules, can solve problems such as unfavorable installation and use of complex electronic equipment, poor bonding force between conductive materials and their substrates, and unstable product performance, and achieve controllable functions. , Improve the accuracy and stability, the effect of good bonding strength

Active Publication Date: 2019-11-19
赵为芳 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] (1) To overcome the problem that the conductive material of the flexible sensing module used for dynamic monitoring of human body inductance is not well bonded to its substrate, and the product performance is unstable;
[0014] (2) To overcome the problems of low tensile strength and high thermal shrinkage rate of the existing flexible sensing modules used for dynamic monitoring of human body inductance, which are not conducive to installation and use in complex electronic devices

Method used

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  • Flexible sensing module for human body inductance dynamic monitoring and manufacturing process and application thereof
  • Flexible sensing module for human body inductance dynamic monitoring and manufacturing process and application thereof
  • Flexible sensing module for human body inductance dynamic monitoring and manufacturing process and application thereof

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Embodiment 1

[0051] A flexible sensing module for dynamic monitoring of human body inductance and its manufacturing process. The flexible sensing module for dynamic monitoring of human body inductance is made of the following raw materials in weight percentage: 10% nano-platinum powder, 50% Fiber-grade PET chips, 8% nano-graphene, 8% epoxy resin, 2% epoxy resin reactive diluent, 2% high-efficiency dispersant and stabilizer, 10% deionized water, 10% Far-infrared fiber cloth base material.

[0052] The high-efficiency dispersant: the weight ratio of the stabilizer is 5:2.

[0053] The high-efficiency dispersant is dimethyl ethanolamine acrylate.

[0054] The stabilizer is triphenyl phosphate.

[0055] The epoxy resin is bisphenol A type epoxy resin.

[0056] The epoxy resin reactive diluent is 1,6-hexanediol diglycidyl ether.

[0057] The manufacturing process of the flexible sensing module used for dynamic monitoring of human body inductance includes:

[0058] (1) Dispersion step of fi...

Embodiment 2

[0074] A flexible sensing module for dynamic monitoring of human body inductance and its manufacturing process. The flexible sensing module for dynamic monitoring of human body inductance is made of the following raw materials in weight percentage: 20% nano-platinum powder, 40% Fiber-grade PET chips, 8% nano-graphene, 8% epoxy resin, 2% epoxy resin reactive diluent, 2% high-efficiency dispersant and stabilizer, 10% deionized water, 10% Far-infrared fiber cloth base material.

[0075] The high-efficiency dispersant: the weight ratio of the stabilizer is 5:2.

[0076] The high-efficiency dispersant is isopropanol.

[0077] The stabilizer is triphenyl phosphate.

[0078] The epoxy resin is bisphenol A type epoxy resin.

[0079] The epoxy resin reactive diluent is 1,6-hexanediol diglycidyl ether.

[0080] The manufacturing process of the flexible sensing module used for dynamic monitoring of human body inductance includes:

[0081] (1) Dispersion step of fiber-grade PET slice...

Embodiment 3

[0097]A flexible sensing module for dynamic monitoring of human body inductance and its manufacturing process. The flexible sensing module for dynamic monitoring of human body inductance is made of the following raw materials in weight percentage: 15% nano-platinum powder, 45% Fiber-grade PET chips, 10% nano-graphene, 10% epoxy resin, 3% epoxy resin reactive diluent, 3% high-efficiency dispersant and stabilizer, 6% deionized water, 8% Far-infrared fiber cloth base material.

[0098] The high-efficiency dispersant: the weight ratio of the stabilizer is 5:2.

[0099] The high-efficiency dispersant is dimethyl ethanolamine acrylate.

[0100] The stabilizer is triphenyl phosphate.

[0101] The epoxy resin is bisphenol A type epoxy resin.

[0102] The epoxy resin reactive diluent is 1,6-hexanediol diglycidyl ether.

[0103] The manufacturing process of the flexible sensing module used for dynamic monitoring of human body inductance includes:

[0104] (1) Dispersion step of fib...

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Abstract

The invention provides a flexible sensing module for human body inductance dynamic monitoring.The raw materials of the flexible sensing module include nano platinum powder, fiber-grade PET slices, nano graphene, a far-infrared fiber cloth substrate and the like.The invention also provides a preparation method of the flexible sensing module for human body inductance dynamic monitoring.The method includes the steps of PET slice dispersion, preparation of an electrostatic spinning material, electrostatic spinning, and far-infrared sizing.The invention also provides application of the flexible sensing module in a human body inductance dynamic monitoring device.The flexible sensing module has the beneficial effects that the conductive material of the flexible sensing module has good bonding strength with the substrate, and the flexible sensing module is excellent and stable in performance and controllable in function; the thermal shrinkage is low, and the tensile strength is high; the conductivity is high, the ionic conductivity is good, and the detection sensitivity is high; the accuracy and stability of the human body inductance dynamic monitoring device applying the flexible sensingmodule can be significantly improved.

Description

technical field [0001] The invention relates to the field of sensing modules, in particular to a flexible sensing module for dynamic monitoring of human body inductance, a manufacturing process and an application thereof. Background technique [0002] Flexible sensors refer to sensors made of flexible materials, which have good flexibility, ductility, and can even be bent or folded freely, and have flexible and diverse structures. Accurate and fast measurement with special signals, so flexible sensing technology plays an important role in artificial intelligence, health medical devices and wearable electronics. The hard and brittle nature of ordinary sensors makes it difficult for electronic devices to bend or extend. Once there is a large deformation, the electronic devices will be damaged and the measurement range will be greatly affected. As the application requirements of the information age are getting higher and higher, the requirements for various performance paramet...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): D04H1/728D04H1/55D01D5/00D01F1/09A61B5/11
CPCA61B5/1118D01D5/003D01D5/0069D01D5/0084D01D5/0092D01F1/09D04H1/55D04H1/728
Inventor 赵为芳
Owner 赵为芳
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